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VCBUP7CT7

Texas Instruments

VCBUP7CT7 by Texas Instruments

VCBUP7CT7 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 529 terminals in a GRID ARRAY package. It operates b/w 0-85 °C and has a supply voltage range of 1.14-1.26 V, making it suitable for various applications requiring high performance and reliability in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,860 parts In-Stock

1+ parts

-

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3,860

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Digiode

USA . 3,693 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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3,693

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 240 parts In-Stock

1+ parts

$9.677

100+ parts

-

1k+ parts

-

10k+ parts

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240

$9.677

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One Stop Electronics

USA . 580 parts In-Stock

1+ parts

$15.000

100+ parts

-

1k+ parts

-

10k+ parts

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580

$15.000

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$22.462

100+ parts

$20.440

1k+ parts

$18.419

10k+ parts

-

1,000

$22.462

$20.440

$18.419

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Corohmni

South Africa . 31 parts In-Stock

1+ parts

$42.945

100+ parts

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31

$42.945

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Parana Technologies

USA . 116 parts In-Stock

1+ parts

$47.290

100+ parts

$4,391.608

1k+ parts

$42.561

10k+ parts

-

116

$47.290

$4,391.608

$42.561

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DigiPath Technology Company

USA . 1,304 parts In-Stock

1+ parts

$52.072

100+ parts

-

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10k+ parts

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1,304

$52.072

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ChromeModa Solutions

Germany . 3,151 parts In-Stock

1+ parts

$53.135

100+ parts

$43.571

1k+ parts

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3,151

$53.135

$43.571

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IDEA Electronic Components Group

UK . 61 parts In-Stock

1+ parts

$53.135

100+ parts

$50.478

1k+ parts

$47.822

10k+ parts

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61

$53.135

$50.478

$47.822

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Component Stockers USA

USA . 708 parts In-Stock

1+ parts

$99.990

100+ parts

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708

$99.990

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Microchip USA

USA . 2,676 parts In-Stock

1+ parts

$156.180

100+ parts

$152.010

1k+ parts

$149.930

10k+ parts

$147.850

2,676

$156.180

$152.010

$149.930

$147.850

Corphita

USA . 4,022 parts In-Stock

1+ parts

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4,022

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Overview

Discover the innovative VCBUP7CT7 by Texas Instruments, a cutting-edge product in the category of Other Function uPs,uCs & Peripheral ICs. Manufactured with top-quality materials and advanced technology, this device offers unmatched performance and reliability. With its compact design and high level of functionality, it is perfect for a wide range of applications. Experience the value and benefits this product brings to your projects, from increased efficiency to enhanced capabilities. Trust in Texas Instruments for superior quality and elevate your work to new heights with the VCBUP7CT7.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, saving space in electronic devices.

Maximum Supply Voltage: 1.26 V

This high supply voltage allows for reliable and stable performance under various operating conditions.

Package Shape: SQUARE

The square shape of the package provides a uniform and easy-to-handle design for installation and mounting purposes.

No. of Terminals: 529

Having a large number of terminals enables greater connectivity options and versatility in circuit design.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array style combined with a heat sink/slub design helps to dissipate heat efficiently, improving overall performance and reliability.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and energy-efficient operation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and extended usage without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable performance even in cold environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

The bottom terminal position makes it easy to connect and integrate the product into various electronic systems.

Maximum Seated Height: 3.3 mm

The low seated height allows for compact and slim device designs, especially where space is limited.

Width: 19 mm

The moderate width of the product allows for easy handling and installation in various electronic applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature ensures quick and efficient soldering during manufacturing processes.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures secure and reliable solder joints for long-lasting performance.

Length: 19 mm

The compact length of the product contributes to space-saving designs and easy integration into electronic systems.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit type, this product offers advanced computing capabilities and performance for various applications.

Technology: CMOS

CMOS technology provides low power consumption and high-speed processing, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form offers secure connections and easy installation, ensuring stable performance in electronic devices.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a standard operating range for the product, ensuring compatibility with various power sources.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density packaging and optimal use of available space on circuit boards.

Moisture Sensitivity Level (MSL): 4

This moisture sensitivity level indicates that the product is suitable for standard manufacturing and storage conditions, preventing damage from moisture exposure.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs VCBUP7CT7 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.3 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

VCBUP7CT7 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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