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XC7Z007S-1CLG400I

Xilinx

XC7Z007S-1CLG400I by Xilinx

The Xilinx XC7Z007S-1CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This low profile chip in a grid array package is ideal for various applications requiring high performance and compact design.

Median Price

$66.880

Lifecycle Status

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Mouser Electronics

USA . 19 parts In-Stock

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$65.250

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DigiKey

USA . 680 parts In-Stock

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$66.880

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Farnell

UK . 113 parts In-Stock

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$70.390

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Digiode

USA . 156 parts In-Stock

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$66.870

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VNN

France . 594 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Touchstone Systems

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Vyrian

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Vigor

Singapore . 250 parts In-Stock

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$57.820

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Ampacity Inc.

Singapore . 279 parts In-Stock

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$59.830

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Semicontronic

India . 209 parts In-Stock

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$58.334

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$58.035

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Continental Prestige Electronics

USA . 120 parts In-Stock

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$61.940

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Corphita

USA . 401 parts In-Stock

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MARBEL Systems

Belgium . 122 parts In-Stock

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$64.151

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$61.585

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Corohmni

South Africa . 334 parts In-Stock

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$68.727

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Texas Native Microelectronics

USA . 247 parts In-Stock

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$73.737

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$70.788

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$68.575

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Netroflash

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Aztec Data Supply Inc.

USA . 2,014 parts In-Stock

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$84.680

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Kenton Components

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$88.484

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Advanced Electronics

New Zealand . 592 parts In-Stock

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Modulus Dynamics

Lithuania . 929 parts In-Stock

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$129.990

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A-Z Elektronik GmbH

Germany . 8,365 parts In-Stock

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Lixinc

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Supply Digital

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Argo Parts USA

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Qasali Group International

UK . 1,759 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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Lucentia Tech

USA . 900 parts In-Stock

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$6.468

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$6.468

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$6.468

Overview

Elevate your projects with the XC7Z007S-1CLG400I by Xilinx, a cutting-edge System on Chip that promises unrivaled performance and reliability. As a leading manufacturer in the industry, Xilinx delivers top-quality products that cater to diverse applications in the field of Other Function uPs, uCs & Peripheral ICs. With a low profile, fine pitch design and advanced CMOS technology, this chip offers seamless integration and maximum efficiency for your projects. Experience the value and benefits of the XC7Z007S-1CLG400I as it takes your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making this product a reliable choice.

Surface Mount: YES

The surface mount option allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.05 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, increasing its versatility.

Package Shape: SQUARE

The square package shape helps with space efficiency, allowing for more components to be placed closely together on a board.

No. of Terminals: 400

The high number of terminals enables connectivity to various other components, expanding the functionality of the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with precise terminal placement, optimizing performance in limited space.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures this product can operate efficiently even with low power sources.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, increasing its durability.

Minimum Operating Temperature: -40 °C

The wide temperature range allows this product to function reliably in various climates and settings.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation process and improves accessibility for connecting to other components.

Maximum Seated Height: 1.6 mm

The low maximum seated height contributes to the compact design of this product, ideal for space-constrained applications.

Width: 17 mm

The moderate width of this product allows for easy integration into different systems without taking up excessive space.

Length: 17 mm

The compact length of this product makes it suitable for applications where size is a crucial factor.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip design integrates multiple functions into a single component, reducing the need for extra peripherals and simplifying system design.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: BALL

The ball terminal form provides a reliable connection and easy soldering method, ensuring a secure and stable electrical connection.

Nominal Supply Voltage: 1 V

The nominal supply voltage ensures compatibility with standard power sources, making this product easy to incorporate into existing systems.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for precise soldering and compact layout, enhancing the efficiency of the product's design.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z007S-1CLG400I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B400

Length:

17 mm

No. of Terminals:

400

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

XC7Z007S-1CLG400I Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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