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XCVM1802-1MSEVSVD1760

Xilinx

XCVM1802-1MSEVSVD1760 by Xilinx

XCVM1802-1MSEVSVD1760 by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.775-0.825 V. This GRID ARRAY IC is ideal for applications requiring high performance in a compact 40x40 mm package.

Median Price

$8,563.590

Lifecycle Status

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Nova Conductors

Japan . 100 parts In-Stock

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Vyrian

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One Stop Electronics

USA . 1,333 parts In-Stock

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AZTECH Wire

Italy . 371 parts In-Stock

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Semicontronic

India . 598 parts In-Stock

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Ampacity Inc.

Singapore . 801 parts In-Stock

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Corohmni

South Africa . 109 parts In-Stock

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MARBEL Systems

Belgium . 750 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 34,153 parts In-Stock

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Qasali Group International

UK . 3,196 parts In-Stock

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Aranea Global

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Argo Parts USA

USA . 3,671 parts In-Stock

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Continental Prestige Electronics

USA . 848 parts In-Stock

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Microchip USA

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Supply Digital

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Overview

Enhance your electronic designs with the XCVM1802-1MSEVSVD1760 by Xilinx. Known for their top-quality products, Xilinx delivers cutting-edge solutions in the category of Other Function uPs, uCs & Peripheral ICs. This versatile microprocessor circuit offers unmatched value and benefits, allowing you to create innovative and efficient systems. Whether you're building consumer electronics, industrial control systems, or automotive applications, the XCVM1802-1MSEVSVD1760 provides the performance and reliability you need. Upgrade your projects today with Xilinx!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making it a reliable choice.

Surface Mount: YES

This feature allows for easy installation and compact design, making it suitable for space-constrained applications.

Maximum Supply Voltage: 0.825 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing versatility.

Package Shape: SQUARE

The square shape makes it easy to mount and integrate into existing systems, saving space and simplifying installation.

No. of Terminals: 1760

With a large number of terminals, this product can support complex circuits and connections, offering flexibility in design.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

This package style provides efficient heat dissipation and reliable connections, enhancing overall performance.

Minimum Supply Voltage: 0.775 V

The low minimum supply voltage allows for energy-efficient operation and compatibility with a variety of power sources.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliability in extreme conditions, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures functionality in a wide range of environments, increasing usability.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides strong connections and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position allows for easy access and installation, making maintenance and repairs simple.

Maximum Seated Height: 4 mm

The low seated height enables compact designs and efficient use of space, making it ideal for small-scale applications.

Width: 40 mm

The width of 40 mm offers a balance between compact size and functionality, making it versatile in various applications.

Length: 40 mm

The length of 40 mm provides a square form factor, allowing for efficient mounting and compatibility with standard designs.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

This peripheral IC type offers advanced processing capabilities, making it suitable for complex applications.

Technology: CMOS

The CMOS technology used in this product ensures energy-efficient operation and high performance, enhancing overall efficiency.

Terminal Form: BALL

The ball terminal form provides strong connections and reliability, ensuring stable performance in demanding conditions.

Nominal Supply Voltage: 0.8 V

The nominal supply voltage of 0.8 V offers stability and compatibility with industry-standard power sources, ensuring reliable operation.

Terminal Pitch: 0.92 mm

With a small terminal pitch of 0.92 mm, this product allows for high-density connections and compact designs, making it ideal for space-constrained applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCVM1802-1MSEVSVD1760 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B1760

JESD-609 Code:

e1

Length:

40 mm

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1760,42X42,36

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

4 mm

Maximum Supply Voltage:

.825 V

Minimum Supply Voltage:

.775 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.92 mm

Terminal Position:

BOTTOM

Width:

40 mm

Peripheral IC Type:

Trade Compliance

XCVM1802-1MSEVSVD1760 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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