Loading...

VCBUP7CCUT6

Texas Instruments

VCBUP7CCUT6 by Texas Instruments

VCBUP7CCUT6 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1.14-1.26 V, making it suitable for various applications requiring high performance in a compact GRID ARRAY package style.

Median Price

$84.490

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 43 parts In-Stock

1+ parts

$84.490

100+ parts

$82.810

1k+ parts

$81.120

10k+ parts

-

43

$84.490

$82.810

$81.120

-

DigiKey

USA . 43 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

43

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,433 parts In-Stock

1+ parts

$77.358

100+ parts

-

1k+ parts

-

10k+ parts

-

4,433

$77.358

-

-

-

Vyrian

USA . 634 parts In-Stock

1+ parts

$81.430

100+ parts

-

1k+ parts

-

10k+ parts

-

634

$81.430

-

-

-

DigiKey Marketplace

USA . 43 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

43

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,234 parts In-Stock

1+ parts

$32.652

100+ parts

-

1k+ parts

-

10k+ parts

-

1,234

$32.652

-

-

-

Parana Technologies

USA . 327 parts In-Stock

1+ parts

$49.451

100+ parts

-

1k+ parts

-

10k+ parts

-

327

$49.451

-

-

-

DigiPath Technology Company

USA . 1,204 parts In-Stock

1+ parts

$54.452

100+ parts

-

1k+ parts

-

10k+ parts

-

1,204

$54.452

-

-

-

IDEA Electronic Components Group

UK . 333 parts In-Stock

1+ parts

$55.563

100+ parts

$52.785

1k+ parts

$50.007

10k+ parts

-

333

$55.563

$52.785

$50.007

-

ChromeModa Solutions

Germany . 230 parts In-Stock

1+ parts

$55.563

100+ parts

$45.562

1k+ parts

-

10k+ parts

-

230

$55.563

$45.562

-

-

Corphita

USA . 2,194 parts In-Stock

1+ parts

$73.287

100+ parts

-

1k+ parts

-

10k+ parts

-

2,194

$73.287

-

-

-

Microchip USA

USA . 1,667 parts In-Stock

1+ parts

$125.850

100+ parts

$123.660

1k+ parts

$122.570

10k+ parts

$121.480

1,667

$125.850

$123.660

$122.570

$121.480

QUARKTWIN TECHNOLOGY LTD

USA . 8,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,200

-

-

-

-

Overview

Discover the VCBUP7CCUT6 by Texas Instruments, a top-quality Other Function uPs,uCs & Peripheral ICs solution that offers incredible value to customers. With a commitment to excellence and innovation, Texas Instruments delivers a product that is versatile and reliable, suitable for a wide range of applications. From grid arrays to heat sinks, this product stands out for its performance and durability. Embrace the benefits of cutting-edge technology with the VCBUP7CCUT6 and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides excellent durability and resistance to harsh environmental conditions, making this product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a PCB, saving time and space in the overall design.

Maximum Supply Voltage: 1.26 V

A higher maximum supply voltage provides flexibility in power input options, allowing for compatibility with a variety of power sources.

Package Shape: SQUARE

The square package shape helps in efficient placement and alignment on the circuit board, optimizing the use of available space.

No. of Terminals: 529

With a high number of terminals, this product offers extensive connectivity options, enabling complex circuit designs and functionality.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style, coupled with heat sink/slug design, enhances heat dissipation and overall performance, making this product suitable for high-power applications.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of low-power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated temperatures, ensuring reliable performance in demanding environments.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes this product versatile and suitable for use in diverse environments, ranging from industrial to consumer electronics.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper as terminal finish materials ensures excellent conductivity, corrosion resistance, and solderability, enhancing the product's reliability and longevity.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection to the PCB, simplifying the assembly process and ensuring proper alignment.

Maximum Seated Height: 3.3 mm

The relatively low maximum seated height helps in space-constrained applications, allowing for compact and slim designs.

Width: 19 mm

The moderate width of the product ensures compatibility with standard PCB layouts and spacing, facilitating easy integration into existing designs.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering of the product, preventing damage and ensuring long-term reliability.

Peak Reflow Temperature °C: 245

The high peak reflow temperature of 245°C enables reliable bonding of the product to the PCB during the assembly process, ensuring a robust and stable connection.

Length: 19 mm

The moderate length of the product offers a balanced form factor, suitable for a variety of applications without compromising on performance or functionality.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product provides advanced processing capabilities, enabling complex computing tasks and enhancing overall system performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of operating voltages, making this product energy-efficient and versatile.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and ensures consistent performance, making this product suitable for high-speed and high-frequency applications.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V offers a balanced power input for efficient operation, ensuring compatibility with various voltage requirements.

Terminal Pitch: 0.8 mm

With a small terminal pitch of 0.8 mm, this product allows for dense routing and compact designs, ideal for space-constrained applications.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that this product requires careful handling during storage and assembly to prevent moisture-related damage, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs VCBUP7CCUT6 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.3 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

VCBUP7CCUT6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 7