Loading...

XCVM1402-1LSENSVF1369

Xilinx

XCVM1402-1LSENSVF1369 by Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 916 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

916

-

-

-

-

VNN

France . 368 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

368

-

-

-

-

Digiode

USA . 76 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

76

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 385 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

-

385

$8.000

-

-

-

AZTECH Wire

Italy . 450 parts In-Stock

1+ parts

$11.907

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$11.907

-

-

-

Semicontronic

India . 1,291 parts In-Stock

1+ parts

$27.000

100+ parts

$26.325

1k+ parts

$26.190

10k+ parts

-

1,291

$27.000

$26.325

$26.190

-

MARBEL Systems

Belgium . 10 parts In-Stock

1+ parts

$49.419

100+ parts

$47.443

1k+ parts

-

10k+ parts

-

10

$49.419

$47.443

-

-

Texas Native Microelectronics

USA . 751 parts In-Stock

1+ parts

$56.804

100+ parts

$54.532

1k+ parts

$52.828

10k+ parts

-

751

$56.804

$54.532

$52.828

-

Kenton Components

USA . 2,241 parts In-Stock

1+ parts

$68.165

100+ parts

-

1k+ parts

-

10k+ parts

$59.985

2,241

$68.165

-

-

$59.985

Microchip USA

USA . 1,299 parts In-Stock

1+ parts

$3,330.171

100+ parts

-

1k+ parts

-

10k+ parts

-

1,299

$3,330.171

-

-

-

Supply Digital

USA . 2,164 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,164

-

-

-

-

Qasali Group International

UK . 1,539 parts In-Stock

1+ parts

-

100+ parts

$147.236

1k+ parts

-

10k+ parts

$134.966

1,539

-

$147.236

-

$134.966

Corphita

USA . 354 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

354

-

-

-

-

Corohmni

South Africa . 110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

110

-

-

-

-

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCVM1402-1LSENSVF1369 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B1369

Length:

35 mm

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1369,37X37,36

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

4 mm

Maximum Supply Voltage:

.724 V

Minimum Supply Voltage:

.676 V

Nominal Supply Voltage:

.7 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.92 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

XCVM1402-1LSENSVF1369 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20