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AM6254ATCGGAALW

Texas Instruments

AM6254ATCGGAALW by Texas Instruments

AM6254ATCGGAALW by Texas Instruments is a SoC peripheral IC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring high-speed processing and low power consumption.

Median Price

$22.992

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 125,080 parts In-Stock

1+ parts

$20.453

100+ parts

$17.865

1k+ parts

$12.321

10k+ parts

-

125,080

$20.453

$17.865

$12.321

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DigiKey

USA . 1,439 parts In-Stock

1+ parts

$25.530

100+ parts

$19.281

1k+ parts

$16.775

10k+ parts

-

1,439

$25.530

$19.281

$16.775

-

Mouser Electronics

USA . 156 parts In-Stock

1+ parts

$25.530

100+ parts

$19.290

1k+ parts

$16.880

10k+ parts

-

156

$25.530

$19.290

$16.880

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Chip1Stop

Japan . 119 parts In-Stock

1+ parts

-

100+ parts

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$18.440

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119

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-

$18.440

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,218 parts In-Stock

1+ parts

$19.430

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-

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2,218

$19.430

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Nova Conductors

Japan . 79 parts In-Stock

1+ parts

$20.400

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79

$20.400

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-

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Vyrian

USA . 31,238 parts In-Stock

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31,238

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VNN

France . 4,868 parts In-Stock

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4,868

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Sensible Micro Corp

USA . 110 parts In-Stock

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110

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 31,619 parts In-Stock

1+ parts

$15.670

100+ parts

-

1k+ parts

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10k+ parts

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31,619

$15.670

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Semicontronic

India . 31,395 parts In-Stock

1+ parts

$15.670

100+ parts

$15.278

1k+ parts

$15.200

10k+ parts

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31,395

$15.670

$15.278

$15.200

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Corohmni

South Africa . 217 parts In-Stock

1+ parts

$17.313

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217

$17.313

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Corphita

USA . 794 parts In-Stock

1+ parts

$18.408

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794

$18.408

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Continental Prestige Electronics

USA . 3,961 parts In-Stock

1+ parts

$18.703

100+ parts

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1k+ parts

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10k+ parts

$18.329

3,961

$18.703

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-

$18.329

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$20.400

100+ parts

$19.380

1k+ parts

-

10k+ parts

$18.156

10

$20.400

$19.380

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$18.156

Argo Parts USA

USA . 404 parts In-Stock

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404

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Overview

Experience unparalleled quality and reliability with the AM6254ATCGGAALW by Texas Instruments, a cutting-edge peripheral IC that sets new standards in performance. Designed with precision and innovation, this product offers endless possibilities in various applications, from automotive to industrial control systems. With advanced technology and a sleek design, this SoC delivers exceptional value and benefits to customers, ensuring seamless operation and optimal efficiency. Trust in Texas Instruments for top-of-the-line solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuits inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology makes it easier to integrate the product onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 0.79 V

With a relatively low maximum supply voltage, this product is suitable for low-power applications, helping to conserve energy.

Package Shape: SQUARE

The square shape allows for efficient use of space on circuit boards, making it easier to integrate into compact electronic devices.

No. of Terminals: 425

The high number of terminals allows for connectivity with a wide range of other components, enabling versatile functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers a compact footprint and high terminal density, making it ideal for applications where space is limited.

Minimum Supply Voltage: 0.715 V

The low minimum supply voltage ensures compatibility with a range of power sources and helps to optimize power efficiency.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows for reliable performance in a variety of environmental conditions, increasing the product's versatility.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality even in cold environments, making the product suitable for a wide range of applications.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier integration and connection to other components, improving the overall efficiency of the product.

Maximum Seated Height: 0.89 mm

The low seated height contributes to a slim profile, making the product suitable for compact electronic devices where space is at a premium.

Width: 13 mm

The compact width of the product allows for efficient use of space on circuit boards, enabling easy integration into various electronic devices.

Peak Reflow Temperature °C: 250

The high peak reflow temperature ensures reliability during assembly processes, reducing the risk of damage to the product.

Length: 13 mm

The compact length of the product complements its square shape, further enhancing its suitability for space-constrained applications.

Peripheral IC Type: SoC

The System-on-Chip (SoC) architecture integrates multiple functions into a single IC, reducing the need for external components and simplifying design and manufacturing processes.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and compatibility with a wide range of operating voltages.

Terminal Form: BALL

Ball terminal form is known for reliable connections and efficient heat dissipation, ensuring stable performance of the product.

Nominal Supply Voltage: 0.75 V

The nominal supply voltage falls within the range of the minimum and maximum values, providing a stable operating voltage for the product.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high terminal density and efficient use of space on the package, enabling complex functionality within a compact form factor.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the product can withstand exposure to moderate levels of moisture during storage and assembly processes.

Speed: 1400 rpm

The high speed rating indicates that the product is capable of fast data processing and communication, making it suitable for high-performance applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6254ATCGGAALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

.89 mm

Speed:

1400 rpm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6254ATCGGAALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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