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RF430FRL152HSRGER

Texas Instruments

RF430FRL152HSRGER by Texas Instruments

RF430FRL152HSRGER by Texas Instruments is a CMOS microprocessor circuit with 24 terminals in a square chip carrier package. Operating temperature range of 0-70°C makes it suitable for commercial applications. With surface mount capability and very thin profile, it is ideal for compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,748 parts In-Stock

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Digiode

USA . 2,268 parts In-Stock

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2,268

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Distributors (Availability)

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AZTECH Wire

Italy . 326 parts In-Stock

1+ parts

$5.218

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326

$5.218

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Corohmni

South Africa . 2,881 parts In-Stock

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$29.624

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One Stop Electronics

USA . 226 parts In-Stock

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$32.000

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226

$32.000

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Parana Technologies

USA . 1,958 parts In-Stock

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$65.520

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1,958

$65.520

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DigiPath Technology Company

USA . 933 parts In-Stock

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$72.146

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933

$72.146

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IDEA Electronic Components Group

UK . 2,036 parts In-Stock

1+ parts

$73.618

100+ parts

$69.937

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$66.256

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2,036

$73.618

$69.937

$66.256

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ChromeModa Solutions

Germany . 1,638 parts In-Stock

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$73.618

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$60.367

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$73.618

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Corphita

USA . 2,646 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments RF430FRL152HSRGER. Built by a trusted manufacturer, this versatile microprocessor circuit offers endless possibilities for your next project. Whether you're looking to enhance security, improve efficiency, or streamline communication, this cutting-edge technology delivers unmatched performance and reliability. Say goodbye to limitations and hello to endless opportunities with the RF430FRL152HSRGER.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Square shape provides uniformity and allows for efficient use of space on the circuit board.

No. of Terminals: 24

Sufficient number of terminals for versatile connection options and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This combination of package styles allows for effective heat dissipation and compact design, ideal for applications with limited space.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in demanding environments.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for use in a wide range of operating conditions.

Terminal Position: QUAD

Quad terminal position provides stability and ease of connection during installation.

Maximum Seated Height: 1 mm

Low seated height allows for a slim profile and efficient use of space on the circuit board.

Width: 4 mm

Compact width makes the product suitable for applications with limited space constraints.

Length: 4 mm

Compact length makes the product suitable for applications with limited space constraints.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions in commercial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit offers advanced processing capabilities and versatility for various applications.

Technology: CMOS

CMOS technology provides low power consumption and high performance, making it an efficient choice for electronic devices.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of lead-related issues and ensures environmental friendliness.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise connections and efficient use of space on the circuit board.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs RF430FRL152HSRGER attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

RF430FRL152HSRGER Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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