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OMAPL138EZCED4E

Texas Instruments

OMAPL138EZCED4E by Texas Instruments

OMAPL138EZCED4E by Texas Instruments is a low-profile, fine-pitch microprocessor circuit with a max clock frequency of 50 MHz. It is suitable for industrial applications and supports I2C, SPI, UART, and USB bus compatibility.

Median Price

$24.782

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,164 parts In-Stock

1+ parts

$24.782

100+ parts

$21.647

1k+ parts

$14.929

10k+ parts

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2,164

$24.782

$21.647

$14.929

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Distributors (In-Stock)

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$22.390

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650

$22.390

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Digiode

USA . 2,663 parts In-Stock

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$23.543

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2,663

$23.543

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Vyrian

USA . 8,771 parts In-Stock

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8,771

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Distributors (Availability)

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AZTECH Wire

Italy . 65 parts In-Stock

1+ parts

$10.310

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65

$10.310

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Ampacity Inc.

Singapore . 2,042 parts In-Stock

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$21.060

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2,042

$21.060

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Corphita

USA . 2,213 parts In-Stock

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$22.304

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2,213

$22.304

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Parana Technologies

USA . 1,568 parts In-Stock

1+ parts

$23.137

100+ parts

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$23.774

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1,568

$23.137

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$23.774

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DigiPath Technology Company

USA . 1,876 parts In-Stock

1+ parts

$25.477

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1,876

$25.477

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ChromeModa Solutions

Germany . 3,254 parts In-Stock

1+ parts

$25.997

100+ parts

$21.318

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3,254

$25.997

$21.318

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IDEA Electronic Components Group

UK . 1,809 parts In-Stock

1+ parts

$25.997

100+ parts

$24.697

1k+ parts

$23.397

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1,809

$25.997

$24.697

$23.397

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Corohmni

South Africa . 2,249 parts In-Stock

1+ parts

$27.230

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2,249

$27.230

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QUARKTWIN TECHNOLOGY LTD

USA . 27,907 parts In-Stock

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Lixinc

USA . 14,111 parts In-Stock

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14,111

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Perfect Parts

USA . 358 parts In-Stock

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358

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Futuretech Components

Singapore . 148 parts In-Stock

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Overview

Discover the OMAPL138EZCED4E by Texas Instruments, a cutting-edge microprocessor circuit that offers unbeatable quality and reliability. With its innovative design and state-of-the-art technology, this versatile product is perfect for a wide range of applications. Whether you need it for industrial automation, telecommunications, or consumer electronics, the OMAPL138EZCED4E delivers exceptional performance. Experience the value, benefits, and advantages that Texas Instruments brings to the table with this outstanding offering. Don't miss out on the opportunity to enhance your projects with the OMAPL138EZCED4E!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's package body material enhances durability and makes it resistant to impact and external elements, making it a reliable choice.

Surface Mount: YES

The surface mount feature allows for easy installation onto circuit boards, minimizing space requirements and facilitating efficient assembly.

Maximum Supply Voltage: 1.35 V

With a high maximum supply voltage, this product can handle power-intensive tasks effectively, ensuring stable performance even under demanding conditions.

Package Shape: SQUARE

The square package shape provides uniformity and compatibility with various board layouts, making it easy to integrate this product into different systems.

No. of Terminals: 361

With a high number of terminals, this product offers ample connectivity options, allowing for seamless communication with other components in a circuit.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low-profile, and fine pitch package style enhances the product's overall compactness and allows for efficient heat dissipation, making it ideal for space-constrained applications.

Minimum Supply Voltage: 1.25 V

The low minimum supply voltage enables energy-efficient operation, reducing power consumption and enhancing the product's suitability for battery-powered devices.

Maximum Operating Temperature: 90 °C

This product can withstand high operating temperatures, enabling it to perform reliably in demanding environments with elevated heat levels.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature ensures this product's suitability for use in extreme cold conditions, making it versatile and dependable.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides robust electrical conductivity, ensuring excellent signal transmission and minimizing the risk of corrosion, thereby enhancing the product's reliability and longevity.

Terminal Position: BOTTOM

The bottom terminal position simplifies the product's integration into circuit boards and facilitates ease of use during installation and maintenance.

Maximum Seated Height: 1.3 mm

With a low seated height, this product offers a compact form factor, making it suitable for applications with limited vertical space.

Width: 13 mm

The product's width contributes to its slim profile, enabling it to fit into narrow spaces and compact designs effectively.

External Data Bus Width: 32

The wide external data bus width of 32 bits enables fast and efficient data transfer, enhancing the product's overall performance in data-intensive applications.

Maximum Clock Frequency: 50 MHz

With a high maximum clock frequency, this product can execute instructions quickly and process data rapidly, improving performance in time-critical operations.

Maximum Time At Peak Reflow Temperature (s): 30

The product's capability to withstand the peak reflow temperature for up to 30 seconds ensures reliable soldering during assembly, facilitating efficient manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability of 260°C ensures proper solder melting, ensuring secure connections between the product and the circuit board during assembly.

Length: 13 mm

The product's length contributes to its compact design, allowing for easy integration into space-limited applications and reducing the overall footprint.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures this product can operate reliably in harsh environments, including high temperatures, making it suitable for rugged industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

This product, being a microprocessor circuit, offers advanced processing capabilities, making it ideal for complex tasks that require high computational power and sophisticated control.

Technology: CMOS

The CMOS technology employed in this product provides low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, enhancing overall performance and versatility.

Terminal Form: BALL

The ball terminal form facilitates efficient electrical contact and helps manage heat dissipation, ensuring optimal performance and reliability in demanding operating conditions.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage of 1.3 V ensures stability and efficient power usage, making this product suitable for various applications requiring precision and tight voltage control.

Bus Compatibility: I2C; SPI; UART; USB

This product's compatibility with multiple bus protocols (I2C, SPI, UART, USB) enables seamless communication with various devices, expanding its range of applications and boosting its flexibility.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density circuit board layouts, enabling the product to be used in compact designs, where space optimization is crucial.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, this product is less susceptible to moisture-related damage during storage and assembly, ensuring its reliability and extending its shelf life.

Speed: 456 rpm

The high rotational speed capability of 456 rotations per minute enables this product to deliver fast and efficient performance in applications requiring swift data processing or precise motor control.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL138EZCED4E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

Bus Compatibility:

I2C; SPI; UART; USB

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Speed:

456 rpm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

OMAPL138EZCED4E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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