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XCVM1802-2LLIVSVA2197

Xilinx

XCVM1802-2LLIVSVA2197 by Xilinx

XCVM1802-2LLIVSVA2197 by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 110 °C, with supply voltage range of 0.676V to 0.724V. This GRID ARRAY IC, measuring 45mm x 45mm, has 2197 terminals and is ideal for various applications requiring high-performance processing capabilities.

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Vyrian

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AZTECH Wire

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Overview

Experience the cutting-edge technology of the XCVM1802-2LLIVSVA2197 by Xilinx, a top-tier manufacturer known for quality and innovation. This product falls under the category of Other Function uPs, uCs & Peripheral ICs, with a package style of GRID ARRAY, HEAT SINK/SLUG. From its wide temperature range to its superior terminal finish, this product offers unmatched reliability and performance. Discover the endless applications and benefits of the XCVM1802-2LLIVSVA2197, providing customers with exceptional value and advanced solutions for their technological needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good mechanical strength and thermal conductivity, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation onto printed circuit boards, saving time and labor costs.

Maximum Supply Voltage: 0.724 V

High maximum supply voltage allows for flexibility in power supply options, accommodating a wide range of applications.

Package Shape: SQUARE

Square package shape enables efficient use of space on the PCB, maximizing component density and minimizing footprint.

No. of Terminals: 2197

High number of terminals allows for versatile connectivity options and supports complex circuit configurations.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

Grid array package style with heat sink/slug enhances thermal performance, ensuring efficient heat dissipation and overall system reliability.

Minimum Supply Voltage: 0.676 V

Low minimum supply voltage enables energy-efficient operation and extends battery life in portable applications.

Maximum Operating Temperature: 110 °C

High maximum operating temperature ensures reliable performance in extreme environmental conditions, making the product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for operation in harsh cold environments, ensuring reliable functionality in diverse climates.

Terminal Finish: TIN SILVER COPPER

Terminal finish with tin, silver, and copper provides excellent electrical conductivity and corrosion resistance, enhancing long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, improving signal integrity and reducing electromagnetic interference.

Maximum Seated Height: 4 mm

Low maximum seated height minimizes the overall profile of the product, allowing for compact and space-saving designs.

Width: 45 mm

Standard width dimension facilitates compatibility with existing PCB designs and ensures easy integration into various system configurations.

Length: 45 mm

Standard length dimension enables seamless installation into standard board sizes, promoting ease of assembly and compatibility.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit offers powerful computing capabilities and advanced functionality, making the product suitable for demanding applications requiring complex processing tasks.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and reliable operation, ensuring efficient performance and energy efficiency.

Terminal Form: BALL

Ball terminal form facilitates reliable solder joints and ensures secure electrical connections, enhancing overall product durability and signal integrity.

Nominal Supply Voltage: 0.7 V

Stable nominal supply voltage provides consistent power delivery to the device, ensuring reliable operation and minimizing performance fluctuations.

Terminal Pitch: 0.92 mm

Narrow terminal pitch allows for high-density mounting, maximizing component integration and enabling compact system designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCVM1802-2LLIVSVA2197 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B2197

JESD-609 Code:

e1

Length:

45 mm

No. of Terminals:

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA2197,47X47,36

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

4 mm

Maximum Supply Voltage:

.724 V

Minimum Supply Voltage:

.676 V

Nominal Supply Voltage:

.7 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.92 mm

Terminal Position:

BOTTOM

Width:

45 mm

Peripheral IC Type:

Trade Compliance

XCVM1802-2LLIVSVA2197 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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