Loading...

MFRC52202HN1,157

NXP Semiconductors

MFRC52202HN1,157 by NXP Semiconductors

NXP Semiconductors' MFRC52202HN1,157 is a microprocessor circuit with 32 terminals in a square chip carrier package. Operating at 3/3.3V, it has a max temp of 85°C and min temp of -25°C. Ideal for applications requiring RFID technology like access control systems and contactless payment solutions.

Median Price

$8.000

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,506 parts In-Stock

1+ parts

$6.350

100+ parts

$4.170

1k+ parts

$3.860

10k+ parts

-

1,506

$6.350

$4.170

$3.860

-

Mouser Electronics

USA . 4,143 parts In-Stock

1+ parts

$8.000

100+ parts

$5.310

1k+ parts

$4.800

10k+ parts

-

4,143

$8.000

$5.310

$4.800

-

DigiKey

USA . 1,514 parts In-Stock

1+ parts

$8.000

100+ parts

$5.306

1k+ parts

-

10k+ parts

-

1,514

$8.000

$5.306

-

-

Newark

USA . 1,506 parts In-Stock

1+ parts

$8.480

100+ parts

$5.560

1k+ parts

$5.160

10k+ parts

-

1,506

$8.480

$5.560

$5.160

-

Element14

Singapore . 2,660 parts In-Stock

1+ parts

$10.050

100+ parts

$7.520

1k+ parts

$6.550

10k+ parts

-

2,660

$10.050

$7.520

$6.550

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$4.680

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$4.680

-

-

-

Digiode

USA . 936 parts In-Stock

1+ parts

$5.206

100+ parts

-

1k+ parts

-

10k+ parts

-

936

$5.206

-

-

-

Vyrian

USA . 3,425 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,425

-

-

-

-

Anansix

USA . 946 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

946

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,336 parts In-Stock

1+ parts

$4.440

100+ parts

-

1k+ parts

-

10k+ parts

-

2,336

$4.440

-

-

-

Ampacity Inc.

Singapore . 3,062 parts In-Stock

1+ parts

$4.660

100+ parts

-

1k+ parts

-

10k+ parts

-

3,062

$4.660

-

-

-

Semicontronic

India . 2,906 parts In-Stock

1+ parts

$4.660

100+ parts

$4.544

1k+ parts

$4.520

10k+ parts

-

2,906

$4.660

$4.544

$4.520

-

Corphita

USA . 2,060 parts In-Stock

1+ parts

$4.932

100+ parts

-

1k+ parts

-

10k+ parts

-

2,060

$4.932

-

-

-

Continental Prestige Electronics

USA . 3,346 parts In-Stock

1+ parts

$5.180

100+ parts

$3.880

1k+ parts

-

10k+ parts

-

3,346

$5.180

$3.880

-

-

Corohmni

South Africa . 604 parts In-Stock

1+ parts

$5.421

100+ parts

-

1k+ parts

-

10k+ parts

-

604

$5.421

-

-

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$5.584

100+ parts

$5.304

1k+ parts

$5.304

10k+ parts

-

100

$5.584

$5.304

$5.304

-

Aztec Data Supply Inc.

USA . 66 parts In-Stock

1+ parts

$41.440

100+ parts

-

1k+ parts

-

10k+ parts

-

66

$41.440

-

-

-

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

UNI Independent Distributors

Spain . 1,787 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,787

-

-

-

-

Overview

Unlock the power of innovation with the MFRC52202HN1,157 by NXP Semiconductors. This cutting-edge Peripheral IC is designed to meet the highest quality standards and offers a wide range of applications in the world of microprocessor circuits. With its advanced features, this product delivers unmatched performance, reliability, and efficiency, making it the perfect choice for your next project. Experience the value and benefits that NXP Semiconductors brings to the table with the MFRC52202HN1,157.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the IC, ensuring reliable performance while keeping the overall weight of the product low.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving valuable space and simplifying the assembly process.

Package Shape: SQUARE

Enables efficient use of space on the PCB and ensures a secure fit within the system design.

Power Supplies (V): 3/3.3

Compatible with common power supply configurations, making integration into existing systems straightforward.

No. of Terminals: 32

Provides ample connectivity options for various peripherals and components, allowing for versatile system design.

Package Style (Meter): CHIP CARRIER

Offers a compact and reliable packaging solution that is suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of operating conditions, making the product suitable for diverse environments.

Minimum Operating Temperature: -25 °C

Allows for operation in low-temperature environments without compromising performance, increasing the product's versatility.

Terminal Position: QUAD

Facilitates easy PCB layout and soldering, optimizing the manufacturing process and reducing chances of errors.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering of the IC during the assembly process, contributing to the product's reliability and longevity.

Peak Reflow Temperature °C: 260

Allows for reliable soldering of the IC on the PCB, ensuring secure connections and preventing potential issues.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Employs advanced processing capabilities for enhanced performance and functionality, making the IC suitable for a wide range of applications.

Terminal Form: NO LEAD

Reduces the risk of solder joint failures and improves overall reliability of the product, leading to longer operational lifespan.

Maximum Supply Current: 100 mA

Efficiently manages power consumption while providing sufficient current for various components, ensuring optimal performance.

Terminal Pitch: 0.5 mm

Enables high-density PCB designs with close component placement, enhancing system compactness and functionality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MFRC52202HN1,157 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

100 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

MFRC52202HN1,157 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 16