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XCVM1802-2MSEVSVA2197

Xilinx

XCVM1802-2MSEVSVA2197 by Xilinx

XCVM1802-2MSEVSVA2197 by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-110 °C, with supply voltage range of 0.775-0.825 V. This GRID ARRAY IC is ideal for applications requiring high performance and compact design.

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Kenton Components

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Overview

Unlock unparalleled performance and versatility with the XCVM1802-2MSEVSVA2197 by Xilinx. As a leading manufacturer in the industry, Xilinx delivers cutting-edge technology that exceeds expectations. This microprocessor circuit offers endless possibilities for various applications, from IoT devices to automotive systems. Experience seamless integration, reliability, and efficiency with this innovative product. Elevate your projects with the unmatched quality and value that Xilinx brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 0.825 V

With a maximum supply voltage of 0.825 V, this product offers reliable performance within the specified voltage range.

No. of Terminals: 2197

The high number of terminals allows for versatile connectivity and functionality in complex electronic systems.

Minimum Operating Temperature: 0 °C

The product can operate efficiently in low-temperature environments, ensuring reliability in various conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of Tin Silver Copper provides excellent conductivity and corrosion resistance for long-term performance.

Width: 45 mm

The compact width of 45 mm makes the product suitable for applications where space is limited.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities, making it suitable for advanced applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCVM1802-2MSEVSVA2197 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B2197

JESD-609 Code:

e1

Length:

45 mm

No. of Terminals:

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA2197,47X47,36

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

4 mm

Maximum Supply Voltage:

.825 V

Minimum Supply Voltage:

.775 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.92 mm

Terminal Position:

BOTTOM

Width:

45 mm

Peripheral IC Type:

Trade Compliance

XCVM1802-2MSEVSVA2197 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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