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66AK2G12ABYA100E

Texas Instruments

66AK2G12ABYA100E by Texas Instruments

The Texas Instruments 66AK2G12ABYA100E is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.95V to 1.05V. With 625 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring low profile and fine pitch components.

Median Price

$83.982

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 208 parts In-Stock

1+ parts

$70.043

100+ parts

$62.261

1k+ parts

$45.780

10k+ parts

-

208

$70.043

$62.261

$45.780

-

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$97.920

100+ parts

$74.830

1k+ parts

-

10k+ parts

-

4

$97.920

$74.830

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,433 parts In-Stock

1+ parts

$66.541

100+ parts

-

1k+ parts

-

10k+ parts

-

2,433

$66.541

-

-

-

Vyrian

USA . 4,404 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,404

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 611 parts In-Stock

1+ parts

$19.223

100+ parts

-

1k+ parts

-

10k+ parts

-

611

$19.223

-

-

-

Northwest PG Solutions

USA . 653 parts In-Stock

1+ parts

$21.145

100+ parts

$19.030

1k+ parts

-

10k+ parts

-

653

$21.145

$19.030

-

-

Parana Technologies

USA . 1,933 parts In-Stock

1+ parts

$42.546

100+ parts

$3,951.083

1k+ parts

$38.292

10k+ parts

-

1,933

$42.546

$3,951.083

$38.292

-

DigiPath Technology Company

USA . 1,949 parts In-Stock

1+ parts

$46.849

100+ parts

$43.101

1k+ parts

-

10k+ parts

-

1,949

$46.849

$43.101

-

-

ChromeModa Solutions

Germany . 5,566 parts In-Stock

1+ parts

$47.805

100+ parts

$39.200

1k+ parts

-

10k+ parts

-

5,566

$47.805

$39.200

-

-

IDEA Electronic Components Group

UK . 428 parts In-Stock

1+ parts

$47.805

100+ parts

$45.415

1k+ parts

$43.024

10k+ parts

-

428

$47.805

$45.415

$43.024

-

Corphita

USA . 2,263 parts In-Stock

1+ parts

$63.039

100+ parts

-

1k+ parts

-

10k+ parts

-

2,263

$63.039

-

-

-

Corohmni

South Africa . 190 parts In-Stock

1+ parts

$70.112

100+ parts

-

1k+ parts

-

10k+ parts

-

190

$70.112

-

-

-

Microchip USA

USA . 1,578 parts In-Stock

1+ parts

$157.390

100+ parts

$154.660

1k+ parts

$153.290

10k+ parts

$151.920

1,578

$157.390

$154.660

$153.290

$151.920

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

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Overview

Elevate your electronics projects with the 66AK2G12ABYA100E by Texas Instruments. Known for their top-notch quality and cutting-edge technology, Texas Instruments delivers another exceptional product in the category of Other Function uPs,uCs & Peripheral ICs. This versatile chip offers a wide range of applications, from IoT devices to automotive systems. With its low profile, fine pitch design and industrial-grade temperature grade, this system on chip provides unmatched performance and reliability. Upgrade your projects today with the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components as it is durable and resistant to heat, making it a reliable choice for this product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.05 V

Provides flexibility in powering the product within a safe voltage range, allowing for reliable performance.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board, optimizing the layout and design.

No. of Terminals: 625

With a high number of terminals, this product can support complex circuit designs and functions, making it versatile for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact size, low profile design, and fine pitch layout, which is ideal for dense circuitry and high-performance applications.

Minimum Supply Voltage: 0.95 V

With a low minimum supply voltage, this product is energy efficient and can operate effectively even with low power sources.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, ensuring reliability in harsh environmental conditions or under heavy use.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity, corrosion resistance, and solderability, promoting long-lasting performance.

Terminal Position: BOTTOM

The terminals positioned at the bottom facilitate easy connection to the circuit board, simplifying assembly and improving overall reliability.

Maximum Seated Height: 1.56 mm

With a low seated height, this product can fit into compact devices or applications where space is limited.

Width: 21 mm

The width of 21 mm offers a balance between size and functionality, making this product suitable for various integration and mounting options.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand a peak reflow temperature for up to 30 seconds, allowing for robust soldering and assembly processes without compromising the product's performance.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliability during the manufacturing process, enhancing the product's quality.

Length: 21 mm

The length of 21 mm complements the square shape of the package, making it suitable for compact applications while still providing ample space for terminal connections.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product can operate efficiently in rugged environments and withstand challenging conditions.

Peripheral IC Type: SYSTEM ON CHIP

Being a system-on-chip (SoC) design, this product integrates multiple functions into a single chip, reducing costs, complexity, and power consumption while enhancing performance.

Technology: CMOS

Utilizing Complementary Metal-Oxide-Semiconductor (CMOS) technology, this product offers low power consumption, high noise immunity, and compatibility with a wide range of devices.

Terminal Form: BALL

The ball terminal form provides reliable and secure connections, ensuring proper contact with the circuit board for stable operation.

Nominal Supply Voltage: 1 V

With a nominal supply voltage of 1V, this product is optimized for efficient power consumption and performance, suitable for a wide range of applications.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8 mm allows for high-density mounting and precise connections, enabling complex circuit designs and compact layouts.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level of 3, this product can withstand typical storage and assembly conditions without compromising its reliability or performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs 66AK2G12ABYA100E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

625

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.56 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

66AK2G12ABYA100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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