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AM5716AABCXEA

Texas Instruments

AM5716AABCXEA by Texas Instruments

AM5716AABCXEA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for industrial applications requiring high performance in compact spaces.

Median Price

$58.712

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 454 parts In-Stock

1+ parts

$44.523

100+ parts

$39.576

1k+ parts

$29.100

10k+ parts

-

454

$44.523

$39.576

$29.100

-

Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$72.900

100+ parts

$56.700

1k+ parts

$56.500

10k+ parts

-

3

$72.900

$56.700

$56.500

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 785 parts In-Stock

1+ parts

$42.297

100+ parts

-

1k+ parts

-

10k+ parts

-

785

$42.297

-

-

-

Nova Conductors

Japan . 39 parts In-Stock

1+ parts

$48.580

100+ parts

-

1k+ parts

-

10k+ parts

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39

$48.580

-

-

-

Vyrian

USA . 4,053 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,053

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-

-

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VNN

France . 1,505 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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1,505

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,175 parts In-Stock

1+ parts

$16.800

100+ parts

-

1k+ parts

$17.047

10k+ parts

-

2,175

$16.800

-

$17.047

-

AZTECH Wire

Italy . 850 parts In-Stock

1+ parts

$18.701

100+ parts

-

1k+ parts

-

10k+ parts

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850

$18.701

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-

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ChromeModa Solutions

Germany . 4,394 parts In-Stock

1+ parts

$18.876

100+ parts

$15.478

1k+ parts

-

10k+ parts

-

4,394

$18.876

$15.478

-

-

IDEA Electronic Components Group

UK . 524 parts In-Stock

1+ parts

$18.876

100+ parts

$17.932

1k+ parts

$16.988

10k+ parts

-

524

$18.876

$17.932

$16.988

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Corohmni

South Africa . 469 parts In-Stock

1+ parts

$25.392

100+ parts

-

1k+ parts

-

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469

$25.392

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-

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$29.814

100+ parts

$27.131

1k+ parts

$24.447

10k+ parts

-

500

$29.814

$27.131

$24.447

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Ampacity Inc.

Singapore . 221 parts In-Stock

1+ parts

$37.840

100+ parts

-

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-

10k+ parts

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221

$37.840

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-

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Semicontronic

India . 99 parts In-Stock

1+ parts

$37.840

100+ parts

$36.894

1k+ parts

$36.705

10k+ parts

-

99

$37.840

$36.894

$36.705

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Corphita

USA . 2,535 parts In-Stock

1+ parts

$40.071

100+ parts

-

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10k+ parts

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2,535

$40.071

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-

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Continental Prestige Electronics

USA . 2,006 parts In-Stock

1+ parts

$48.580

100+ parts

-

1k+ parts

-

10k+ parts

$47.608

2,006

$48.580

-

-

$47.608

Netroflash

USA . 500 parts In-Stock

1+ parts

$48.580

100+ parts

-

1k+ parts

-

10k+ parts

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500

$48.580

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-

-

Microchip USA

USA . 1,684 parts In-Stock

1+ parts

$97.770

100+ parts

$96.070

1k+ parts

$95.220

10k+ parts

$94.370

1,684

$97.770

$96.070

$95.220

$94.370

DigiPath Technology Company

USA . 1,407 parts In-Stock

1+ parts

-

100+ parts

$17.019

1k+ parts

-

10k+ parts

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1,407

-

$17.019

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Argo Parts USA

USA . 1,167 parts In-Stock

1+ parts

-

100+ parts

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1,167

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Perfect Parts

USA . 470 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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470

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Overview

Unlock the next level of performance with the AM5716AABCXEA by Texas Instruments. Manufactured with precision and expertise, this cutting-edge system-on-chip offers unparalleled reliability and efficiency in a wide range of applications. Whether you're looking to enhance your industrial systems or streamline your consumer electronics, this product delivers exceptional value, benefits, and advantages that will elevate your projects to new heights. Trust Texas Instruments for quality and innovation that exceeds expectations. Elevate your designs with the AM5716AABCXEA today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the integrated circuits inside, making the product long-lasting and reliable.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.2 V

Suitable for low-power applications, helping to conserve energy and reduce overall power consumption.

Package Shape: SQUARE

Optimal shape for efficient use of space on the circuit board, allowing for more compact designs.

No. of Terminals: 760

Provides a high level of connectivity options for various components, offering flexibility in circuit design.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, making it suitable for industrial applications where heat resistance is necessary.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold environments, expanding the range of possible use cases for the product.

Terminal Finish: TIN SILVER COPPER

Ensures good conductivity and corrosion resistance for reliable connections within the circuit.

Maximum Seated Height: 2.96 mm

Low profile design allows for installation in space-constrained applications without sacrificing performance.

Width: 23 mm

Compact width dimension enables the product to fit in tight spaces on the circuit board, optimizing layout designs.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and efficient soldering processes during assembly, saving time and enhancing manufacturing efficiency.

Peak Reflow Temperature °C: 250

Withstands high reflow temperatures during the soldering process, ensuring the product's reliability in harsh manufacturing conditions.

Temperature Grade: INDUSTRIAL

Meets the standards for industrial-grade components, guaranteeing high performance and reliability in demanding environments.

Peripheral IC Type: SYSTEM ON CHIP

Integration of multiple functions onto a single chip simplifies the design, reduces components, and enhances overall system efficiency.

Technology: CMOS

Provides low power consumption and high noise immunity, making the product energy-efficient and reliable for various applications.

Terminal Form: BALL

Ball terminals offer secure connections and facilitate efficient soldering during assembly, ensuring reliable electrical contacts.

Nominal Supply Voltage: 1.15 V

Optimal voltage level for efficient performance and power consumption, contributing to the product's overall energy efficiency.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density mounting on the circuit board, maximizing space utilization in the design.

Moisture Sensitivity Level (MSL): 3

Withstand moderate moisture exposure levels during storage and handling, ensuring product integrity and reliability in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM5716AABCXEA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.96 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5716AABCXEA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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