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AM4379BZDNA100

Texas Instruments

AM4379BZDNA100 by Texas Instruments

AM4379BZDNA100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 105°C. It features a low profile grid array package, 0.65mm terminal pitch, and 1.272-1.378V supply voltage range. Ideal for industrial applications requiring high-performance uPs/uCs & peripheral ICs in compact form factors.

Median Price

$38.690

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 459 parts In-Stock

1+ parts

$22.691

100+ parts

$20.170

1k+ parts

$14.831

10k+ parts

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459

$22.691

$20.170

$14.831

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DigiKey

USA . 60 parts In-Stock

1+ parts

$38.690

100+ parts

$27.845

1k+ parts

$26.710

10k+ parts

-

60

$38.690

$27.845

$26.710

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Mouser Electronics

USA . 33 parts In-Stock

1+ parts

$38.690

100+ parts

$27.080

1k+ parts

$26.700

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33

$38.690

$27.080

$26.700

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,811 parts In-Stock

1+ parts

$21.556

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1,811

$21.556

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Nova Conductors

Japan . 550 parts In-Stock

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$22.247

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550

$22.247

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Vyrian

USA . 5,876 parts In-Stock

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5,876

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VNN

France . 3,867 parts In-Stock

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Chip Stock

USA . 701 parts In-Stock

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701

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Distributors (Availability)

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AZTECH Wire

Italy . 530 parts In-Stock

1+ parts

$11.015

100+ parts

-

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530

$11.015

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Ampacity Inc.

Singapore . 267 parts In-Stock

1+ parts

$19.290

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267

$19.290

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Corphita

USA . 3,030 parts In-Stock

1+ parts

$20.422

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3,030

$20.422

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$21.802

100+ parts

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$20.930

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500

$21.802

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$20.930

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Continental Prestige Electronics

USA . 6,295 parts In-Stock

1+ parts

$22.247

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$21.802

6,295

$22.247

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$21.802

Parana Technologies

USA . 1,879 parts In-Stock

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$71.792

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1,879

$71.792

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DigiPath Technology Company

USA . 1,039 parts In-Stock

1+ parts

$79.052

100+ parts

$72.728

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1,039

$79.052

$72.728

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ChromeModa Solutions

Germany . 2,640 parts In-Stock

1+ parts

$80.665

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$66.145

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2,640

$80.665

$66.145

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IDEA Electronic Components Group

UK . 1,925 parts In-Stock

1+ parts

$80.665

100+ parts

$76.632

1k+ parts

$72.598

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1,925

$80.665

$76.632

$72.598

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S.R.D Solutions

India . 27,890 parts In-Stock

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Perfect Parts

USA . 8,960 parts In-Stock

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Lixinc

USA . 7,813 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,595 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,730 parts In-Stock

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3,730

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 980 parts In-Stock

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Futuretech Components

Singapore . 600 parts In-Stock

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Overview

Discover the cutting-edge AM4379BZDNA100 by Texas Instruments, a top-tier manufacturer known for quality and innovation. This System on Chip device falls under the category of Other Function uPs,uCs & Peripheral ICs, offering unparalleled performance and reliability. With a temperature grade of INDUSTRIAL and a maximum operating temperature of 105°C, this product is ideal for a wide range of applications. From automotive to industrial automation, this versatile chip delivers exceptional value and benefits to customers, making it a must-have for any project requiring high-quality functionality. Upgrade your system with Texas Instruments' AM4379BZDNA100 and experience the difference in performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to external elements, ensuring the longevity of the product.

Surface Mount: YES

Surface mount feature allows for easy integration and installation of the product onto circuit boards.

Maximum Supply Voltage: 1.378 V

Higher maximum supply voltage allows for stable operation and versatility in different power supply scenarios.

Package Shape: SQUARE

Square package shape helps in efficient use of space on the circuit board, making it suitable for compact designs.

No. of Terminals: 491

High number of terminals provide ample connectivity options for various input and output configurations.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance in both extreme cold and hot environments.

Terminal Finish: TIN SILVER COPPER

Tin silver copper finish on terminals provides good conductivity and corrosion resistance, improving the overall reliability of the product.

Width: 17 mm

Compact width dimension allows for easy integration into space-constrained electronic devices.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the product can withstand the necessary soldering processes during manufacturing.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable performance even in harsh industrial environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4379BZDNA100 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.378 V

Minimum Supply Voltage:

1.272 V

Nominal Supply Voltage:

1.325 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4379BZDNA100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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