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AM5718AABCXQ1

Texas Instruments

AM5718AABCXQ1 by Texas Instruments

AM5718AABCXQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates at 1.11-1.2V, suitable for automotive applications. With 760 terminals in a GRID ARRAY package style, it offers high performance at temperatures ranging from -40 to 125°C.

Median Price

$80.200

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 601 parts In-Stock

1+ parts

$66.889

100+ parts

$59.456

1k+ parts

$43.718

10k+ parts

-

601

$66.889

$59.456

$43.718

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Mouser Electronics

USA . 507 parts In-Stock

1+ parts

$93.510

100+ parts

$71.540

1k+ parts

-

10k+ parts

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507

$93.510

$71.540

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$62.722

100+ parts

-

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-

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50

$62.722

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-

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Digiode

USA . 3,560 parts In-Stock

1+ parts

$63.545

100+ parts

-

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3,560

$63.545

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-

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VNN

France . 3,234 parts In-Stock

1+ parts

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3,234

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Vyrian

USA . 2,164 parts In-Stock

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2,164

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 515 parts In-Stock

1+ parts

$56.860

100+ parts

-

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515

$56.860

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-

-

Semicontronic

India . 202 parts In-Stock

1+ parts

$56.860

100+ parts

$55.438

1k+ parts

$55.154

10k+ parts

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202

$56.860

$55.438

$55.154

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Corphita

USA . 3,570 parts In-Stock

1+ parts

$60.200

100+ parts

-

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3,570

$60.200

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Continental Prestige Electronics

USA . 6,984 parts In-Stock

1+ parts

$62.722

100+ parts

-

1k+ parts

-

10k+ parts

$61.468

6,984

$62.722

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-

$61.468

Netroflash

USA . 100 parts In-Stock

1+ parts

$62.722

100+ parts

-

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100

$62.722

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Parana Technologies

USA . 1,528 parts In-Stock

1+ parts

$69.491

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1,528

$69.491

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DigiPath Technology Company

USA . 276 parts In-Stock

1+ parts

$76.518

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276

$76.518

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ChromeModa Solutions

Germany . 5,091 parts In-Stock

1+ parts

$78.080

100+ parts

$64.026

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5,091

$78.080

$64.026

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IDEA Electronic Components Group

UK . 298 parts In-Stock

1+ parts

$78.080

100+ parts

$74.176

1k+ parts

$70.272

10k+ parts

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298

$78.080

$74.176

$70.272

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Microchip USA

USA . 1,178 parts In-Stock

1+ parts

$137.710

100+ parts

$135.320

1k+ parts

$134.120

10k+ parts

$132.920

1,178

$137.710

$135.320

$134.120

$132.920

Lixinc

USA . 13,982 parts In-Stock

1+ parts

-

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13,982

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Argo Parts USA

USA . 1,029 parts In-Stock

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1,029

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Overview

Experience unmatched quality and reliability with the AM5718AABCXQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge solutions in the category of Other Function uPs,uCs & Peripheral ICs. This product offers incredible value and benefits to customers, with applications ranging from automotive to industrial settings. Trust Texas Instruments to provide you with top-of-the-line technology that pushes the boundaries of innovation. Choose the AM5718AABCXQ1 for unparalleled performance and efficiency in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.2 V

Operates efficiently with a low maximum supply voltage, reducing power consumption and heat generation.

Package Shape: SQUARE

Square package shape provides uniformity in design and easier positioning on the circuit board.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures without performance degradation, suitable for automotive and industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM5718AABCXQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.96 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5718AABCXQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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