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66AK2L06XCMS2

Texas Instruments

66AK2L06XCMS2 by Texas Instruments

The Texas Instruments 66AK2L06XCMS2 is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.1V. Ideal for applications requiring high performance in a compact GRID ARRAY package.

Median Price

$850.475

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,661 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,661

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Digiode

USA . 2,627 parts In-Stock

1+ parts

-

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-

1k+ parts

-

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2,627

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-

-

-

TME

Poland . 44 parts In-Stock

1+ parts

-

100+ parts

$850.475

1k+ parts

-

10k+ parts

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44

-

$850.475

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 325 parts In-Stock

1+ parts

$4.993

100+ parts

-

1k+ parts

-

10k+ parts

-

325

$4.993

-

-

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Parana Technologies

USA . 993 parts In-Stock

1+ parts

$13.338

100+ parts

-

1k+ parts

$13.851

10k+ parts

-

993

$13.338

-

$13.851

-

ChromeModa Solutions

Germany . 981 parts In-Stock

1+ parts

$14.986

100+ parts

$12.289

1k+ parts

-

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981

$14.986

$12.289

-

-

IDEA Electronic Components Group

UK . 808 parts In-Stock

1+ parts

$14.986

100+ parts

$14.237

1k+ parts

$13.487

10k+ parts

-

808

$14.986

$14.237

$13.487

-

One Stop Electronics

USA . 706 parts In-Stock

1+ parts

$18.000

100+ parts

-

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10k+ parts

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706

$18.000

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Native Components

USA . 325 parts In-Stock

1+ parts

$21.994

100+ parts

-

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325

$21.994

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Corohmni

South Africa . 74 parts In-Stock

1+ parts

$23.370

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-

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74

$23.370

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Northwest PG Solutions

USA . 814 parts In-Stock

1+ parts

$24.193

100+ parts

$21.774

1k+ parts

-

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814

$24.193

$21.774

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-

Advanced Electronics

New Zealand . 34 parts In-Stock

1+ parts

$46.559

100+ parts

$42.369

1k+ parts

$38.178

10k+ parts

-

34

$46.559

$42.369

$38.178

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Microchip USA

USA . 2,925 parts In-Stock

1+ parts

$424.510

100+ parts

$409.070

1k+ parts

$401.350

10k+ parts

$393.630

2,925

$424.510

$409.070

$401.350

$393.630

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Corphita

USA . 1,314 parts In-Stock

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1,314

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DigiPath Technology Company

USA . 77 parts In-Stock

1+ parts

-

100+ parts

$13.511

1k+ parts

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10k+ parts

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77

-

$13.511

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Component Stockers USA

USA . 41 parts In-Stock

1+ parts

-

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41

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Overview

Experience the seamless performance and cutting-edge technology of the 66AK2L06XCMS2 by Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers exceptional solutions in the category of Other Function uPs, uCs & Peripheral ICs. This versatile product offers a wide range of applications, providing value and benefits to customers looking for reliable and efficient microprocessor circuits. Trust Texas Instruments to deliver superior performance and unmatched reliability with the 66AK2L06XCMS2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 1.1 V

Operates efficiently within a moderate supply voltage range.

Package Shape: SQUARE

Square package shape ensures a compact design and efficient use of space.

No. of Terminals: 900

High number of terminals allow for a wide range of connectivity options.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch enhances the overall performance and reliability of the product.

Minimum Supply Voltage: 0.95 V

Can operate at lower supply voltages, improving energy efficiency.

Maximum Operating Temperature: 100 °C

Capable of operating at high temperatures without compromising performance.

Minimum Operating Temperature: 0 °C

Can function effectively in a wide temperature range.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Provides excellent corrosion resistance and ensures reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy integration with other components on the PCB.

Maximum Seated Height: 3.55 mm

Low profile design for compact product packaging.

Width: 25 mm

Optimal width for fitting into standard PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time reduces the risk of component damage during assembly.

Peak Reflow Temperature °C: 245

Withstands high reflow temperatures for reliable soldering.

Length: 25 mm

Compact length for space-saving design.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit enhances the overall functionality and processing capabilities of the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form allows for reliable and secure connections.

Nominal Supply Voltage: 1.05 V

Nominal supply voltage suited for optimal performance.

Terminal Pitch: 0.8 mm

Fine terminal pitch for high-density connectivity.

Moisture Sensitivity Level (MSL): 4

MSL level indicates the product's resistance to moisture and humidity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs 66AK2L06XCMS2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Length:

25 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.55 mm

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

66AK2L06XCMS2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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