Loading...

66AK2G12ABYT100

Texas Instruments

66AK2G12ABYT100 by Texas Instruments

66AK2G12ABYT100 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 0.95V to 1.05V, making it ideal for automotive applications. This package features a grid array with 625 terminals in a low profile, fine pitch design for surface mount assembly.

Median Price

$97.690

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 179 parts In-Stock

1+ parts

$63.657

100+ parts

$56.584

1k+ parts

$41.606

10k+ parts

-

179

$63.657

$56.584

$41.606

-

DigiKey

USA . 32 parts In-Stock

1+ parts

$97.690

100+ parts

$74.821

1k+ parts

$72.945

10k+ parts

-

32

$97.690

$74.821

$72.945

-

Mouser Electronics

USA . 20 parts In-Stock

1+ parts

$97.690

100+ parts

$74.830

1k+ parts

-

10k+ parts

-

20

$97.690

$74.830

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,060 parts In-Stock

1+ parts

$60.474

100+ parts

-

1k+ parts

-

10k+ parts

-

4,060

$60.474

-

-

-

Vyrian

USA . 8,286 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,286

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,220 parts In-Stock

1+ parts

$27.109

100+ parts

-

1k+ parts

$32.350

10k+ parts

-

2,220

$27.109

-

$32.350

-

DigiPath Technology Company

USA . 2,313 parts In-Stock

1+ parts

$29.850

100+ parts

$27.462

1k+ parts

-

10k+ parts

-

2,313

$29.850

$27.462

-

-

ChromeModa Solutions

Germany . 6,662 parts In-Stock

1+ parts

$30.459

100+ parts

$24.976

1k+ parts

-

10k+ parts

-

6,662

$30.459

$24.976

-

-

IDEA Electronic Components Group

UK . 211 parts In-Stock

1+ parts

$30.459

100+ parts

$28.936

1k+ parts

$27.413

10k+ parts

-

211

$30.459

$28.936

$27.413

-

Native Components

USA . 627 parts In-Stock

1+ parts

$42.510

100+ parts

-

1k+ parts

-

10k+ parts

$40.810

627

$42.510

-

-

$40.810

Corohmni

South Africa . 2,143 parts In-Stock

1+ parts

$43.385

100+ parts

-

1k+ parts

-

10k+ parts

-

2,143

$43.385

-

-

-

Northwest PG Solutions

USA . 1,575 parts In-Stock

1+ parts

$46.761

100+ parts

-

1k+ parts

-

10k+ parts

-

1,575

$46.761

-

-

-

Corphita

USA . 1,177 parts In-Stock

1+ parts

$57.291

100+ parts

-

1k+ parts

-

10k+ parts

-

1,177

$57.291

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

iodParts Technologies Inc.

India . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

360

-

-

-

-

Overview

Elevate your projects to the next level with the Texas Instruments 66AK2G12ABYT100. Known for their superior quality, Texas Instruments delivers top-notch performance in the realm of Other Function uPs,uCs & Peripheral ICs. This versatile chip, housed in a durable PLASTIC/EPOXY package, is perfect for automotive applications. With a wide temperature range and low profile design, this chip offers reliability and efficiency in every use. Experience the value and benefits of Texas Instruments technology with the 66AK2G12ABYT100.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and reliability, making the product suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing overall production costs.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage allows for flexibility in power requirements and compatibility with different systems.

Package Shape: SQUARE

Square package shape provides a compact design, maximizing space utilization on circuit boards.

No. of Terminals: 625

With a high number of terminals, this product offers extensive connectivity options and functionality for versatile applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style provides high density and efficient performance in a small form factor.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures energy efficiency and compatibility with lower power systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range allows for reliable performance in elevated temperature environments.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range enables the product to function in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The triple terminal finish provides excellent conductivity, corrosion resistance, and solderability for long-lasting performance.

Terminal Position: BOTTOM

Bottom terminal position offers straightforward installation and efficient connection to circuit boards.

Maximum Seated Height: 1.56 mm

Low maximum seated height contributes to a slim and compact design, ideal for space-constrained applications.

Width: 21 mm

A moderate width size enables easy integration into various circuit board layouts.

Maximum Time At Peak Reflow Temperature (s): 30

30-second maximum time at peak reflow temperature ensures proper soldering and reliable connections during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures efficient soldering and a strong bond between the product and circuit board.

Length: 21 mm

A compact length size facilitates flexible placement and integration into different electronic devices.

Temperature Grade: AUTOMOTIVE

Built to automotive-grade standards, ensuring reliability and performance under harsh operating conditions in vehicles.

Peripheral IC Type: SYSTEM ON CHIP

System-on-Chip design integrates multiple functions into a single IC, reducing complexity and enhancing overall system efficiency.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable operation, making the product energy-efficient and robust.

Terminal Form: BALL

Ball terminal form provides secure contacts and easy connection to circuit boards during assembly.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent and reliable performance in various operating conditions.

Terminal Pitch: 0.8 mm

Narrow terminal pitch enhances connectivity options and enables high-density integration on circuit boards.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, allowing for safe and reliable storage and handling of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs 66AK2G12ABYT100 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

625

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.56 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

66AK2G12ABYT100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 10