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RF430FRL154HCRGER

Texas Instruments

RF430FRL154HCRGER by Texas Instruments

RF430FRL154HCRGER by Texas Instruments is a MICROPROCESSOR CIRCUIT with I2C and SPI compatibility. It features 24 terminals in a CHIP CARRIER package style, suitable for commercial applications with an operating temperature range of 0 to 70°C. This CMOS technology device has a very thin profile and is surface mountable.

Median Price

$3.410

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,999 parts In-Stock

1+ parts

$3.410

100+ parts

$2.190

1k+ parts

$1.590

10k+ parts

$1.520

2,999

$3.410

$2.190

$1.590

$1.520

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 58 parts In-Stock

1+ parts

$1.228

100+ parts

-

1k+ parts

-

10k+ parts

-

58

$1.228

-

-

-

Digiode

USA . 4,360 parts In-Stock

1+ parts

$2.983

100+ parts

-

1k+ parts

-

10k+ parts

-

4,360

$2.983

-

-

-

Vyrian

USA . 8,515 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,515

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 3,605 parts In-Stock

1+ parts

$1.228

100+ parts

$1.167

1k+ parts

$1.108

10k+ parts

$1.093

3,605

$1.228

$1.167

$1.108

$1.093

Continental Prestige Electronics

USA . 5,673 parts In-Stock

1+ parts

$1.228

100+ parts

-

1k+ parts

-

10k+ parts

$1.203

5,673

$1.228

-

-

$1.203

Argo Parts USA

USA . 1,840 parts In-Stock

1+ parts

$1.228

100+ parts

-

1k+ parts

-

10k+ parts

-

1,840

$1.228

-

-

-

Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$1.253

100+ parts

$1.253

1k+ parts

$1.253

10k+ parts

-

150

$1.253

$1.253

$1.253

-

Ampacity Inc.

Singapore . 8,579 parts In-Stock

1+ parts

$2.670

100+ parts

-

1k+ parts

-

10k+ parts

-

8,579

$2.670

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-

-

Corphita

USA . 4,483 parts In-Stock

1+ parts

$2.826

100+ parts

-

1k+ parts

-

10k+ parts

-

4,483

$2.826

-

-

-

Microchip USA

USA . 4,009 parts In-Stock

1+ parts

$8.561

100+ parts

-

1k+ parts

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10k+ parts

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4,009

$8.561

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-

-

Parana Technologies

USA . 1,600 parts In-Stock

1+ parts

$40.838

100+ parts

-

1k+ parts

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10k+ parts

-

1,600

$40.838

-

-

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ChromeModa Solutions

Germany . 3,117 parts In-Stock

1+ parts

$45.885

100+ parts

$37.626

1k+ parts

-

10k+ parts

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3,117

$45.885

$37.626

-

-

IDEA Electronic Components Group

UK . 478 parts In-Stock

1+ parts

$45.885

100+ parts

$43.591

1k+ parts

$41.296

10k+ parts

-

478

$45.885

$43.591

$41.296

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Corohmni

South Africa . 2,675 parts In-Stock

1+ parts

$62.491

100+ parts

-

1k+ parts

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10k+ parts

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2,675

$62.491

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-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

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Futuretech Components

Singapore . 2,024 parts In-Stock

1+ parts

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2,024

-

-

-

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DigiPath Technology Company

USA . 1,255 parts In-Stock

1+ parts

-

100+ parts

$41.370

1k+ parts

-

10k+ parts

-

1,255

-

$41.370

-

-

Lixinc

USA . 561 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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561

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Overview

Unlock endless possibilities with the RF430FRL154HCRGER by Texas Instruments, a cutting-edge microprocessor circuit that delivers unparalleled performance and reliability. Designed with precision and expertise, Texas Instruments ensures top-notch quality in every aspect of this chip carrier package. Whether you're looking to enhance your IoT devices or streamline your industrial applications, this product's innovative technology, seamless compatibility with I2C and SPI buses, and commercial-grade temperature range make it a game-changer for your projects. Elevate your designs with the RF430FRL154HCRGER and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the IC, making it suitable for various applications.

Surface Mount: YES

Being surface mountable makes it easy to integrate into circuit boards, saving space and simplifying the assembly process.

Package Shape: SQUARE

The square shape allows for efficient use of space on the circuit board, making it ideal for compact electronic devices.

No. of Terminals: 24

With 24 terminals, this IC provides ample connectivity options for interfacing with other components and peripherals.

Package Style: CHIP CARRIER, VERY THIN PROFILE

The thin profile of the chip carrier package style helps in minimizing the overall height of the component, making it suitable for slim designs.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance of 70°C ensures reliable performance even in challenging environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The incorporation of a microprocessor circuit in the peripheral IC enhances processing capabilities, allowing for advanced functionality in electronic devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable for various applications.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates that the IC is relatively resistant to moisture, ensuring stable performance in humid environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs RF430FRL154HCRGER attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE

Bus Compatibility:

I2C; SPI

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

RF430FRL154HCRGER Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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