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SCANSTA111SMX/NOPB

Texas Instruments

SCANSTA111SMX/NOPB by Texas Instruments

SCANSTA111SMX/NOPB by Texas Instruments is a MICROPROCESSOR CIRCUIT with 49 terminals, operating at 3.3V. It features a GRID ARRAY package style, suitable for industrial applications. With a low profile and fine pitch design, it can handle temperatures from -40 to 85°C efficiently.

Median Price

$9.115

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 57,028 parts In-Stock

1+ parts

$9.115

100+ parts

$7.431

1k+ parts

$4.954

10k+ parts

-

57,028

$9.115

$7.431

$4.954

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 534 parts In-Stock

1+ parts

$8.659

100+ parts

-

1k+ parts

-

10k+ parts

-

534

$8.659

-

-

-

Vyrian

USA . 2,166 parts In-Stock

1+ parts

$9.115

100+ parts

-

1k+ parts

-

10k+ parts

-

2,166

$9.115

-

-

-

Bristol Electronics

USA . 10 parts In-Stock

1+ parts

$18.000

100+ parts

-

1k+ parts

-

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10

$18.000

-

-

-

Anansix

USA . 2,713 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,713

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-

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Microfarads

USA . 9 parts In-Stock

1+ parts

-

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-

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9

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 460 parts In-Stock

1+ parts

$4.764

100+ parts

-

1k+ parts

-

10k+ parts

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460

$4.764

-

-

-

Corphita

USA . 4,049 parts In-Stock

1+ parts

$8.204

100+ parts

-

1k+ parts

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4,049

$8.204

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Parana Technologies

USA . 1,765 parts In-Stock

1+ parts

$72.195

100+ parts

-

1k+ parts

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10k+ parts

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1,765

$72.195

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-

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DigiPath Technology Company

USA . 1,908 parts In-Stock

1+ parts

$79.496

100+ parts

$73.136

1k+ parts

-

10k+ parts

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1,908

$79.496

$73.136

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ChromeModa Solutions

Germany . 1,505 parts In-Stock

1+ parts

$81.118

100+ parts

$66.517

1k+ parts

-

10k+ parts

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1,505

$81.118

$66.517

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IDEA Electronic Components Group

UK . 209 parts In-Stock

1+ parts

$81.118

100+ parts

$77.062

1k+ parts

$73.006

10k+ parts

-

209

$81.118

$77.062

$73.006

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

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Perfect Parts

USA . 4,395 parts In-Stock

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4,395

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Overview

Discover the SCANSTA111SMX/NOPB by Texas Instruments, a top-quality product in the category of Other Function uPs, uCs & Peripheral ICs. With a focus on excellence and innovation, Texas Instruments delivers cutting-edge solutions for a wide range of applications. This versatile product boasts unmatched value, offering customers numerous benefits and advantages. Whether you're looking to enhance your industrial processes or streamline your electronic devices, the SCANSTA111SMX/NOPB is the perfect choice for all your needs. Unlock the potential of this remarkable technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, the product can handle a wide range of input power sources.

Package Shape: SQUARE

The square package shape offers efficient use of space on a circuit board.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable performance of the product.

No. of Terminals: 49

The high number of terminals provides versatile connectivity options for various peripheral devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style allows for compact and efficient circuit board design.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes the product suitable for industrial use in challenging environments.

Minimum Operating Temperature: -40 °C

The product can operate in extremely low temperatures, making it versatile for different applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance for a reliable connection.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure mounting onto a circuit board.

Maximum Seated Height: 1.5 mm

Low seated height helps in maintaining a slim profile for the overall product.

Width: 7 mm

Compact width enables easy placement and integration into circuit board layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand a peak reflow temperature for a sufficient duration during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robust soldering during manufacturing.

Length: 7 mm

Short length of the product allows for space-efficient placement on circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, the product offers advanced processing capabilities for various applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology provides low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form enables easy rework and reliable solder joints.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage at 3.3V ensures consistent performance of the product.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting on circuit boards.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates that the product can withstand multiple reflows during manufacturing without degradation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SCANSTA111SMX/NOPB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B49

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

SCANSTA111SMX/NOPB Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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