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MFRC63102HN,551

NXP Semiconductors

MFRC63102HN,551 by NXP Semiconductors

MFRC63102HN,551 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 5V with a max current of 20mA and supports temperatures from -25 °C to 85 °C. Ideal for RFID applications, it offers reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,290 parts In-Stock

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Anansix

USA . 2,012 parts In-Stock

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2,012

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Digiode

USA . 1,526 parts In-Stock

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1,526

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Distributors (Availability)

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One Stop Electronics

USA . 1,353 parts In-Stock

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$6.000

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$6.000

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AZTECH Wire

Italy . 343 parts In-Stock

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$21.420

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343

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Corohmni

South Africa . 585 parts In-Stock

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$52.278

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585

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Component Stockers USA

USA . 560 parts In-Stock

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$99.990

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560

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QUARKTWIN TECHNOLOGY LTD

USA . 21,841 parts In-Stock

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UNI Independent Distributors

Spain . 6,211 parts In-Stock

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Corphita

USA . 1,071 parts In-Stock

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Overview

Unlock endless possibilities with the MFRC63102HN,551 from NXP Semiconductors—a trusted leader in innovation. This versatile microprocessor circuit excels in various applications, offering unmatched reliability and performance. Designed for seamless integration, it ensures efficiency in power management and flexibility in design. Experience enhanced functionality while enjoying the peace of mind that comes with NXP's renowned quality and support. Embrace the future with a solution that empowers your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using a durable and lightweight plastic/epoxy material ensures high reliability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and enables easy integration into modern PCB layouts, which is essential for space-constrained applications.

Package Shape: SQUARE

The square shape of the package provides balanced dimensions, making it easier to fit into various circuit designs and layouts.

Power Supplies (V): 5

Operating at a standard 5V supply voltage simplifies power supply design, enhancing compatibility with a wide range of devices.

No. of Terminals: 32

With 32 terminals, this microprocessor circuit offers ample connectivity options for diverse functionalities and interfacing needs.

Package Style (Meter): CHIP CARRIER

The chip carrier style is designed for effective heat dissipation and stable performance, making it ideal for high-performance applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in warmer environments, making it suitable for industrial applications.

Minimum Operating Temperature: -25 °C

With a minimum operating temperature of -25 °C, this product can function effectively in low-temperature environments, enhancing its application versatility.

Terminal Position: QUAD

The quad terminal position facilitates straightforward routing and connections on PCBs, improving design layout efficiency.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being classified as a microprocessor circuit indicates the ability to perform complex operations, making it suitable for advanced processing tasks.

Terminal Form: NO LEAD

The no lead form contributes to the compact size and lightweight nature of the component, allowing for denser PCB designs without compromising performance.

Maximum Supply Current: 20 mA

Drawing a maximum supply current of 20 mA ensures low power consumption, which is particularly beneficial in battery-operated devices.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V aligns with common electronic systems and components, facilitating easier integration into existing designs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for fine-pitch design, accommodating high-density applications and optimizing space utilization on PCBs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MFRC63102HN,551 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

20 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

MFRC63102HN,551 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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