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XAZU2EG-1SFVC784I

Xilinx

XAZU2EG-1SFVC784I by Xilinx

Xilinx XAZU2EG-1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature range from -40 to 100 °C. The package style is GRID ARRAY, FINE PITCH, making it suitable for various applications requiring high performance and reliability.

Median Price

$436.000

Lifecycle Status

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Mouser Electronics

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DigiKey

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Digiode

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MARBEL Systems

Belgium . 727 parts In-Stock

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Corohmni

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Modulus Dynamics

Lithuania . 1,688 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

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Vigor

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One Stop Electronics

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Ampacity Inc.

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Semicontronic

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Corphita

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Microchip USA

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Overview

Unlock unparalleled performance and reliability with the XAZU2EG-1SFVC784I by Xilinx. As a leader in the industry, Xilinx delivers top-notch quality and cutting-edge technology to meet the demands of various applications. This MICROPROCESSOR CIRCUIT offers unmatched value and benefits, providing customers with the advantage of enhanced functionality and efficiency. Whether you're looking to optimize your system or boost performance, the XAZU2EG-1SFVC784I is the perfect solution for all your needs. Elevate your projects to new heights with this innovative product from Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package, making it ideal for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing manufacturing costs.

No. of Terminals: 784

With a high number of terminals, this product provides ample connectivity options for interfacing with other components and peripherals.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature makes this product suitable for industrial applications where elevated temperatures are common.

Terminal Finish: TIN SILVER COPPER

The use of tin silver copper terminal finish ensures good conductivity and reliability for long-term use.

Width: 23 mm

Compact width dimensions allow for efficient use of space on a circuit board and enable a smaller overall product footprint.

Nominal Supply Voltage: 0.85 V

The low nominal supply voltage of 0.85 V results in reduced power consumption and heat generation, making it energy-efficient.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XAZU2EG-1SFVC784I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

3.32 mm

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

XAZU2EG-1SFVC784I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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