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XC7Z045-1FFG676I

Xilinx

XC7Z045-1FFG676I by Xilinx

XC7Z045-1FFG676I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance processing capabilities.

Median Price

$2,289.160

Lifecycle Status

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7

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Mouser Electronics

USA . 2 parts In-Stock

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DigiKey

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Digiode

USA . 175 parts In-Stock

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$2,035.878

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VNN

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 474 parts In-Stock

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$14.937

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Corohmni

South Africa . 82 parts In-Stock

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MARBEL Systems

Belgium . 5,001 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 2,857 parts In-Stock

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Aztec Data Supply Inc.

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Modulus Dynamics

Lithuania . 676 parts In-Stock

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Qasali Group International

UK . 2,122 parts In-Stock

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Microchip USA

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Semicontronic

India . 4 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 4 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 6,623 parts In-Stock

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Argo Parts USA

USA . 2,673 parts In-Stock

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$2,103.948

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Advanced Electronics

New Zealand . 200 parts In-Stock

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Supply Digital

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Vigor

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Overview

Unlock limitless possibilities with the XC7Z045-1FFG676I by Xilinx, a cutting-edge system on chip designed to revolutionize your projects. Crafted with precision and expertise, Xilinx delivers unparalleled quality and reliability in every product. Ideal for a wide range of applications in the realm of Other Function uPs, uCs & Peripheral ICs, this innovative chip offers unmatched value and performance. Elevate your designs, streamline your processes, and stay ahead of the curve with the XC7Z045-1FFG676I from Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuits inside.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 1.05 V

Provides a stable power source for the product to function efficiently.

Package Shape: SQUARE

Square shape allows for efficient use of space on circuit boards.

No. of Terminals: 676

Provides a high level of connectivity for various functions and applications.

Package Style (Meter): GRID ARRAY

Grid array style allows for easy connections and layout on circuit boards.

Minimum Supply Voltage: 0.95 V

Ensures that the product can operate even at lower voltage levels, increasing flexibility.

Maximum Operating Temperature: 100 °C

Can function reliably at high temperatures, making it suitable for various environments.

Minimum Operating Temperature: -40 °C

Operates even in freezing temperatures, making it versatile for different climates.

Terminal Position: BOTTOM

Bottom terminal position allows for efficient heat dissipation and signal processing.

Maximum Seated Height: 3.24 mm

Low height allows for compact design and easy integration into devices.

Width: 27 mm

Compact width size enables easy placement on circuit boards with limited space.

Length: 27 mm

Square shape and length provide balanced dimensions for versatile placement on circuit boards.

Peripheral IC Type: SYSTEM ON CHIP

Integration of system functionalities on a single chip minimizes external components and simplifies design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminals provide reliable connections and allow for easy installation.

Nominal Supply Voltage: 1 V

Stable supply voltage ensures consistent performance in various operating conditions.

Terminal Pitch: 1 mm

Narrow terminal pitch enables high density connections on circuit boards for complex applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z045-1FFG676I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.24 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z045-1FFG676I Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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