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MFRC63102HN,118

NXP Semiconductors

MFRC63102HN,118 by NXP Semiconductors

MFRC63102HN,118 by NXP Semiconductors is a microprocessor circuit designed for surface mount applications. It operates at 5V with a max supply current of 20mA and withstands temperatures from -25 °C to 85 °C. Ideal for RFID and NFC solutions, it features a compact chip carrier design.

Median Price

$4.523

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 6,000 parts In-Stock

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$4.523

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Vyrian

USA . 10,991 parts In-Stock

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Digiode

USA . 4,090 parts In-Stock

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Anansix

USA . 1,809 parts In-Stock

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One Stop Electronics

USA . 701 parts In-Stock

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$14.000

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701

$14.000

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AZTECH Wire

Italy . 424 parts In-Stock

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$20.190

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Corohmni

South Africa . 416 parts In-Stock

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$34.942

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UNI Independent Distributors

Spain . 8,360 parts In-Stock

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Corphita

USA . 2,305 parts In-Stock

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Overview

Unlock seamless connectivity and enhanced performance with the MFRC63102HN,118 from NXP Semiconductors. Renowned for their exceptional quality and innovation, NXP delivers a microprocessor circuit designed to elevate your applications, whether in smart energy, automotive, or IoT solutions. Enjoy reliable operation across various temperatures, low power consumption, and a compact design, ensuring you stay ahead of the competition while maximizing efficiency and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials for the package body enhances durability and protects the internal circuitry, making it suitable for various applications.

Surface Mount: YES

Surface mount capabilities allow for efficient use of space on PCBs, leading to smaller product designs and easier integration into complex systems.

Package Shape: SQUARE

The square shape of the package allows for uniform heat distribution and efficient board layout, improving overall performance in tight spaces.

Power Supplies (V): 5

Operating at a standard 5V supply makes it compatible with a wide range of consumer electronics and embedded systems.

No. of Terminals: 32

With 32 terminals, this microprocessor circuit provides ample connection points for input/output operations, enabling versatile application in various designs.

Package Style (Meter): CHIP CARRIER

The chip carrier style ensures robust electrical connections and simplifies the mounting process on printed circuit boards.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable operation in environments that experience heat without risking performance.

Minimum Operating Temperature: -25 °C

A minimum operating temperature of -25 °C allows the microprocessor to function effectively in colder environments, increasing its range of possible applications.

Terminal Position: QUAD

The quad terminal layout provides flexible design options and can facilitate easy integration with various circuit configurations.

Maximum Time At Peak Reflow Temperature (s): 30

Allowing for a 30-second peak reflow durations ensures compatibility with modern soldering processes, enhancing manufacturability and reliability.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C assures the ability to withstand high-temperature soldering techniques, crucial for robust device assembly.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, it is suitable for various computing applications, enabling extensive functionality in embedded systems.

Terminal Form: NO LEAD

The no lead terminal form leads to a more compact design, reducing the overall footprint on the PCB and improving thermal performance.

Maximum Supply Current: 20 mA

Drawing a maximum supply current of 20 mA helps in energy efficiency, making it suitable for battery-powered applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V makes it straightforward to power with common supplies, enhancing usability in diverse projects.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, it allows for denser packing of components on the PCB, maximizing space usage in compact applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MFRC63102HN,118 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

20 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

MFRC63102HN,118 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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