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AM6252ATGGHAALW

Texas Instruments

AM6252ATGGHAALW by Texas Instruments

AM6252ATGGHAALW by Texas Instruments is a Peripheral IC with 425 terminals, operating temperature range of -40 to 105 °C. It features a CMOS technology, 0.75 V nominal voltage, and 0.5 mm terminal pitch. This SoC is ideal for applications requiring a very thin profile and fine pitch package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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VNN

France . 4,383 parts In-Stock

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Digiode

USA . 3,063 parts In-Stock

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Vyrian

USA . 2,324 parts In-Stock

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Nova Conductors

Japan . 23 parts In-Stock

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Ampacity Inc.

Singapore . 1,220 parts In-Stock

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$3.000

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$3.000

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One Stop Electronics

USA . 1,075 parts In-Stock

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$6.000

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AZTECH Wire

Italy . 378 parts In-Stock

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$19.417

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Corohmni

South Africa . 504 parts In-Stock

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$65.854

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Parana Technologies

USA . 1,532 parts In-Stock

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$65.965

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ChromeModa Solutions

Germany . 5,236 parts In-Stock

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$74.118

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$60.777

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IDEA Electronic Components Group

UK . 1,536 parts In-Stock

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$74.118

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$70.412

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$66.706

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Argo Parts USA

USA . 3,923 parts In-Stock

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Corphita

USA . 2,536 parts In-Stock

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Continental Prestige Electronics

USA . 2,436 parts In-Stock

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DigiPath Technology Company

USA . 1,042 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the AM6252ATGGHAALW by Texas Instruments. Crafted with precision and expertise, this innovative IC offers unparalleled performance and reliability in a wide range of applications. From IoT devices to robotics, this versatile product delivers exceptional value and benefits to customers seeking top-tier solutions. Trust Texas Instruments for quality, trust the AM6252ATGGHAALW for unmatched performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring longevity and reliability of the product.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 0.79 V

The maximum supply voltage of 0.79V helps in preventing overloading and damage to the product, ensuring safe operation.

Package Shape: SQUARE

The square package shape is compact and efficient, making it easier to integrate into various electronic devices.

No. of Terminals: 425

With a high number of terminals, this product offers extensive connectivity options, allowing for versatile applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style enables efficient use of space on circuit boards while maintaining high signal integrity, essential for optimal performance.

Minimum Supply Voltage: 0.715 V

The minimum supply voltage of 0.715V ensures that the product operates efficiently even at lower power levels, maximizing energy efficiency.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this product can withstand harsh environmental conditions, expanding its usability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the product functions reliably even in extremely cold environments.

Terminal Position: BOTTOM

Bottom terminal position simplifies the integration of the product into circuit designs and facilitates efficient heat dissipation.

Maximum Seated Height: 0.89 mm

The low maximum seated height of 0.89mm allows for a slim profile, making this product suitable for space-constrained applications.

Width: 13 mm

The compact width of 13mm makes this product versatile and adaptable to various form factors, enhancing its compatibility.

Length: 13 mm

The square package with a length of 13mm ensures uniformity and symmetry, facilitating efficient placement on circuit boards.

Peripheral IC Type: SoC

Being a System-on-Chip (SoC) design enables integration of multiple functions into a single chip, reducing complexity and enhancing performance.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliability.

Terminal Form: BALL

The ball terminal form simplifies soldering and improves signal transmission, ensuring robust connections for long-term performance.

Nominal Supply Voltage: 0.75 V

The nominal supply voltage of 0.75V provides optimal operating conditions, balancing performance and efficiency for the product.

Terminal Pitch: 0.5 mm

With a narrow terminal pitch of 0.5mm, this product allows for high-density mounting and precise connections, enhancing overall system design.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6252ATGGHAALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.89 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6252ATGGHAALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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