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XAZU3EG-1SFVC784Q

Xilinx

XAZU3EG-1SFVC784Q by Xilinx

Xilinx XAZU3EG-1SFVC784Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. Featuring 784 terminals in a GRID ARRAY package style, it has a terminal pitch of 0.8 mm and nominal voltage of 0.85 V.

Median Price

$1,162.317

Lifecycle Status

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6

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Digiode

USA . 286 parts In-Stock

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VNN

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Nova Conductors

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Corohmni

South Africa . 113 parts In-Stock

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MARBEL Systems

Belgium . 3,033 parts In-Stock

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Texas Native Microelectronics

USA . 975 parts In-Stock

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$53.028

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$51.371

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Modulus Dynamics

Lithuania . 519 parts In-Stock

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Kenton Components

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Vigor

Singapore . 880 parts In-Stock

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Microchip USA

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One Stop Electronics

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Ampacity Inc.

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Semicontronic

India . 3 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Qasali Group International

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Overview

Discover the cutting-edge XAZU3EG-1SFVC784Q by Xilinx, a top-tier manufacturer known for superior quality and innovation in the realm of Other Function uPs, uCs & Peripheral ICs. This advanced product offers unmatched performance and reliability, making it ideal for a wide range of applications in automotive technology and beyond. With its high-tech features and robust design, this MICROPROCESSOR CIRCUIT will elevate your projects to new heights, providing exceptional value and benefits to customers seeking top-notch components for their electronic creations. Upgrade your technology with Xilinx today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the integrated circuits inside the package.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and facilitating mass production.

Package Shape: SQUARE

Square shape makes it easier to align and place on circuit boards, ensuring compatibility with standard board designs.

No. of Terminals: 784

High number of terminals allows for complex connections and functionalities within the integrated circuits.

Maximum Operating Temperature: 125 °C

Can operate efficiently in high temperature environments, suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable performance in extreme cold conditions as well.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance, ensuring long-term reliability of connections.

Terminal Position: BOTTOM

Facilitates easy and secure mounting on circuit boards, ensuring stable connections.

Maximum Seated Height: 3.32 mm

Low profile design saves space and allows for compact system design.

Width: 23 mm

Standard width for easy integration into various circuit board layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures quick and efficient soldering process during assembly.

Peak Reflow Temperature °C: 250

High peak reflow temperature allows for reliable soldering and strong connections.

Length: 23 mm

Standard length for easy integration into various circuit board layouts.

Temperature Grade: AUTOMOTIVE

Specifically designed and tested for automotive applications, ensuring reliability under harsh conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Includes advanced microprocessor circuitry for high performance computing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, suitable for various applications.

Terminal Form: BALL

Ball terminals provide reliable and robust connections for long-term usage.

Nominal Supply Voltage: 0.85 V

Low nominal supply voltage allows for energy-efficient operation and longer battery life.

Terminal Pitch: 0.8 mm

Fine pitch terminal spacing allows for more terminals in a compact package, enabling complex circuit designs.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates good resistance to moisture, suitable for various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XAZU3EG-1SFVC784Q attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

3.32 mm

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

XAZU3EG-1SFVC784Q Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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