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FT230XQ-U

FTDI

FT230XQ-U by FTDI

MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Technology: CMOS;

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 445 parts In-Stock

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445

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Nova Conductors

Japan . 300 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 525 parts In-Stock

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$6.341

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$24.778

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$23.539

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$23.539

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$24.778

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Aztec Data Supply Inc.

USA . 254 parts In-Stock

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$72.270

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$72.270

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Continental Prestige Electronics

USA . 5,417 parts In-Stock

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Argo Parts USA

USA . 4,059 parts In-Stock

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Modulus Dynamics

Lithuania . 870 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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$0.042

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$0.042

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$0.042

500

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$0.042

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Bastille Electronics

Australia . 100 parts In-Stock

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs FT230XQ-U attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from FTDI

Specs

Peak Reflow Temperature (C):

NOT SPECIFIED

Technology:

CMOS

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

FT230XQ-U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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