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66AK2L06XCMSA

Texas Instruments

66AK2L06XCMSA by Texas Instruments

The Texas Instruments 66AK2L06XCMSA is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.1V. This IC, in GRID ARRAY package style, is ideal for industrial applications requiring high performance and reliability.

Median Price

$646.985

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 208 parts In-Stock

1+ parts

$493.350

100+ parts

$446.567

1k+ parts

$425.302

10k+ parts

-

208

$493.350

$446.567

$425.302

-

Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$800.620

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$800.620

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 946 parts In-Stock

1+ parts

$468.682

100+ parts

-

1k+ parts

-

10k+ parts

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946

$468.682

-

-

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Vyrian

USA . 5,144 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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5,144

-

-

-

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VNN

France . 915 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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915

-

-

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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450

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 4,984 parts In-Stock

1+ parts

$72.970

100+ parts

-

1k+ parts

-

10k+ parts

-

4,984

$72.970

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-

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Parana Technologies

USA . 431 parts In-Stock

1+ parts

$73.347

100+ parts

-

1k+ parts

-

10k+ parts

-

431

$73.347

-

-

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DigiPath Technology Company

USA . 2,080 parts In-Stock

1+ parts

$80.764

100+ parts

-

1k+ parts

-

10k+ parts

-

2,080

$80.764

-

-

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ChromeModa Solutions

Germany . 6,786 parts In-Stock

1+ parts

$82.412

100+ parts

$67.578

1k+ parts

-

10k+ parts

-

6,786

$82.412

$67.578

-

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IDEA Electronic Components Group

UK . 2,084 parts In-Stock

1+ parts

$82.412

100+ parts

$78.291

1k+ parts

$74.171

10k+ parts

-

2,084

$82.412

$78.291

$74.171

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Ampacity Inc.

Singapore . 105 parts In-Stock

1+ parts

$419.350

100+ parts

-

1k+ parts

-

10k+ parts

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105

$419.350

-

-

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Microchip USA

USA . 2,470 parts In-Stock

1+ parts

$432.280

100+ parts

$416.560

1k+ parts

$408.700

10k+ parts

$400.840

2,470

$432.280

$416.560

$408.700

$400.840

Corphita

USA . 168 parts In-Stock

1+ parts

$444.015

100+ parts

-

1k+ parts

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10k+ parts

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168

$444.015

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,000

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Netroflash

USA . 50 parts In-Stock

1+ parts

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50

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Overview

Experience the next level of performance and efficiency with the 66AK2L06XCMSA by Texas Instruments. Crafted with precision and expertise, this advanced microprocessor circuit offers unparalleled reliability and versatility for a wide range of applications. From cutting-edge industrial automation to innovative smart devices, this high-quality IC delivers superior functionality and seamless integration. Trust in Texas Instruments to bring you the best in technology, providing value and benefits that exceed expectations. Elevate your projects with the 66AK2L06XCMSA and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good thermal and electrical insulation, ensuring the reliability and durability of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing costs.

Maximum Supply Voltage: 1.1 V

A high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Package Shape: SQUARE

The square shape of the package enhances space efficiency and ease of PCB layout.

No. of Terminals: 900

Having a large number of terminals enables the product to interface with a wide range of external devices and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch design make soldering and connection of the device more precise and reliable.

Minimum Supply Voltage: 0.95 V

With a low minimum supply voltage, the product can operate efficiently even in low-power scenarios.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows the product to function in extreme cold environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of these quality finishes on terminals ensures good conductivity and corrosion resistance for long-term performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure mounting on the PCB.

Maximum Seated Height: 3.55 mm

The low profile of the product allows for compact and slim device designs.

Width: 25 mm

The compact width of the product enables space-saving integration on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and efficient soldering during manufacturing processes.

Peak Reflow Temperature °C: 245

The high peak reflow temperature allows for reliable and strong solder joints for robust connections.

Length: 25 mm

The compact length of the product complements the overall space efficiency of the design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product's reliability and performance in demanding industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities for advanced functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: BALL

The ball terminal form provides strong and reliable connections for seamless integration into the system.

Nominal Supply Voltage: 1.05 V

The nominal supply voltage ensures stable and consistent power delivery for optimal performance.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for high-density mounting, enabling more functionality in a smaller footprint.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level indicates the level of protection against moisture-related damage, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs 66AK2L06XCMSA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Length:

25 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.55 mm

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

66AK2L06XCMSA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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