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MIMXRT1062CVJ5B

NXP Semiconductors

MIMXRT1062CVJ5B by NXP Semiconductors

The NXP MIMXRT1062CVJ5B is a SoC with CMOS technology. It operates b/w -40 to 105°C, with a supply voltage range of 1.15-1.26V. With 196 terminals in a low-profile grid array package, it's ideal for applications requiring high performance and compact design.

Median Price

$10.600

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 189 parts In-Stock

1+ parts

$10.600

100+ parts

$9.330

1k+ parts

$8.350

10k+ parts

-

189

$10.600

$9.330

$8.350

-

Arrow

USA . 405 parts In-Stock

1+ parts

$11.610

100+ parts

$8.951

1k+ parts

$7.786

10k+ parts

$7.546

405

$11.610

$8.951

$7.786

$7.546

Mouser Electronics

USA . 681 parts In-Stock

1+ parts

$13.610

100+ parts

$8.920

1k+ parts

$8.540

10k+ parts

-

681

$13.610

$8.920

$8.540

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DigiKey

USA . 638 parts In-Stock

1+ parts

$13.610

100+ parts

$9.984

1k+ parts

$8.542

10k+ parts

$8.360

638

$13.610

$9.984

$8.542

$8.360

EBV Elektronik

Germany . 20,979 parts In-Stock

1+ parts

-

100+ parts

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20,979

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Verical

USA . 2,646 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$9.000

10k+ parts

$8.723

2,646

-

-

$9.000

$8.723

Rochester

USA . 227 parts In-Stock

1+ parts

-

100+ parts

$7.330

1k+ parts

$6.560

10k+ parts

$6.180

227

-

$7.330

$6.560

$6.180

Future Electronics

Canada . 189 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.620

10k+ parts

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189

-

-

$6.620

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,221 parts In-Stock

1+ parts

$7.742

100+ parts

-

1k+ parts

-

10k+ parts

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2,221

$7.742

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$12.760

100+ parts

-

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-

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10

$12.760

-

-

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Anansix

USA . 2,487 parts In-Stock

1+ parts

-

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2,487

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Vyrian

USA . 729 parts In-Stock

1+ parts

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729

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NAC Semi

USA . 378 parts In-Stock

1+ parts

-

100+ parts

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$10.600

10k+ parts

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378

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-

$10.600

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IBS Electronics

USA . 189 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.671

10k+ parts

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189

-

-

$8.671

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 701 parts In-Stock

1+ parts

$6.930

100+ parts

-

1k+ parts

-

10k+ parts

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701

$6.930

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-

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Semicontronic

India . 302 parts In-Stock

1+ parts

$6.930

100+ parts

$6.757

1k+ parts

$6.722

10k+ parts

-

302

$6.930

$6.757

$6.722

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Corphita

USA . 3,443 parts In-Stock

1+ parts

$7.335

100+ parts

-

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3,443

$7.335

-

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Continental Prestige Electronics

USA . 3,349 parts In-Stock

1+ parts

$12.170

100+ parts

-

1k+ parts

-

10k+ parts

$11.927

3,349

$12.170

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-

$11.927

Netroflash

USA . 100 parts In-Stock

1+ parts

$12.760

100+ parts

-

1k+ parts

-

10k+ parts

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100

$12.760

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-

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Corohmni

South Africa . 243 parts In-Stock

1+ parts

$19.401

100+ parts

-

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243

$19.401

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Modulus Dynamics

Lithuania . 3,881 parts In-Stock

1+ parts

$25.131

100+ parts

$25.131

1k+ parts

$25.131

10k+ parts

-

3,881

$25.131

$25.131

$25.131

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$46.542

100+ parts

$44.215

1k+ parts

$44.215

10k+ parts

-

5,000

$46.542

$44.215

$44.215

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Microchip USA

USA . 7,880 parts In-Stock

1+ parts

$50.792

100+ parts

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7,880

$50.792

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Aztec Data Supply Inc.

USA . 2,124 parts In-Stock

1+ parts

$65.050

100+ parts

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2,124

$65.050

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Futuretech Components

Singapore . 30,240 parts In-Stock

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30,240

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QUARKTWIN TECHNOLOGY LTD

USA . 19,576 parts In-Stock

1+ parts

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19,576

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Argo Parts USA

USA . 3,669 parts In-Stock

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3,669

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UNI Independent Distributors

Spain . 2,635 parts In-Stock

1+ parts

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2,635

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Robosynatics

Brazil . 1,659 parts In-Stock

1+ parts

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100+ parts

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1,659

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Lucentia Tech

USA . 1,659 parts In-Stock

1+ parts

-

100+ parts

$21.862

1k+ parts

$21.416

10k+ parts

$21.416

1,659

-

$21.862

$21.416

$21.416

Overview

Elevate your projects with the cutting-edge MIMXRT1062CVJ5B by NXP Semiconductors, a top-tier manufacturer known for delivering high-quality solutions. This versatile product falls under the category of Other Function uPs, uCs & Peripheral ICs, offering endless possibilities for innovation. With its advanced technology and superior performance, this SoC is a game-changer in the industry. From its sleek design to its impressive features, the MIMXRT1062CVJ5B is designed to exceed expectations and provide unparalleled value to customers seeking top-notch solutions for their projects. Experience the difference with NXP Semiconductors' groundbreaking product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good protection to the internal components of the product, making it durable and reliable.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving both time and labor costs during production.

Maximum Supply Voltage: 1.26 V

High maximum supply voltage of 1.26V ensures stable operation and performance of the product under varying voltage conditions.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, making it ideal for compact designs and applications.

No. of Terminals: 196

Having a large number of terminals (196) provides flexibility in connecting various external components, enabling versatile functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style ensures high-density packing and efficient heat dissipation, making it suitable for high-performance applications.

Minimum Supply Voltage: 1.15 V

Low minimum supply voltage of 1.15V allows for energy-efficient operation and extends the product's battery life in portable devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105°C ensures reliable performance in harsh environmental conditions, increasing the product's durability and longevity.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature (-40°C) allows the product to function in extreme cold conditions, making it suitable for various applications.

Terminal Finish: TIN SILVER

Tin silver terminal finish provides good electrical conductivity, corrosion resistance, and solderability, ensuring reliable connections and longevity of the product.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and assembly, making it convenient for manufacturers during production.

Maximum Seated Height: 1.52 mm

Low maximum seated height of 1.52mm allows for slim and compact designs, ideal for space-constrained applications.

Width: 12 mm

Moderate width of 12mm provides a balance between space efficiency and ease of handling during installation, making the product versatile in various applications.

Maximum Time At Peak Reflow Temperature (s): 40

Maximum time at peak reflow temperature of 40 seconds ensures proper soldering and reflow process during manufacturing, reducing the risk of defects and improving product reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper solder melting and reflow process, resulting in strong and reliable solder joints for the product.

Length: 12 mm

Moderate length of 12mm provides a balanced form factor, allowing for efficient PCB layout and component placement, making it suitable for various applications.

Peripheral IC Type: SoC

System on Chip (SoC) peripheral IC type integrates multiple functions into a single chip, reducing component count and enhancing performance and efficiency of the product.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology ensures low power consumption, high noise immunity, and high speed performance, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides good electrical connections, mechanical strength, and reliability, ensuring proper signal transmission and durability of the product.

Terminal Pitch: 0.8 mm

Small terminal pitch of 0.8mm allows for high-density packaging and compact PCB design, suitable for space-constrained and portable applications.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level (MSL) 3 indicates that the product can withstand standard moisture exposure levels during storage and production, ensuring proper functionality and reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMXRT1062CVJ5B attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e2

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.52 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMXRT1062CVJ5B Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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