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XCVM1802-2MLEVSVA2197

Xilinx

XCVM1802-2MLEVSVA2197 by Xilinx

XCVM1802-2MLEVSVA2197 by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-110 °C, with supply voltage range of 0.775-0.825 V. This GRID ARRAY IC is ideal for applications requiring high performance and reliability in compact spaces.

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Overview

Unleash the power of cutting-edge technology with the XCVM1802-2MLEVSVA2197 by Xilinx. This high-quality product offers unmatched performance and reliability, showcasing the excellence of its manufacturer. Ideal for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this versatile device delivers exceptional value to customers. Experience seamless functionality and innovative solutions with the XCVM1802-2MLEVSVA2197, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good protection to the internal components of the IC, making it durable and reliable for long-term use.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving time and effort during assembly.

Maximum Supply Voltage: 0.825 V

The high maximum supply voltage allows for flexibility in power input, accommodating a range of different power sources.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space on the circuit board and allowing for efficient layout.

No. of Terminals: 2197

Having a large number of terminals allows for versatile connectivity options, making it suitable for complex circuit designs.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

This package style offers effective heat dissipation, ensuring optimal performance and reliability even under high operating temperatures.

Minimum Supply Voltage: 0.775 V

The low minimum supply voltage allows for efficient power consumption, making it suitable for energy-efficient applications.

Maximum Operating Temperature: 110 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and operate reliably in a wide range of settings.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments, making it suitable for various applications.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring stable connections and long-term reliability.

Terminal Position: BOTTOM

Having terminals at the bottom simplifies the installation process and allows for easy access during maintenance and troubleshooting.

Maximum Seated Height: 4 mm

The low maximum seated height helps in achieving a slim and compact overall design, ideal for space-constrained applications.

Width: 45 mm

The moderate width of the IC allows for easy integration into various circuit layouts while providing enough surface area for component placement.

Length: 45 mm

The moderate length of the IC offers a balanced form factor, making it suitable for different types of circuit board designs.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this IC offers advanced processing capabilities and versatile functions, making it suitable for a wide range of applications.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, making this IC efficient and reliable for various electronic devices.

Terminal Form: BALL

The ball terminal form provides easy and reliable connections, ensuring stable performance and easy integration into the circuit.

Nominal Supply Voltage: 0.8 V

The nominal supply voltage indicates the recommended operating voltage for optimal performance and efficiency of the IC.

Terminal Pitch: 0.92 mm

With a small terminal pitch, this IC allows for high-density mounting, enabling compact and efficient circuit board designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCVM1802-2MLEVSVA2197 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B2197

JESD-609 Code:

e1

Length:

45 mm

No. of Terminals:

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA2197,47X47,36

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

4 mm

Maximum Supply Voltage:

.825 V

Minimum Supply Voltage:

.775 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.92 mm

Terminal Position:

BOTTOM

Width:

45 mm

Peripheral IC Type:

Trade Compliance

XCVM1802-2MLEVSVA2197 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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