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VCBU65WMCE30

Texas Instruments

VCBU65WMCE30 by Texas Instruments

VCBU65WMCE30 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width. It operates b/w 0-85 °C and supports I2C, SPI, UART, USB bus compatibility. The package style is GRID ARRAY with 338 terminals in a SQUARE shape measuring 13mm x 13mm.

Median Price

$20.600

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$20.600

100+ parts

-

1k+ parts

-

10k+ parts

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100

$20.600

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-

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Vyrian

USA . 2,206 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,206

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-

-

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Digiode

USA . 1,918 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,918

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,585 parts In-Stock

1+ parts

$15.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,585

$15.000

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AZTECH Wire

Italy . 795 parts In-Stock

1+ parts

$15.364

100+ parts

-

1k+ parts

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795

$15.364

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One Stop Electronics

USA . 1,390 parts In-Stock

1+ parts

$23.000

100+ parts

-

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10k+ parts

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1,390

$23.000

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-

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Corohmni

South Africa . 2,477 parts In-Stock

1+ parts

$34.117

100+ parts

-

1k+ parts

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2,477

$34.117

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Microchip USA

USA . 3,098 parts In-Stock

1+ parts

$47.381

100+ parts

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3,098

$47.381

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-

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Parana Technologies

USA . 972 parts In-Stock

1+ parts

$52.902

100+ parts

-

1k+ parts

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10k+ parts

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972

$52.902

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IDEA Electronic Components Group

UK . 2,273 parts In-Stock

1+ parts

$59.441

100+ parts

$56.469

1k+ parts

$53.497

10k+ parts

-

2,273

$59.441

$56.469

$53.497

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ChromeModa Solutions

Germany . 2,126 parts In-Stock

1+ parts

$59.441

100+ parts

$48.742

1k+ parts

-

10k+ parts

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2,126

$59.441

$48.742

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Corphita

USA . 1,333 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,333

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DigiPath Technology Company

USA . 1,074 parts In-Stock

1+ parts

-

100+ parts

$53.592

1k+ parts

-

10k+ parts

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1,074

-

$53.592

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$20.188

1k+ parts

$19.570

10k+ parts

$19.158

100

-

$20.188

$19.570

$19.158

Overview

Experience unparalleled quality and innovation with the VCBU65WMCE30 by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge technology that exceeds expectations. This versatile product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a wide range of applications. With a focus on value and reliability, this product provides customers with unmatched benefits and advantages. Trust Texas Instruments to elevate your projects to new heights with the VCBU65WMCE30.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology makes the product easier to assemble and allows for compact design, saving space on the PCB.

Maximum Supply Voltage: 1.42 V

The higher maximum supply voltage allows for flexibility in power input and can accommodate a wider range of applications.

Package Shape: SQUARE

The square shape of the package enables efficient use of space on the PCB and facilitates easy alignment during assembly.

No. of Terminals: 338

Having a high number of terminals allows for more connections and functionality, making the product versatile for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style enables high density mounting and efficient routing of signals, contributing to overall performance efficiency.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the soldering process during assembly without damage, ensuring reliability.

Width: 13 mm

The compact width of the product allows for space-saving on the PCB and enables the design of smaller, more portable devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the product.

Nominal Supply Voltage: 1.35 V

The optimal nominal supply voltage ensures stable performance and power efficiency for the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs VCBU65WMCE30 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

VCBU65WMCE30 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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