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MCIMX356AVM4B

NXP Semiconductors

MCIMX356AVM4B by NXP Semiconductors

MCIMX356AVM4B by NXP Semiconductors is a SYSTEM ON CHIP with 400 terminals, operating temperature range of -40 to 85 °C. It has a supply voltage range of 1.22V to 1.47V and is designed for industrial applications requiring low profile, fine pitch package style.

Median Price

$26.368

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 90 parts In-Stock

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$24.470

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$24.470

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Flip Electronics (Authorized)

USA . 90 parts In-Stock

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90

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Verical

USA . 90 parts In-Stock

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$28.266

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90

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$28.266

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Distributors (In-Stock)

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Nova Conductors

Japan . 68 parts In-Stock

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$23.343

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$23.343

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Vyrian

USA . 6,225 parts In-Stock

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Digiode

USA . 1,557 parts In-Stock

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Anansix

USA . 225 parts In-Stock

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One Stop Electronics

USA . 90 parts In-Stock

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$11.000

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$11.000

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AZTECH Wire

Italy . 418 parts In-Stock

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$18.409

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Continental Prestige Electronics

USA . 2,895 parts In-Stock

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$23.343

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$22.877

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Ampacity Inc.

Singapore . 90 parts In-Stock

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$29.000

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Advanced Electronics

New Zealand . 71 parts In-Stock

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$33.530

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$30.512

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$27.495

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Microchip USA

USA . 1,657 parts In-Stock

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$60.401

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Corohmni

South Africa . 3,208 parts In-Stock

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UNI Independent Distributors

Spain . 7,965 parts In-Stock

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Corphita

USA . 4,341 parts In-Stock

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Argo Parts USA

USA . 3,262 parts In-Stock

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Authorized Procurement Solutions

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Netroflash

USA . 100 parts In-Stock

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$22.877

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$22.176

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$21.709

100

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$22.877

$22.176

$21.709

Overview

Discover the cutting-edge MCIMX356AVM4B by NXP Semiconductors, a game-changing System on Chip designed for unparalleled performance in various applications. With NXP's reputation for quality and innovation, this product boasts reliability and efficiency like no other. From smart devices to automotive systems, this versatile chip offers unmatched value and benefits to customers looking for top-tier solutions. Upgrade your projects with the MCIMX356AVM4B and experience the difference that NXP Semiconductors brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components due to its durability and resistance to heat and chemicals.

Surface Mount: YES

Surface mount technology allows for easier and more compact assembly of electronic circuits, making the product suitable for small and complex designs.

Maximum Supply Voltage: 1.47 V

The maximum supply voltage is within acceptable limits for many applications, providing stability and reliability to the product.

Screening Level: AEC-Q100

This level of screening ensures that the product meets automotive standards, making it suitable for automotive applications where high reliability is essential.

Package Shape: SQUARE

The square package shape is advantageous for efficient use of space and allows for uniform distribution of components within the package.

No. of Terminals: 400

Having a high number of terminals allows for more connectivity options and functionality in the product, making it versatile and adaptable to various requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style provides a compact and low-profile design with fine pitch terminals, enabling high-density mounting and improving performance.

Minimum Supply Voltage: 1.22 V

The minimum supply voltage ensures compatibility with a wide range of power sources, enhancing the product's flexibility and usability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and deliver reliable performance in demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to operate effectively in cold environments, expanding its range of potential applications.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections and long-term performance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom allows for easier soldering and assembly, improving the overall manufacturing process and quality of the product.

Maximum Seated Height: 1.6 mm

The low maximum seated height of the product contributes to a compact and slim design, ideal for space-constrained applications.

Width: 17 mm

The product's width dimension is suitable for integration into various electronic systems, providing compatibility and ease of installation.

Maximum Time At Peak Reflow Temperature (s): 40

This specification indicates the product's tolerance to high reflow temperatures during assembly, ensuring proper soldering and reliability in manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows the product to withstand harsh soldering processes without degradation, ensuring long-term reliability.

Length: 17 mm

The product's length dimension complements its width, providing a balanced form factor suitable for a wide range of electronic applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certifies the product's reliability and performance in rugged environments, making it suitable for industrial applications.

Peripheral IC Type: SYSTEM ON CHIP

Being a system-on-chip peripheral IC type, the product offers integrated functionality and high performance, reducing the need for additional components and enhancing efficiency.

Technology: CMOS

Complementary metal-oxide-semiconductor (CMOS) technology ensures low power consumption and high-speed operation, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form provides secure connections and good thermal performance, enabling efficient heat dissipation and reliable electrical contacts.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage specification indicates the standard voltage level required for optimal performance, ensuring consistent and stable operation.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for high-density mounting and compact design, facilitating miniaturization and space-saving in electronic systems.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates moderate sensitivity to moisture, requiring proper handling and storage practices to maintain the product's performance and reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX356AVM4B attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.47 V

Minimum Supply Voltage:

1.22 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MCIMX356AVM4B Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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