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AM6251AKGGHHALW

Texas Instruments

AM6251AKGGHHALW by Texas Instruments

AM6251AKGGHHALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w 0-95°C, with supply voltage ranging from 0.715-0.79V. This IC is ideal for applications requiring a very thin profile and fine pitch grid array package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,861 parts In-Stock

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Digiode

USA . 1,851 parts In-Stock

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VNN

France . 785 parts In-Stock

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Nova Conductors

Japan . 76 parts In-Stock

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AZTECH Wire

Italy . 198 parts In-Stock

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$7.419

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Semicontronic

India . 834 parts In-Stock

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$23.000

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$22.425

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$22.310

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834

$23.000

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Ampacity Inc.

Singapore . 570 parts In-Stock

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$29.000

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One Stop Electronics

USA . 787 parts In-Stock

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$35.000

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Parana Technologies

USA . 769 parts In-Stock

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$51.862

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DigiPath Technology Company

USA . 220 parts In-Stock

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$57.107

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ChromeModa Solutions

Germany . 5,958 parts In-Stock

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$58.272

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$47.783

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IDEA Electronic Components Group

UK . 1,612 parts In-Stock

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$58.272

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$55.358

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$52.445

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Corohmni

South Africa . 57 parts In-Stock

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Corphita

USA . 3,749 parts In-Stock

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Continental Prestige Electronics

USA . 3,604 parts In-Stock

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Argo Parts USA

USA . 2,947 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the AM6251AKGGHHALW by Texas Instruments. Manufactured to the highest standards, this innovative product belongs to the category of Other Function uPs,uCs & Peripheral ICs, offering unparalleled quality and reliability. Perfect for a wide range of applications, this product boasts a square package shape and 425 terminals, making it ideal for various electronic devices. Experience the value and benefits of this advanced technology, providing customers with superior performance and efficiency. Choose Texas Instruments for exceptional quality and innovation in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and good insulation, making the product reliable for various applications.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 0.79 V

Suitable for low power applications, reducing energy consumption and heat generation.

Package Shape: SQUARE

Optimal shape for efficient use of space on a PCB, maximizing component density.

No. of Terminals: 425

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables high-density mounting and enhances signal integrity for reliable performance.

Minimum Operating Temperature: 0 °C

Allows for operation in a wide range of temperatures, making it suitable for diverse environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency.

Nominal Supply Voltage: 0.75 V

Optimal voltage level for stable and efficient operation of the product.

Terminal Pitch: 0.5 mm

Fine pitch design allows for high-density mounting and improved signal transmission.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6251AKGGHHALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

No. of Terminals:

425

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.89 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6251AKGGHHALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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