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AM4378BZDN80

Texas Instruments

AM4378BZDN80 by Texas Instruments

AM4378BZDN80 by Texas Instruments is a CMOS system-on-chip with a max supply voltage of 1.326V and a min operating temperature of 0°C. It is used in applications requiring low-profile, fine-pitch grid array packages with 491 terminals.

Median Price

$16.840

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 357 parts In-Stock

1+ parts

$12.500

100+ parts

$10.919

1k+ parts

$7.530

10k+ parts

-

357

$12.500

$10.919

$7.530

-

Mouser Electronics

USA . 90 parts In-Stock

1+ parts

$21.180

100+ parts

$12.970

1k+ parts

$12.850

10k+ parts

-

90

$21.180

$12.970

$12.850

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,094 parts In-Stock

1+ parts

$11.875

100+ parts

-

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-

10k+ parts

-

3,094

$11.875

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-

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Nova Conductors

Japan . 49 parts In-Stock

1+ parts

$13.100

100+ parts

-

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-

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49

$13.100

-

-

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Vyrian

USA . 7,664 parts In-Stock

1+ parts

-

100+ parts

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7,664

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VNN

France . 1,791 parts In-Stock

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-

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-

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1,791

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 275 parts In-Stock

1+ parts

$6.224

100+ parts

-

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275

$6.224

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-

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Ampacity Inc.

Singapore . 224 parts In-Stock

1+ parts

$10.630

100+ parts

-

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-

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224

$10.630

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-

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Corphita

USA . 4,357 parts In-Stock

1+ parts

$11.250

100+ parts

-

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-

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4,357

$11.250

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-

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Continental Prestige Electronics

USA . 5,092 parts In-Stock

1+ parts

$13.100

100+ parts

-

1k+ parts

-

10k+ parts

$12.838

5,092

$13.100

-

-

$12.838

Netroflash

USA . 50 parts In-Stock

1+ parts

$13.100

100+ parts

-

1k+ parts

$12.445

10k+ parts

$12.183

50

$13.100

-

$12.445

$12.183

Corohmni

South Africa . 54 parts In-Stock

1+ parts

$14.720

100+ parts

-

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-

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54

$14.720

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Parana Technologies

USA . 1,633 parts In-Stock

1+ parts

$22.410

100+ parts

-

1k+ parts

$23.085

10k+ parts

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1,633

$22.410

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$23.085

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Advanced Electronics

New Zealand . 59 parts In-Stock

1+ parts

$24.450

100+ parts

$22.250

1k+ parts

$20.049

10k+ parts

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59

$24.450

$22.250

$20.049

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DigiPath Technology Company

USA . 1,585 parts In-Stock

1+ parts

$24.676

100+ parts

$22.702

1k+ parts

-

10k+ parts

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1,585

$24.676

$22.702

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ChromeModa Solutions

Germany . 6,845 parts In-Stock

1+ parts

$25.180

100+ parts

$20.648

1k+ parts

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6,845

$25.180

$20.648

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IDEA Electronic Components Group

UK . 2,239 parts In-Stock

1+ parts

$25.180

100+ parts

$23.921

1k+ parts

$22.662

10k+ parts

-

2,239

$25.180

$23.921

$22.662

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,500

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Lixinc

USA . 5,612 parts In-Stock

1+ parts

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5,612

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Argo Parts USA

USA . 3,543 parts In-Stock

1+ parts

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100+ parts

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3,543

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Overview

Experience the power of cutting-edge technology with the AM4378BZDN80 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees superior quality and reliability in every product. With its wide range of applications in Other Function uPs, uCs & Peripheral ICs, this device is perfect for enhancing performance and efficiency in various electronic systems. Unlock your potential with the AM4378BZDN80 and enjoy the value, benefits, and advantages it brings to your projects. Trust in Texas Instruments to deliver innovation that surpasses expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to temperature and moisture, making the product suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving time and cost during production.

Maximum Supply Voltage: 1.326 V

The higher maximum supply voltage ensures reliable performance and stability of the product under different operating conditions.

Package Shape: SQUARE

The square shape of the package provides a compact and space-efficient design, making it ideal for applications with limited space.

No. of Terminals: 491

The high number of terminals allows for a greater level of connectivity and functionality within the product, suitable for complex applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a high level of integration, low profile design, and fine pitch for efficient signal routing and connectivity.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage ensures energy efficiency and optimal performance of the product, reducing power consumption.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature allows the product to function reliably in challenging environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can operate in a wide range of temperature conditions, improving its versatility.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance of the product.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and secure connection to circuit boards, improving the overall stability and durability of the product.

Maximum Seated Height: 1.3 mm

The low seated height of the product ensures compatibility with compact designs and applications, offering flexibility in mounting options.

Width: 17 mm

The compact width of the product enables easy integration into various electronic systems, saving space and facilitating efficient assembly.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering and reliability during manufacturing processes, reducing potential defects.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for effective soldering and bonding of components, ensuring durability and long-term performance of the product.

Length: 17 mm

The compact length of the product contributes to its overall space-efficient design, suitable for applications with size constraints.

Peripheral IC Type: SYSTEM ON CHIP

The integration of peripheral ICs into a single system on chip provides enhanced functionality and performance, reducing the need for additional external components.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product in various applications.

Terminal Form: BALL

The ball terminal form provides reliable connections and solder joints, ensuring secure and stable operation of the product in demanding environments.

Nominal Supply Voltage: 1.26 V

The specified nominal supply voltage ensures optimal performance and efficiency, meeting the power requirements of the product for reliable operation.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for high-density integration and precise signal routing, improving the overall performance and connectivity of the product.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates the product's ability to withstand moderate exposure to moisture during storage and assembly, ensuring reliability and durability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4378BZDN80 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4378BZDN80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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