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RF430FRL153HCRGER

Texas Instruments

RF430FRL153HCRGER by Texas Instruments

RF430FRL153HCRGER by Texas Instruments is a MICROPROCESSOR CIRCUIT with I2C and SPI compatibility. It features 24 terminals in a SQUARE CHIP CARRIER package style, suitable for COMMERCIAL applications. Operating temperature ranges from 0 to 70°C, making it ideal for various electronic devices.

Median Price

$2.701

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,967 parts In-Stock

1+ parts

$2.202

100+ parts

$1.796

1k+ parts

$1.197

10k+ parts

-

10,967

$2.202

$1.796

$1.197

-

Mouser Electronics

USA . 2,946 parts In-Stock

1+ parts

$3.200

100+ parts

$2.270

1k+ parts

$1.690

10k+ parts

$1.580

2,946

$3.200

$2.270

$1.690

$1.580

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.523

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.523

-

-

-

Digiode

USA . 2,392 parts In-Stock

1+ parts

$2.092

100+ parts

-

1k+ parts

-

10k+ parts

-

2,392

$2.092

-

-

-

Chip Stock

USA . 19,470 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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19,470

-

-

-

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Vyrian

USA . 6,779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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6,779

-

-

-

-

Electronics Depot

USA . 13 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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13

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,186 parts In-Stock

1+ parts

$1.523

100+ parts

-

1k+ parts

-

10k+ parts

-

2,186

$1.523

-

-

-

Continental Prestige Electronics

USA . 1,912 parts In-Stock

1+ parts

$1.523

100+ parts

-

1k+ parts

-

10k+ parts

$1.493

1,912

$1.523

-

-

$1.493

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$1.554

100+ parts

$1.554

1k+ parts

$1.554

10k+ parts

-

40

$1.554

$1.554

$1.554

-

Ampacity Inc.

Singapore . 6,915 parts In-Stock

1+ parts

$1.870

100+ parts

-

1k+ parts

-

10k+ parts

-

6,915

$1.870

-

-

-

Semicontronic

India . 6,535 parts In-Stock

1+ parts

$1.870

100+ parts

$1.823

1k+ parts

$1.814

10k+ parts

-

6,535

$1.870

$1.823

$1.814

-

Corphita

USA . 3,585 parts In-Stock

1+ parts

$1.982

100+ parts

-

1k+ parts

-

10k+ parts

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3,585

$1.982

-

-

-

Corohmni

South Africa . 1,116 parts In-Stock

1+ parts

$48.077

100+ parts

-

1k+ parts

-

10k+ parts

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1,116

$48.077

-

-

-

Parana Technologies

USA . 474 parts In-Stock

1+ parts

$73.234

100+ parts

-

1k+ parts

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10k+ parts

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474

$73.234

-

-

-

DigiPath Technology Company

USA . 1,306 parts In-Stock

1+ parts

$80.639

100+ parts

-

1k+ parts

-

10k+ parts

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1,306

$80.639

-

-

-

ChromeModa Solutions

Germany . 6,243 parts In-Stock

1+ parts

$82.285

100+ parts

$67.474

1k+ parts

-

10k+ parts

-

6,243

$82.285

$67.474

-

-

IDEA Electronic Components Group

UK . 1,846 parts In-Stock

1+ parts

$82.285

100+ parts

$78.171

1k+ parts

$74.056

10k+ parts

-

1,846

$82.285

$78.171

$74.056

-

Lixinc

USA . 11,473 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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11,473

-

-

-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,000

-

-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.493

1k+ parts

$1.447

10k+ parts

$1.417

1,000

-

$1.493

$1.447

$1.417

Overview

Unlock endless possibilities with the Texas Instruments RF430FRL153HCRGER, a cutting-edge peripheral IC that revolutionizes connectivity and functionality. Crafted with precision and expertise by Texas Instruments, this chip carrier boasts unrivaled quality and innovation. From IoT devices to smart wearables, this versatile microprocessor circuit is designed to elevate your projects to new heights. Experience seamless integration, high performance, and reliability like never before. Elevate your designs with the RF430FRL153HCRGER and unleash the full potential of your creations.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protects internal components well.

Surface Mount:

YES - Easy to install and saves space on PCB.

Package Shape:

SQUARE - Allows for efficient use of board space.

No. of Terminals:

24 - Offers ample connection options for various functions.

Package Style:

CHIP CARRIER, VERY THIN PROFILE - Enhances portability and sleek design.

Maximum Operating Temperature:

70 °C - Ensures stable performance in varying environmental conditions.

Minimum Operating Temperature:

0 °C - Can operate in cold environments without issues.

Terminal Finish:

NICKEL PALLADIUM GOLD - Provides excellent conductivity and prevents corrosion.

Terminal Position:

QUAD - Facilitates easy soldering and secure connection.

Maximum Seated Height:

1 mm - Allows for low-profile designs and compact circuits.

Width:

4 mm - Fits well in narrow spaces and crowded PCB layouts.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper reflow soldering without damaging components.

Peak Reflow Temperature:

260 °C - Withstands high temperatures during manufacturing processes.

Length:

4 mm - Ideal size for various electronic applications.

Temperature Grade:

COMMERCIAL - Suitable for standard industrial use.

Peripheral IC Type:

MICROPROCESSOR CIRCUIT - Enables advanced functions and processing capabilities.

Technology:

CMOS - Offers low power consumption and high-speed operation.

Terminal Form:

NO LEAD - Environmentally friendly and RoHS compliant.

Bus Compatibility:

I2C; SPI - Versatile connectivity options for diverse applications.

Terminal Pitch:

0.5 mm - Allows for fine-pitch mounting on PCBs.

Moisture Sensitivity Level (MSL):

2 - Ensures reliability in humid or damp environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs RF430FRL153HCRGER attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE

Bus Compatibility:

I2C; SPI

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

RF430FRL153HCRGER Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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