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AM4372BZDNA80

Texas Instruments

AM4372BZDNA80 by Texas Instruments

AM4372BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.21V to 1.326V. This low profile, fine pitch GRID ARRAY package with 491 terminals is ideal for industrial applications requiring high performance and reliability.

Median Price

$17.250

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,077 parts In-Stock

1+ parts

$11.394

100+ parts

$9.953

1k+ parts

$6.864

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10,077

$11.394

$9.953

$6.864

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DigiKey

USA . 328 parts In-Stock

1+ parts

$17.250

100+ parts

$11.903

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$11.070

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328

$17.250

$11.903

$11.070

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Mouser Electronics

USA . 123 parts In-Stock

1+ parts

$17.250

100+ parts

$11.450

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$10.980

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123

$17.250

$11.450

$10.980

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Distributors (In-Stock)

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Digiode

USA . 4,599 parts In-Stock

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$10.824

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$10.824

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Nova Conductors

Japan . 400 parts In-Stock

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$11.943

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400

$11.943

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Vyrian

USA . 4,056 parts In-Stock

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VNN

France . 2,427 parts In-Stock

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Ashlea Components Ltd

UK . 94 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,158 parts In-Stock

1+ parts

$9.680

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$9.680

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Continental Prestige Electronics

USA . 812 parts In-Stock

1+ parts

$10.042

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$9.841

812

$10.042

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$9.841

Corphita

USA . 4,426 parts In-Stock

1+ parts

$10.255

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Bastille Electronics

Australia . 700 parts In-Stock

1+ parts

$11.940

100+ parts

$11.343

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$10.627

700

$11.940

$11.343

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$10.627

Parana Technologies

USA . 2,134 parts In-Stock

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$32.885

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$114.150

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$32.885

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DigiPath Technology Company

USA . 814 parts In-Stock

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$36.210

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814

$36.210

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ChromeModa Solutions

Germany . 6,136 parts In-Stock

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$36.949

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$30.298

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$36.949

$30.298

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IDEA Electronic Components Group

UK . 1,096 parts In-Stock

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$36.949

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$35.102

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$33.254

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$35.102

$33.254

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QUARKTWIN TECHNOLOGY LTD

USA . 23,933 parts In-Stock

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Lixinc

USA . 15,495 parts In-Stock

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Argo Parts USA

USA . 3,653 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Metaverse IC Inc.

Canada . 133 parts In-Stock

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iodParts Technologies Inc.

India . 50 parts In-Stock

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Overview

Experience cutting-edge technology with the AM4372BZDNA80 by Texas Instruments, a high-quality System on Chip designed to revolutionize your electronic devices. This versatile device offers unparalleled performance and reliability, making it perfect for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will meet all your needs. Upgrade your projects today with the AM4372BZDNA80 and enjoy the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into electronic circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 1.326 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in design and application.

Package Shape: SQUARE

The square package shape facilitates easy orientation and alignment during assembly, reducing the chances of installation errors.

No. of Terminals: 491

Having a high number of terminals allows for connectivity with various external devices and components, enhancing the product's versatility and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enables dense packing of components on the circuit board, optimizing space utilization and performance.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage ensures efficient power usage and helps in prolonging the product's lifespan by reducing stress on internal components.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand heat-intensive applications and environments, ensuring reliable performance under challenging conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in cold environments without experiencing performance issues, making it suitable for a wide range of operating conditions.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-term durability.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the assembly process and improves the overall aesthetics of the product, enhancing its appeal to customers.

Maximum Seated Height: 1.3 mm

The low maximum seated height allows for compact and slim designs, making the product suitable for applications where space constraints are a consideration.

Width: 17 mm

The standard width of 17mm allows for easy integration into existing electronic systems, ensuring compatibility and flexibility in design.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature minimizes the risk of heat damage during soldering processes, ensuring the product's reliability and longevity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance indicates the product's ability to withstand high-temperature soldering processes without compromising performance or integrity.

Length: 17 mm

The standard length of 17mm ensures compatibility with industry-standard mounting configurations and facilitates easy installation in various electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate reliably in rugged industrial environments where temperature fluctuations and harsh conditions are common.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip peripheral IC type offers integrated functionality and high-performance capabilities in a single package, simplifying circuit design and reducing overall system complexity.

Technology: CMOS

The CMOS technology used in the product offers low power consumption, high-speed operation, and compatibility with a wide range of applications, making it a cost-effective and versatile solution.

Terminal Form: BALL

The ball terminal form facilitates easy soldering and rework processes, ensuring reliable connections and streamlined manufacturing operations.

Nominal Supply Voltage: 1.26 V

The nominal supply voltage provides a stable power source for the product, ensuring consistent performance and reliability in various operational scenarios.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm allows for high-density mounting and precise connections on the circuit board, enhancing the product's overall performance and functionality.

Moisture Sensitivity Level (MSL): 3

Having a moderate moisture sensitivity level of 3 indicates the product's ability to withstand typical levels of moisture exposure during storage and handling, ensuring product integrity and reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4372BZDNA80 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4372BZDNA80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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