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AM5718AABCXA

Texas Instruments

AM5718AABCXA by Texas Instruments

AM5718AABCXA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.11V to 1.2V. Ideal for industrial applications requiring high-speed processing in compact form factor.

Median Price

$46.405

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 612 parts In-Stock

1+ parts

$46.405

100+ parts

$41.249

1k+ parts

$30.330

10k+ parts

-

612

$46.405

$41.249

$30.330

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Mouser Electronics

USA . 9 parts In-Stock

1+ parts

$73.460

100+ parts

$54.550

1k+ parts

$51.910

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9

$73.460

$54.550

$51.910

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Chip1Stop

Japan . 120 parts In-Stock

1+ parts

-

100+ parts

$36.710

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-

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120

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$36.710

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,405 parts In-Stock

1+ parts

$44.085

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-

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2,405

$44.085

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Nova Conductors

Japan . 300 parts In-Stock

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$44.308

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300

$44.308

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-

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VNN

France . 20,350 parts In-Stock

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20,350

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Vyrian

USA . 8,321 parts In-Stock

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8,321

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Chip Stock

USA . 245 parts In-Stock

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245

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Distributors (Availability)

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AZTECH Wire

Italy . 515 parts In-Stock

1+ parts

$17.427

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-

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515

$17.427

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-

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Parana Technologies

USA . 1,353 parts In-Stock

1+ parts

$19.954

100+ parts

-

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$19.899

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1,353

$19.954

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$19.899

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DigiPath Technology Company

USA . 189 parts In-Stock

1+ parts

$21.972

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189

$21.972

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ChromeModa Solutions

Germany . 4,234 parts In-Stock

1+ parts

$22.420

100+ parts

$18.384

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4,234

$22.420

$18.384

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IDEA Electronic Components Group

UK . 830 parts In-Stock

1+ parts

$22.420

100+ parts

$21.299

1k+ parts

$20.178

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830

$22.420

$21.299

$20.178

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Semicontronic

India . 46 parts In-Stock

1+ parts

$31.200

100+ parts

$30.420

1k+ parts

$30.264

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46

$31.200

$30.420

$30.264

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Ampacity Inc.

Singapore . 19 parts In-Stock

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$31.200

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19

$31.200

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Corphita

USA . 3,222 parts In-Stock

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$41.764

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3,222

$41.764

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Continental Prestige Electronics

USA . 4,787 parts In-Stock

1+ parts

$42.198

100+ parts

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$41.354

4,787

$42.198

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-

$41.354

Aranea Global

USA . 100 parts In-Stock

1+ parts

$43.422

100+ parts

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1k+ parts

$41.685

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100

$43.422

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$41.685

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Lixinc

USA . 13,690 parts In-Stock

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13,690

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A-Z Elektronik GmbH

Germany . 351 parts In-Stock

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351

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Argo Parts USA

USA . 346 parts In-Stock

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346

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Perfect Parts

USA . 67 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the AM5718AABCXA, a top-of-the-line System on Chip peripheral IC. Designed for industrial-grade applications, this versatile square package offers 760 terminals in a compact grid array format. With a maximum supply voltage of 1.2V and operating temperatures ranging from -40°C to 105°C, this innovative product delivers reliability and performance. Trust Texas Instruments for quality and innovation in uPs and uCs, and elevate your project with the AM5718AABCXA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability while keeping the overall weight of the product low.

Surface Mount: YES

Enables easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.2 V

Allows for efficient power consumption, making it suitable for battery-operated devices.

Package Shape: SQUARE

Offers a compact design that saves space in electronic applications.

No. of Terminals: 760

Provides ample connection points for complex circuit integration.

Package Style: GRID ARRAY, FINE PITCH

Enhances signal integrity and reduces crosstalk in high-speed applications.

Minimum Supply Voltage: 1.11 V

Ensures reliable performance even under low voltage conditions.

Maximum Operating Temperature: 105 °C

Withstands high temperatures, making it ideal for industrial environments.

Minimum Operating Temperature: -40 °C

Functions reliably in extreme cold conditions, expanding its usability.

Terminal Finish: TIN SILVER COPPER

Enhances conductivity for improved signal transmission.

Terminal Position: BOTTOM

Facilitates easy access for soldering and connection in tight spaces.

Maximum Seated Height: 2.96 mm

Slim profile allows for compact device designs.

Width: 23 mm

Provides a balance between compactness and adequate space for terminal connections.

Maximum Time At Peak Reflow Temperature: 30s

Ensures proper soldering of the component without causing damage.

Peak Reflow Temperature: 250C

Supports high-temperature soldering processes for reliable connections.

Length: 23 mm

Offers a square form factor for symmetrical board layout and easy mounting.

Temperature Grade: INDUSTRIAL

Meets industry standards for robustness and reliability in harsh environments.

Peripheral IC Type: SYSTEM ON CHIP

Integration of multiple functions on a single chip simplifies circuit design and reduces component count.

Technology: CMOS

Utilizes low power consumption and fast switching speeds for efficient operation.

Terminal Form: BALL

Allows for precise alignment and soldering during assembly.

Nominal Supply Voltage: 1.15 V

Provides a stable voltage level for consistent performance.

Terminal Pitch: 0.8 mm

Offers a fine pitch for high-density board designs.

Moisture Sensitivity Level (MSL): 3

Indicates resistance to moisture during storage and handling.

Speed: 1500 rpm

Supports high-speed data processing and communication requirements.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM5718AABCXA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.96 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5718AABCXA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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