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AM6251ASGGHAALW

Texas Instruments

AM6251ASGGHAALW by Texas Instruments

AM6251ASGGHAALW by Texas Instruments is a SoC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring high-density integration and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,344 parts In-Stock

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Digiode

USA . 1,874 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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VNN

France . 120 parts In-Stock

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AZTECH Wire

Italy . 836 parts In-Stock

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$14.709

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One Stop Electronics

USA . 774 parts In-Stock

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$21.000

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Ampacity Inc.

Singapore . 140 parts In-Stock

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Parana Technologies

USA . 2,132 parts In-Stock

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$43.769

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DigiPath Technology Company

USA . 1,580 parts In-Stock

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$48.195

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$44.340

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ChromeModa Solutions

Germany . 5,983 parts In-Stock

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$49.179

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$40.327

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IDEA Electronic Components Group

UK . 1,160 parts In-Stock

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$49.179

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$46.720

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$44.261

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Corohmni

South Africa . 113 parts In-Stock

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Continental Prestige Electronics

USA . 5,848 parts In-Stock

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Corphita

USA . 2,476 parts In-Stock

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Argo Parts USA

USA . 1,840 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the AM6251ASGGHAALW by Texas Instruments. Crafted with precision and expertise, this innovative product belongs to the category of Other Function uPs,uCs & Peripheral ICs, offering unparalleled performance and reliability. Whether you're diving into IoT applications or exploring the realm of smart devices, this product guarantees seamless integration and exceptional functionality. Elevate your projects with the value and benefits that only Texas Instruments can deliver. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the components inside the package, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 0.79 V

A relatively low maximum supply voltage helps in reducing power consumption and heat dissipation, making the product more energy-efficient.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, enabling a compact design for the product.

No. of Terminals: 425

Having a high number of terminals provides increased connectivity options and functionality, making the product versatile in different applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a very thin profile and fine pitch layout ensures high density integration of components, leading to a compact and efficient product design.

Minimum Supply Voltage: 0.715 V

A low minimum supply voltage allows for operation in low power situations, enhancing the product's efficiency and performance in battery-operated devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain reliable performance in a wide range of applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes the product suitable for use in extreme cold environments without compromising performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier assembly and soldering processes, ensuring a secure connection to the circuit board.

Maximum Seated Height: 0.89 mm

A low maximum seated height allows for a slim profile design, saving space in the overall product layout and enabling integration in compact devices.

Width: 13 mm

With a compact width dimension, the product can fit into narrow spaces on the circuit board, enabling efficient use of available space.

Length: 13 mm

The product's length dimension adds to its compact form factor, making it suitable for applications with space constraints.

Peripheral IC Type: SoC

System-on-Chip (SoC) technology integrates multiple functions into a single chip, reducing the need for external components and enhancing the product's overall performance and efficiency.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable in various applications.

Terminal Form: BALL

BGA (Ball Grid Array) terminal form provides a reliable interconnection between the chip and the circuit board, ensuring strong signal integrity and electrical performance.

Nominal Supply Voltage: 0.75 V

Having a consistent nominal supply voltage ensures stable and reliable operation of the product, enhancing its overall performance and longevity.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high-density packaging of components, enabling a compact design and efficient use of space on the circuit board.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6251ASGGHAALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.89 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6251ASGGHAALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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