BALL Other Function uPs,uCs & Peripheral ICs 1,582

Part# Info			Specs
Part	RoHS	Manufacturer	Description	ADC Channels	Maximum Access Time	Additional Features	Address Bus Width	Bit Size	Boundary Scan	Bus Compatibility	CPU Family	Maximum Clock Frequency	DAC Channels	DMA Channels	External Data Bus Width	Format	Information Access Method	Integrated Cache	Interrupt Capability	JESD-30 Code	JESD-609 Code	Length	Low Power Mode	Moisture Sensitivity Level (MSL)	No. of Bits	No. of DMA Channels	No. of External Interrupts	No. of I/O Lines	No. of Ports	No. of Serial I/Os	No. of Terminals	No. of Timers	On Chip Data RAM Width	On Chip Program ROM Width	Maximum Operating Temperature	Minimum Operating Temperature	PWM Channels	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style (Meter)	Peak Reflow Temperature (C)	Power Supplies (V)	Qualification	RAM Bytes	RAM Words	ROM Words	ROM Programmability	ROM Bits Size	Screening Level	Maximum Seated Height	Speed	Maximum Standby Current	Sub-Category	Maximum Supply Current	Maximum Supply Voltage	Minimum Supply Voltage	Nominal Supply Voltage	Surface Mount	Technology	Temperature Grade	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Minimum Time	Maximum Time At Peak Reflow Temperature (s)	Total Dose (V)	Ultraviolet Erasable	Volatile	Width	Peripheral IC Type	Data EEPROM Size	Connectivity	Peripherals	Analog To Digital Convertors
XCVM1302-1MSINBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;																	S-PBGA-B1024		31 mm									1024				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1302-2MSINBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;																	S-PBGA-B1024		31 mm									1024				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1402-2LLENBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Width: 31 mm;																	S-PBGA-B1024		31 mm									1024				110 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1302-2MLINBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Width: 31 mm;																	S-PBGA-B1024		31 mm									1024				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1402-1LLINBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Length: 31 mm;																	S-PBGA-B1024		31 mm									1024				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1402-1MSENBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;																	S-PBGA-B1024		31 mm									1024				100 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1402-2MSINBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;																	S-PBGA-B1024		31 mm									1024				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1402-2MSENBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;																	S-PBGA-B1024		31 mm									1024				110 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVE1752-1MLIVSVA2197		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;																	S-PBGA-B2197	e1	45 mm									2197				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA2197,47X47,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.825 V	.775 V	.8 V	YES	CMOS		TIN SILVER COPPER	BALL	.92 mm	BOTTOM						45 mm	MICROPROCESSOR CIRCUIT
XCVE1752-1MSEVSVA1596		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;																	S-PBGA-B1596		37.5 mm									1596				100 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA1596,40X40,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						37.5 mm	MICROPROCESSOR CIRCUIT
XCVE1752-1MSIVSVA1596		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;																	S-PBGA-B1596		37.5 mm									1596				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1596,40X40,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						37.5 mm	MICROPROCESSOR CIRCUIT
XCVE1752-2LLEVSVA1596		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .676 V;																	S-PBGA-B1596		37.5 mm									1596				110 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA1596,40X40,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						37.5 mm	MICROPROCESSOR CIRCUIT
XCVE1752-2MLIVSVA1596		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;																	S-PBGA-B1596		37.5 mm									1596				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1596,40X40,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						37.5 mm	MICROPROCESSOR CIRCUIT
XCVE1752-2MSEVSVA1596		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;																	S-PBGA-B1596		37.5 mm									1596				110 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA1596,40X40,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						37.5 mm	MICROPROCESSOR CIRCUIT
XCVE1752-2MSEVSVA2197		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;																	S-PBGA-B2197	e1	45 mm									2197				110 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA2197,47X47,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.825 V	.775 V	.8 V	YES	CMOS		TIN SILVER COPPER	BALL	.92 mm	BOTTOM						45 mm	MICROPROCESSOR CIRCUIT
XCVM1302-1MSENBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;																	S-PBGA-B1024		31 mm									1024				100 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1302-2MLENBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;																	S-PBGA-B1024		31 mm									1024				110 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1402-1LSINBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;																	S-PBGA-B1024		31 mm									1024				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1402-1MLINBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 2.94 mm;																	S-PBGA-B1024		31 mm									1024				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1402-1MSINBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;																	S-PBGA-B1024		31 mm									1024				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1402-2MLENBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Length: 31 mm;																	S-PBGA-B1024		31 mm									1024				110 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVE1752-1LLIVSVA1596		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;																	S-PBGA-B1596		37.5 mm									1596				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1596,40X40,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						37.5 mm	MICROPROCESSOR CIRCUIT
XCVE1752-1LSIVSVA1596		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;																	S-PBGA-B1596		37.5 mm									1596				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1596,40X40,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						37.5 mm	MICROPROCESSOR CIRCUIT
XCVE1752-2MLEVSVA2197		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;																	S-PBGA-B2197	e1	45 mm									2197				110 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA2197,47X47,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.825 V	.775 V	.8 V	YES	CMOS		TIN SILVER COPPER	BALL	.92 mm	BOTTOM						45 mm	MICROPROCESSOR CIRCUIT
XCVE1752-2MLIVSVA2197		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;																	S-PBGA-B2197	e1	45 mm									2197				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA2197,47X47,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.825 V	.775 V	.8 V	YES	CMOS		TIN SILVER COPPER	BALL	.92 mm	BOTTOM						45 mm	MICROPROCESSOR CIRCUIT
XCVM1302-1LLINBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .676 V;																	S-PBGA-B1024		31 mm									1024				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1302-1LSENBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA1024,32X32,36;																	S-PBGA-B1024		31 mm									1024				100 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1302-1LSINBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Length: 31 mm;																	S-PBGA-B1024		31 mm									1024				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1302-2MSENBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;																	S-PBGA-B1024		31 mm									1024				110 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1402-1LSENBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;																	S-PBGA-B1024		31 mm									1024				100 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1402-2LSENBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;																	S-PBGA-B1024		31 mm									1024				110 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1402-2MLINBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA1024,32X32,36;																	S-PBGA-B1024		31 mm									1024				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
CYW54907KWBGT		Infineon Technologies	SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 316; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;			MINIMUM BUMP PITCH IS CONSIDERED														R-PBGA-B316		5.848 mm									316				85 Cel	-30 Cel		PLASTIC/EPOXY	VFBGA	BGA316(UNSPEC)	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH										.33 mm					1.26 V	1.14 V	1.2 V	YES	CMOS			BALL	.2 mm	BOTTOM						4.907 mm	SYSTEM ON CHIP
MIMX8DL1AVNFZBA		NXP Semiconductors	SoC; Terminal Form: BALL; No. of Terminals: 388; Package Shape: SQUARE; Terminal Position: BOTTOM; Peak Reflow Temperature (C): 260;																	S-PBGA-B388		15 mm		3							388							PLASTIC/EPOXY			SQUARE		260									1.7 mm								YES	CMOS			BALL		BOTTOM		40				15 mm	SoC
CYS0644AFNI-S2D43T		Infineon Technologies	PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 100; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;																	R-PBGA-B100		4.1068 mm									100				85 Cel	-40 Cel		PLASTIC/EPOXY	VFBGA	BGA100,12X17,16	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH										.467 mm					3.6 V	1.7 V	1.8 V	YES	CMOS			BALL	.42 mm	BOTTOM						3.9025 mm	PROGRAMMABLE SoC
XCVM1302-2MLENSVF1369		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;																	S-PBGA-B1369		35 mm									1369				110 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA1369,37X37,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						35 mm	MICROPROCESSOR CIRCUIT
XCVM1302-2MSINSVF1369		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;																	S-PBGA-B1369		35 mm									1369				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1369,37X37,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						35 mm	MICROPROCESSOR CIRCUIT
XCVM1402-1LSENSVF1369		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;																	S-PBGA-B1369		35 mm									1369				100 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA1369,37X37,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						35 mm	MICROPROCESSOR CIRCUIT
XCVM1402-1LSINSVF1369		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Length: 35 mm;																	S-PBGA-B1369		35 mm									1369				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1369,37X37,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						35 mm	MICROPROCESSOR CIRCUIT
XCVM1402-2HSINBVB1024		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Length: 31 mm;																	S-PBGA-B1024		31 mm									1024				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1024,32X32,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										2.94 mm					.906 V	.854 V	.88 V	YES	CMOS			BALL	.92 mm	BOTTOM						31 mm	MICROPROCESSOR CIRCUIT
XCVM1402-2HSIVFVC1596		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.75 mm;																	S-PBGA-B1596		37.5 mm									1596				110 Cel	-40 Cel		PLASTIC/EPOXY	BGA	BGA1596,40X40,36	SQUARE	GRID ARRAY										3.75 mm					.906 V	.854 V	.88 V	YES	CMOS			BALL	.92 mm	BOTTOM						37.5 mm	MICROPROCESSOR CIRCUIT
XCVM1302-1LLINSVF1369		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;																	S-PBGA-B1369		35 mm									1369				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1369,37X37,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						35 mm	MICROPROCESSOR CIRCUIT
XCVM1302-1LSINSVF1369		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .676 V;																	S-PBGA-B1369		35 mm									1369				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1369,37X37,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						35 mm	MICROPROCESSOR CIRCUIT
XCVM1302-2LLENSVF1369		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;																	S-PBGA-B1369		35 mm									1369				110 Cel	0 Cel		PLASTIC/EPOXY	HBGA	BGA1369,37X37,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						35 mm	MICROPROCESSOR CIRCUIT
XCVM1402-2MLINSVF1369		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Width: 35 mm;																	S-PBGA-B1369		35 mm									1369				110 Cel	-40 Cel		PLASTIC/EPOXY	HBGA	BGA1369,37X37,36	SQUARE	GRID ARRAY, HEAT SINK/SLUG										4 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						35 mm	MICROPROCESSOR CIRCUIT
XCVM1502-1LSINFVB1369		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1369;																	S-PBGA-B1369		35 mm									1369				110 Cel	-40 Cel		PLASTIC/EPOXY	BGA	BGA1369,37X37,36	SQUARE	GRID ARRAY										3.83 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						35 mm	MICROPROCESSOR CIRCUIT
XCVM1502-1MSINFVB1369		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA1369,37X37,36;																	S-PBGA-B1369		35 mm									1369				110 Cel	-40 Cel		PLASTIC/EPOXY	BGA	BGA1369,37X37,36	SQUARE	GRID ARRAY										3.83 mm					.825 V	.775 V	.8 V	YES	CMOS			BALL	.92 mm	BOTTOM						35 mm	MICROPROCESSOR CIRCUIT
XCVM1502-2LSENFVB1369		Xilinx	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;																	S-PBGA-B1369		35 mm									1369				110 Cel	0 Cel		PLASTIC/EPOXY	BGA	BGA1369,37X37,36	SQUARE	GRID ARRAY										3.83 mm					.724 V	.676 V	.7 V	YES	CMOS			BALL	.92 mm	BOTTOM						35 mm	MICROPROCESSOR CIRCUIT