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AM4378BZDNA80

Texas Instruments

AM4378BZDNA80 by Texas Instruments

AM4378BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.21V to 1.326V. Ideal for applications requiring low profile and fine pitch package style in industrial settings.

Median Price

$28.380

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$28.380

100+ parts

$18.980

1k+ parts

$18.490

10k+ parts

-

4

$28.380

$18.980

$18.490

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$17.230

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$17.230

-

-

-

Digiode

USA . 3,224 parts In-Stock

1+ parts

$17.746

100+ parts

-

1k+ parts

-

10k+ parts

-

3,224

$17.746

-

-

-

Vyrian

USA . 2,323 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,323

-

-

-

-

VNN

France . 2,155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,155

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,473 parts In-Stock

1+ parts

$16.812

100+ parts

-

1k+ parts

-

10k+ parts

-

1,473

$16.812

-

-

-

Continental Prestige Electronics

USA . 599 parts In-Stock

1+ parts

$17.230

100+ parts

-

1k+ parts

-

10k+ parts

$16.885

599

$17.230

-

-

$16.885

Ampacity Inc.

Singapore . 4 parts In-Stock

1+ parts

$17.630

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$17.630

-

-

-

AZTECH Wire

Italy . 429 parts In-Stock

1+ parts

$18.582

100+ parts

-

1k+ parts

-

10k+ parts

-

429

$18.582

-

-

-

Parana Technologies

USA . 1,155 parts In-Stock

1+ parts

$48.104

100+ parts

$4,467.150

1k+ parts

$43.293

10k+ parts

-

1,155

$48.104

$4,467.150

$43.293

-

DigiPath Technology Company

USA . 1,286 parts In-Stock

1+ parts

$52.968

100+ parts

$48.731

1k+ parts

-

10k+ parts

-

1,286

$52.968

$48.731

-

-

IDEA Electronic Components Group

UK . 1,206 parts In-Stock

1+ parts

$54.049

100+ parts

$51.347

1k+ parts

$48.644

10k+ parts

-

1,206

$54.049

$51.347

$48.644

-

ChromeModa Solutions

Germany . 854 parts In-Stock

1+ parts

$54.049

100+ parts

$44.320

1k+ parts

-

10k+ parts

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854

$54.049

$44.320

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-

Lixinc

USA . 16,834 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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16,834

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-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,000

-

-

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Argo Parts USA

USA . 3,108 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,108

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$16.885

1k+ parts

$16.368

10k+ parts

$16.024

50

-

$16.885

$16.368

$16.024

Overview

Discover the cutting-edge AM4378BZDNA80 by Texas Instruments, a top-tier manufacturer in the industry. This versatile System on Chip (SoC) is designed for a wide range of applications, delivering superior performance and reliability. With its advanced technology and industrial-grade components, this product offers unbeatable value and benefits to customers seeking high-quality solutions. Experience seamless operation and endless possibilities with the AM4378BZDNA80 – unlocking innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and resistance to heat, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a more compact and efficient design, saving space on the PCB and improving overall reliability of the product.

Maximum Supply Voltage: 1.326 V

The high maximum supply voltage allows for flexibility in power requirements, accommodating different voltage levels in various applications.

Package Shape: SQUARE

The square shape of the package provides a symmetrical and efficient layout on the PCB, optimizing space and design aesthetics.

No. of Terminals: 491

With a high number of terminals, the product can support complex circuitry and connectivity, making it suitable for advanced electronics applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density interconnects, low profile design, and fine pitch for increased functionality and performance in a compact form factor.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage ensures efficient power consumption and operation at lower voltage levels, reducing energy costs and heat dissipation.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and operate reliably in industrial settings.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows the product to function in extreme cold conditions, ensuring versatility in various environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity, corrosion resistance, and solderability, enhancing the overall performance and longevity of the product.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier and more secure PCB mounting, ensuring proper alignment and reliable connection in the system.

Maximum Seated Height: 1.3 mm

The low seated height allows for a compact and slim profile, ideal for space-constrained applications or designs with height restrictions.

Width: 17 mm

The standard width dimension provides compatibility with common PCB sizes and allows for easy integration into existing electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures proper soldering without damaging the components, improving manufacturing efficiency and product reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables lead-free soldering and RoHS compliance, meeting industry standards for environmental protection and safety.

Length: 17 mm

The standard length dimension provides compatibility with common PCB sizes and allows for easy integration into existing electronic systems.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, the product is suitable for rugged environments and extended operating conditions, ensuring high reliability and durability.

Peripheral IC Type: SYSTEM ON CHIP

The system on chip design integrates multiple functions into a single IC, reducing complexity, improving performance, and saving space in the electronic system.

Technology: CMOS

CMOS technology offers low power consumption, high speed operation, and compatibility with a wide range of applications, making the product energy-efficient and versatile.

Terminal Form: BALL

The ball terminal form provides reliable and robust connections, suitable for high-density packaging and advanced mounting techniques, enhancing overall product quality.

Nominal Supply Voltage: 1.26 V

The nominal supply voltage is well-suited for stable and efficient operation, meeting the power requirements of the product and ensuring reliable performance.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for high-density packaging, precise connection, and improved signal integrity, enhancing the overall performance and functionality of the product.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product has moderate sensitivity to moisture ingress during storage and handling, requiring standard precautions for moisture control.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4378BZDNA80 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4378BZDNA80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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