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OMAPL138EZCEA3

Texas Instruments

OMAPL138EZCEA3 by Texas Instruments

The Texas Instruments OMAPL138EZCEA3 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width, operating at up to 50 MHz. It features a GRID ARRAY package style with 361 terminals and is suitable for industrial applications requiring I2C, SPI, UART, and USB bus compatibility.

Median Price

$26.196

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 54,818 parts In-Stock

1+ parts

$26.196

100+ parts

$22.882

1k+ parts

$15.781

10k+ parts

-

54,818

$26.196

$22.882

$15.781

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

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$23.670

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1,000

$23.670

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Digiode

USA . 3,311 parts In-Stock

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$24.886

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3,311

$24.886

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Vyrian

USA . 2,863 parts In-Stock

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2,863

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Chip Stock

USA . 2,703 parts In-Stock

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2,703

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Bristol Electronics

USA . 79 parts In-Stock

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79

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Atlantic Semiconductor

USA . 79 parts In-Stock

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79

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Distributors (Availability)

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AZTECH Wire

Italy . 306 parts In-Stock

1+ parts

$10.770

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306

$10.770

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Ampacity Inc.

Singapore . 54,326 parts In-Stock

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$22.270

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54,326

$22.270

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Aranea Global

USA . 100 parts In-Stock

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$23.197

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$22.269

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100

$23.197

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$22.269

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Corphita

USA . 597 parts In-Stock

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$23.576

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597

$23.576

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Corohmni

South Africa . 380 parts In-Stock

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$27.450

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380

$27.450

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Parana Technologies

USA . 2,251 parts In-Stock

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$35.806

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DigiPath Technology Company

USA . 1,557 parts In-Stock

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$39.427

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1,557

$39.427

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ChromeModa Solutions

Germany . 5,829 parts In-Stock

1+ parts

$40.232

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$32.990

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5,829

$40.232

$32.990

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IDEA Electronic Components Group

UK . 570 parts In-Stock

1+ parts

$40.232

100+ parts

$38.220

1k+ parts

$36.209

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570

$40.232

$38.220

$36.209

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$53.937

100+ parts

$49.083

1k+ parts

$44.228

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2,500

$53.937

$49.083

$44.228

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A-Z Elektronik GmbH

Germany . 5,886 parts In-Stock

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Lixinc

USA . 5,458 parts In-Stock

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GreenTree Electronics

Israel . 3,170 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the OMAPL138EZCEA3, a top-of-the-line microprocessor circuit that promises unparalleled performance and reliability. This industrial-grade peripheral IC boasts a wide range of applications, from IoT devices to automotive systems, making it a versatile solution for all your project needs. With a maximum clock frequency of 50 MHz and a low profile, fine pitch package style, this innovative product offers unmatched value and benefits to customers looking for quality and efficiency in their designs. Trust Texas Instruments to deliver excellence with the OMAPL138EZCEA3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving time and simplifying the manufacturing process.

Maximum Supply Voltage: 1.35 V

The high maximum supply voltage allows for flexibility in power supply options, making this product versatile and compatible with various systems.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, optimizing the design layout.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand heat and operate reliably in challenging environments.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures makes this product suitable for use in both extreme cold and hot conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring stable electrical connections.

Width: 13 mm

Compact width allows for efficient use of space on the circuit board, enabling a more streamlined and compact overall design.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency allows for fast processing speeds, making this product suitable for applications requiring high performance.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this product is rugged and reliable, capable of withstanding harsh conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy efficient and reliable.

Nominal Supply Voltage: 1.3 V

The stable nominal supply voltage ensures consistent performance and reliable operation of the product.

Bus Compatibility: I2C; SPI; UART; USB

Compatibility with multiple bus protocols allows for versatile connectivity options, making this product suitable for a wide range of applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL138EZCEA3 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

Bus Compatibility:

I2C; SPI; UART; USB

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Speed:

456 rpm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

OMAPL138EZCEA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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