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BALL Other Function uPs,uCs & Peripheral ICs 1,582

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MCIMX6S5EVM10ADR by NXP Semiconductors

MCIMX6S5EVM10ADR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.5 V;

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

CY8C4248BZS-L489 by Infineon Technologies

CY8C4248BZS-L489

Infineon Technologies

PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 124; Package Code: VFBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B241

9 mm

3

124

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA124,13X13,25

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

5.5 V

1.71 V

3.3 V

YES

CMOS

BALL

.65 mm

BOTTOM

9 mm

PROGRAMMABLE SoC

CYPM1211-42FNXIT by Infineon Technologies

CYPM1211-42FNXIT

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: BALL; No. of Terminals: 42; Package Code: VFBGA; Package Shape: RECTANGULAR; Length: 3.184 mm;

R-PBGA-B42

3.184 mm

42

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA42,6X7,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.55 mm

5.5 V

2.7 V

3.3 V

YES

CMOS

BALL

.4 mm

BOTTOM

2.633 mm

CRYPTOGRAPHIC AUTHENTICATOR

AM6421BSFGHAALV by Texas Instruments

AM6421BSFGHAALV

Texas Instruments

AM6421BSFGHAALV by Texas Instruments is a System on Chip with 441 terminals in a fine pitch grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715 to 0.79 V. Ideal for applications requiring high-performance microcontrollers in compact designs.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

17.2 mm

SYSTEM ON CHIP

AM6441BSFFHAALV by Texas Instruments

AM6441BSFFHAALV

Texas Instruments

AM6441BSFFHAALV by Texas Instruments is a SYSTEM ON CHIP with 441 terminals in a GRID ARRAY package. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring fine pitch and CMOS technology.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6442BSFGHAALV by Texas Instruments

AM6442BSFGHAALV

Texas Instruments

AM6442BSFGHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates at speeds up to 1000 rpm and has a max supply voltage of 0.79 V. This IC is ideal for applications requiring high performance in a compact form factor, such as mobile devices and IoT products.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

1000 rpm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6411BKCGHAALV by Texas Instruments

AM6411BKCGHAALV

Texas Instruments

AM6411BKCGHAALV by Texas Instruments is a System on Chip with 441 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715 to 0.79 V. Ideal for applications requiring fine pitch and ball terminal form technology.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6412BSCGHAALV by Texas Instruments

AM6412BSCGHAALV

Texas Instruments

AM6412BSCGHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.715V to 0.79V. With 441 terminals in a GRID ARRAY package, it's ideal for applications requiring high performance in compact spaces.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6441BSEFHAALV by Texas Instruments

AM6441BSEFHAALV

Texas Instruments

AM6441BSEFHAALV by Texas Instruments is a 441-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring fine pitch grid array package style and surface mount compatibility.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

17.2 mm

SYSTEM ON CHIP

AM6442BSDGHAALV by Texas Instruments

AM6442BSDGHAALV

Texas Instruments

AM6442BSDGHAALV by Texas Instruments is a CMOS system-on-chip with 441 terminals in a square grid array package. It operates at temperatures ranging from -40 to 105 °C and has a max supply voltage of 0.79 V. This IC is commonly used in applications requiring high-speed processing, such as data centers or telecommunications equipment.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

1000 rpm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6442BSFFHAALV by Texas Instruments

AM6442BSFFHAALV

Texas Instruments

AM6442BSFFHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.715V to 0.79V. This IC is ideal for applications requiring high-speed processing in compact electronic devices.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

1000 rpm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6411BSCGHAALV by Texas Instruments

AM6411BSCGHAALV

Texas Instruments

AM6411BSCGHAALV by Texas Instruments is a System on Chip with 441 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. Ideal for applications requiring high-performance computing in compact spaces.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6421BSFFHAALV by Texas Instruments

AM6421BSFFHAALV

Texas Instruments

AM6421BSFFHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It features 441 terminals in a GRID ARRAY, FINE PITCH package style. Operating b/w -40 to 105 °C, it's ideal for applications requiring low power consumption and high performance in compact designs.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6442BSEFHAALV by Texas Instruments

AM6442BSEFHAALV

Texas Instruments

AM6442BSEFHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.715V to 0.79V. With 441 terminals in a GRID ARRAY package, it's ideal for high-speed applications requiring fine pitch components.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

1000 rpm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

17.2 mm

SYSTEM ON CHIP

AM6442BSEGHAALV by Texas Instruments

AM6442BSEGHAALV

Texas Instruments

AM6442BSEGHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. This IC has 441 terminals in a GRID ARRAY package style and is ideal for various applications requiring high-speed processing.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

2.652 mm

1000 rpm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

XCVE1752-1MLINSVG1369 by Xilinx

XCVE1752-1MLINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2LSENSVG1369 by Xilinx

XCVE1752-2LSENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Width: 35 mm;

S-PBGA-B1369

35 mm

1369

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2MLENSVG1369 by Xilinx

XCVE1752-2MLENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .825 V;

S-PBGA-B1369

35 mm

1369

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2MSENSVG1369 by Xilinx

XCVE1752-2MSENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Length: 35 mm;

S-PBGA-B1369

35 mm

1369

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2HSINSVG1369 by Xilinx

XCVE1752-2HSINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.906 V

.854 V

.88 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2MSINSVG1369 by Xilinx

XCVE1752-2MSINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Length: 35 mm;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1LLINSVG1369 by Xilinx

XCVE1752-1LLINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Length: 35 mm;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1LSINSVG1369 by Xilinx

XCVE1752-1LSINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1MSENSVG1369 by Xilinx

XCVE1752-1MSENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

S-PBGA-B1369

35 mm

1369

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1MSINSVG1369 by Xilinx

XCVE1752-1MSINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2MLINSVG1369 by Xilinx

XCVE1752-2MLINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .825 V;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1LSENSVG1369 by Xilinx

XCVE1752-1LSENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

S-PBGA-B1369

35 mm

1369

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2LLENSVG1369 by Xilinx

XCVE1752-2LLENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA1369,37X37,36;

S-PBGA-B1369

35 mm

1369

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

AM6422BSDGHAALV by Texas Instruments

AM6422BSDGHAALV

Texas Instruments

AM6422BSDGHAALV by Texas Instruments is a SYSTEM ON CHIP with a max supply voltage of 0.79 V and a min operating temperature of -40 °C. It is used in applications requiring high speed and low power consumption.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

1000 rpm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

17.2 mm

SYSTEM ON CHIP

P1025NXE5DFB by NXP Semiconductors

P1025NXE5DFB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 561; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

S-PBGA-B561

23 mm

3

561

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA561,27X27,32

SQUARE

GRID ARRAY, FINE PITCH

2.3 mm

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SoC

TDA4VE88TGAALZRQ1 by Texas Instruments

TDA4VE88TGAALZRQ1

Texas Instruments

TDA4VE88TGAALZRQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 0.76V to 0.84V. This IC has 770 terminals in a GRID ARRAY package style and is suitable for automotive applications under AEC-Q100 and ISO 26262 standards.

S-PBGA-B770

23 mm

3

770

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA770,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

AEC-Q100; ISO 26262

2.57 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

TDA4AL88TGAALZRQ1 by Texas Instruments

TDA4AL88TGAALZRQ1

Texas Instruments

TDA4AL88TGAALZRQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has 770 terminals in a GRID ARRAY, FINE PITCH package style. Ideal for automotive applications meeting AEC-Q100 and ISO 26262 standards.

S-PBGA-B770

23 mm

3

770

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA770,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

AEC-Q100; ISO 26262

2.57 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

TDA4VL21HGAALZRQ1 by Texas Instruments

TDA4VL21HGAALZRQ1

Texas Instruments

TDA4VL21HGAALZRQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 0.76V to 0.84V. Ideal for automotive applications due to AEC-Q100 and ISO 26262 screening levels.

S-PBGA-B770

23 mm

3

770

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA770,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

AEC-Q100; ISO 26262

2.57 mm

1200 rpm

.84 V

.76 V

.8 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

DRA821U4TCBALMRQ1 by Texas Instruments

DRA821U4TCBALMRQ1

Texas Instruments

DRA821U4TCBALMRQ1 by Texas Instruments is a SoC peripheral IC with 433 terminals in a grid array package. It operates b/w -40 to 125 °C, with supply voltage ranging from 0.76V to 0.84V. Suitable for automotive applications due to AEC-Q100 screening and fine pitch design.

S-PBGA-B433

17.2 mm

3

433

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA433,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.57 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SoC

DRA821U4TCBALMQ1 by Texas Instruments

DRA821U4TCBALMQ1

Texas Instruments

SoC; Terminal Form: BALL; No. of Terminals: 433; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;

S-PBGA-B433

17.2 mm

3

433

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA433,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.57 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SoC

P1025NSE5DFB by NXP Semiconductors

P1025NSE5DFB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 561; Package Code: FBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

S-PBGA-B561

23 mm

3

561

125 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA561,27X27,32

SQUARE

GRID ARRAY, FINE PITCH

2.3 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SoC

P1015NSN5DFB by NXP Semiconductors

P1015NSN5DFB

NXP Semiconductors

The NXP Semiconductors P1015NSN5DFB is a 561-terminal SoC IC with CMOS technology. It operates b/w 0-125°C, with supply voltage range of 0.95-1.05 V. This fine-pitch grid array IC is suitable for applications requiring high performance in compact spaces.

S-PBGA-B561

23 mm

3

561

125 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA561,27X27,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.79 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

23 mm

SoC

AM62A74AUMHAAMBR by Texas Instruments

AM62A74AUMHAAMBR

Texas Instruments

AM62A74AUMHAAMBR by Texas Instruments is a 484-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 0.715V to 0.79V. This fine-pitch grid array IC is suitable for various applications requiring high-performance microcontrollers and peripheral integration.

S-PBGA-B484

18 mm

484

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

2.556 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

18 mm

SoC

AM62A74AUMSIAMBRQ1 by Texas Instruments

AM62A74AUMSIAMBRQ1

Texas Instruments

AM62A74AUMSIAMBRQ1 by Texas Instruments is a 484-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage ranging from 0.715V to 0.79V. Ideal for automotive applications due to AEC-Q100 screening and fine pitch grid array package style.

S-PBGA-B484

18 mm

484

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

AEC-Q100

2.556 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

18 mm

SoC

AM68A92ATGGHAALZR by Texas Instruments

AM68A92ATGGHAALZR

Texas Instruments

AM68A92ATGGHAALZR by Texas Instruments is a SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.76V to 0.84V. This IC has 770 terminals in a grid array package style, suitable for various applications requiring high performance and compact design.

S-PBGA-B770

23 mm

3

770

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA770,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.57 mm

.84 V

.76 V

.8 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

23 mm

SoC

XAM69A98ATNGHAALY by Texas Instruments

XAM69A98ATNGHAALY

Texas Instruments

XAM69A98ATNGHAALY by Texas Instruments is a 1414-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 0.76V to 0.84V. This fine-pitch grid array IC is suitable for applications requiring high performance in compact spaces.

S-PBGA-B1414

31 mm

1414

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA1414,38X38,32

SQUARE

GRID ARRAY, FINE PITCH

3.341 mm

.84 V

.76 V

.8 V

YES

CMOS

BALL

.8 mm

BOTTOM

31 mm

SoC

NRF52805-CAAA-B-R by Nordic Semiconductor Asa

NRF52805-CAAA-B-R

Nordic Semiconductor Asa

NRF52805-CAAA-B-R by Nordic Semiconductor Asa is a SoC with 28 terminals, operating from -40 to 85 °C. It has a supply voltage range of 1.7V to 3.6V and uses CMOS technology. This IC is ideal for applications requiring low power consumption in compact electronic devices.

R-PBGA-B28

2.482 mm

28

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA28,6X7,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.535 mm

3.6 V

1.7 V

3 V

YES

CMOS

BALL

.4 mm

BOTTOM

2.464 mm

SoC

AM6251ATCGHAALW by Texas Instruments

AM6251ATCGHAALW

Texas Instruments

AM6251ATCGHAALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. This IC is ideal for applications requiring a very thin profile and fine pitch grid array package style.

S-PBGA-B425

13 mm

3

425

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA425,25X25,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

250

.89 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.5 mm

BOTTOM

13 mm

SoC

AM6231ATCGHAALW by Texas Instruments

AM6231ATCGHAALW

Texas Instruments

AM6231ATCGHAALW by Texas Instruments is a CMOS SoC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring very thin profile and fine pitch components.

S-PBGA-B425

13 mm

3

425

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA425,25X25,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

250

.89 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.5 mm

BOTTOM

13 mm

SoC

AM6232ATCGHAALW by Texas Instruments

AM6232ATCGHAALW

Texas Instruments

AM6232ATCGHAALW by Texas Instruments is a CMOS SoC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C, with supply voltage ranging from 0.715V to 0.79V. Ideal for applications requiring high-density integration and low power consumption.

S-PBGA-B425

13 mm

3

425

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA425,25X25,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

250

.89 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.5 mm

BOTTOM

13 mm

SoC

OSD3358-1G-ISM by Octavo Systems

OSD3358-1G-ISM

Octavo Systems

Octavo Systems' OSD3358-1G-ISM is a 256-terminal SoC with CMOS technology, operating b/w -40°C to 85°C. Its grid array package style and 1.27mm terminal pitch make it suitable for compact embedded systems requiring low power consumption and high processing capabilities. Ideal for IoT devices, robotics, and industrial automation applications.

S-PBGA-B256

21 mm

256

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,50

SQUARE

GRID ARRAY

2.58 mm

1.1 V

YES

CMOS

BALL

1.27 mm

BOTTOM

21 mm

SoC