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XC7Z035-1FBG676C

Xilinx

XC7Z035-1FBG676C by Xilinx

The Xilinx XC7Z035-1FBG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage ranging from 0.95V to 1.05V. This package has 676 terminals in a square grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

Median Price

$1,296.925

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Mouser Electronics

USA . 3 parts In-Stock

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DigiKey

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Digiode

USA . 357 parts In-Stock

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VNN

France . 164 parts In-Stock

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Nova Conductors

Japan . 80 parts In-Stock

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NAC Semi

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Vyrian

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AZTECH Wire

Italy . 883 parts In-Stock

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Corohmni

South Africa . 93 parts In-Stock

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Aztec Data Supply Inc.

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Modulus Dynamics

Lithuania . 1,479 parts In-Stock

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Texas Native Microelectronics

USA . 58 parts In-Stock

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Vigor

Singapore . 436 parts In-Stock

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Microchip USA

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One Stop Electronics

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Ampacity Inc.

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Semicontronic

India . 1 parts In-Stock

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Corphita

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Aranea Global

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Continental Prestige Electronics

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Argo Parts USA

USA . 24 parts In-Stock

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Advanced Electronics

New Zealand . 17 parts In-Stock

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Lixinc

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Qasali Group International

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Kenton Components

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Overview

Unlock the power of cutting-edge technology with the XC7Z035-1FBG676C by Xilinx. This high-quality product offers exceptional performance and reliability, backed by Xilinx's reputation for excellence in the industry. Ideal for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this innovative solution provides customers with unmatched value, benefits, and advantages. Experience seamless integration, efficiency, and superior functionality with the XC7Z035-1FBG676C, setting new standards in the world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this product lightweight and cost-effective.

Surface Mount: YES

This product can be easily mounted on a circuit board, making it convenient for assembly and maintenance.

Maximum Supply Voltage: 1.05 V

With a high maximum supply voltage, this product can handle power fluctuations without getting damaged.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board.

No. of Terminals: 676

With a large number of terminals, this product can support complex functions and connectivity options.

Package Style (Meter): GRID ARRAY

The grid array package style ensures a stable and secure connection to the circuit board.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage requirement makes this product energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

This product can operate effectively at high temperatures, ensuring reliable performance in various environments.

Minimum Operating Temperature: 0 °C

The ability to operate at freezing temperatures makes this product suitable for a wide range of applications.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and secure connections to the circuit board.

Maximum Seated Height: 2.54 mm

The low maximum seated height ensures that this product can be easily integrated into slim and compact devices.

Width: 27 mm

The compact width of this product enables it to fit into tight spaces on the circuit board.

Length: 27 mm

The small length of this product contributes to its space-saving design and versatility.

Peripheral IC Type: SYSTEM ON CHIP

The system on chip peripheral IC type combines multiple functions into a single integrated circuit, reducing the need for additional components.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high-speed operation.

Terminal Form: BALL

The ball terminal form provides a reliable and efficient connection to the circuit board.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V is ideal for stable and efficient operation of this product.

Terminal Pitch: 1 mm

The small terminal pitch allows for high-density packaging of components on the circuit board.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z035-1FBG676C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z035-1FBG676C Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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