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CY8C21434-24LQXIT

Infineon Technologies

CY8C21434-24LQXIT by Infineon Technologies

CY8C21434-24LQXIT by Infineon is a 32-terminal, CMOS technology chip with a max supply voltage of 5.25V and operating temp range of -40 to 85°C. Ideal for industrial applications, this programmable SoC has a square shape, no lead terminal form, and very thin profile package style.

Median Price

$4.644

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 140,000 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

$4.713

140,000

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-

$4.713

Verical

USA . 140,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.574

140,000

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$4.574

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 52,451 parts In-Stock

1+ parts

-

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52,451

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Digiode

USA . 963 parts In-Stock

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963

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Nova Conductors

Japan . 37 parts In-Stock

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37

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Distributors (Availability)

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Ampacity Inc.

Singapore . 52,215 parts In-Stock

1+ parts

$5.200

100+ parts

-

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52,215

$5.200

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Semicontronic

India . 52,025 parts In-Stock

1+ parts

$5.200

100+ parts

$5.070

1k+ parts

$5.044

10k+ parts

-

52,025

$5.200

$5.070

$5.044

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Modulus Dynamics

Lithuania . 2,249 parts In-Stock

1+ parts

$23.396

100+ parts

$22.460

1k+ parts

$21.524

10k+ parts

-

2,249

$23.396

$22.460

$21.524

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$63.931

100+ parts

$58.177

1k+ parts

$52.423

10k+ parts

-

3,000

$63.931

$58.177

$52.423

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Aztec Data Supply Inc.

USA . 2,838 parts In-Stock

1+ parts

$83.506

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2,838

$83.506

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QUARKTWIN TECHNOLOGY LTD

USA . 19,125 parts In-Stock

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Infinite Electronics LLP (Excess)

. 5,006 parts In-Stock

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5,006

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Metaverse IC Inc.

Canada . 2,374 parts In-Stock

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2,374

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Argo Parts USA

USA . 1,840 parts In-Stock

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1,840

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Corphita

USA . 692 parts In-Stock

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692

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Continental Prestige Electronics

USA . 255 parts In-Stock

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255

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Discover the endless possibilities with the CY8C21434-24LQXIT from Infineon Technologies. This cutting-edge programmable SoC offers unmatched quality and reliability, making it the perfect choice for a wide range of applications. With its advanced technology and industrial-grade temperature grade, this chip carrier with a very thin profile provides customers with a compact yet powerful solution for their projects. Whether you're designing IoT devices or consumer electronics, the CY8C21434-24LQXIT delivers exceptional performance and value, giving you the competitive edge you need in today's fast-paced market.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy integration onto PCBs and saves space in electronic designs.

Maximum Supply Voltage: 5.25 V

Provides a wide operating range, allowing for flexibility in power supply selection.

Package Shape: SQUARE

Square shape provides efficient use of board space and simplifies layout design.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of these styles ensures effective heat dissipation and a compact form factor.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions.

Peripheral IC Type: PROGRAMMABLE SoC

Offers versatility in functionality and customization options for the end product.

Technology: CMOS

Low power consumption and high noise immunity characteristics of CMOS technology.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CY8C21434-24LQXIT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES AT 2.7V AND 3.3V SUPPLY

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Peripheral IC Type:

Trade Compliance

CY8C21434-24LQXIT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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