Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
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Other Function uPs,uCs & Peripheral ICs XCVM1402-2MSINBVB1024 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx
JESD-30 Code:
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XCVM1402-2MSINBVB1024 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
1N4148
General Diode
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 1;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
2N2222A
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
CRCW06030000Z0EAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06030000Z0EAHP is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating temp range -55 to 155 °C, it's SMT package style makes it ideal for automotive applications meeting AEC-Q200 standard.
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
2N7002-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
LM555CM
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BAV99
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Gec Plessey Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WS-7-F
Diodes Incorporated
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
LM317TG
Texas Instruments
LM317TG by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max output current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount, with a rectangular shape and through-hole terminals for easy installation.
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
SS14
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MCIMX6U5DVM10ACR
NXP Semiconductors
MCIMX6U5DVM10ACR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.35-1.5 V. Ideal for applications requiring low profile and fine pitch package style in a square shape with 624 terminals.
MCIMX7D2DVM12SD
MCIMX7D2DVM12SD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 1.2-1.25 V. Ideal for applications requiring low profile and fine pitch package style in a grid array format.
FT800Q-R
FTDI
FTDI's FT800Q-R is a 48-terminal chip carrier IC with CMOS technology. It operates b/w -40 to 85 °C, suitable for industrial applications. With a supply voltage range of 2.97-3.63 V, it is ideal for microprocessor circuits requiring a compact form factor and low power consumption.
AM5716AABCXEA
AM5716AABCXEA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for industrial applications requiring high performance in compact spaces.
SM-K26-XCL2GI
Xilinx
PSoC;
ESP32-C3-MINI-1-N4
Espressif Systems (Shanghai)
ESP32-C3-MINI-1-N4 by Espressif Systems is a 53-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for IoT applications due to its compact size and surface mount capability.
A5000R2HQ1/Z016UZ
NXP Semiconductors A5000R2HQ1/Z016UZ is a cryptographic authenticator IC with 20 terminals, CMOS technology, and 1.8V nominal voltage. It operates b/w -40 to 105 °C and has a max supply voltage of 3.6V. Ideal for secure applications requiring high-level encryption in compact designs.
ATECC608B-SSHDA-T
Microchip Technology
ATECC608B-SSHDA-T by Microchip Technology is a cryptographic authenticator IC with I2C bus compatibility. It operates b/w -40 to 85°C, has a supply voltage range of 2-5.5V, and comes in a small outline package suitable for industrial applications.
PN5321A3HN/C106,55
NXP Semiconductors' PN5321A3HN/C106,55 is a 40-terminal chip carrier with 3/5V power supplies. It operates b/w -30 to 85°C, has a peak reflow temp of 260°C, and consumes up to 150mA. Ideal for applications requiring NFC functionality like contactless payment systems and access control devices.
CC3200MODR1M2AMOBR
CC3200MODR1M2AMOBR by Texas Instruments is a 63-terminal chip carrier with 3.6V max supply voltage, ideal for commercial-grade microprocessor circuits. Featuring 4-Ch 12-Bit ADC channels and I2C/SPI/UART bus compatibility, it operates b/w -20 to 70°C with a compact size of 20.5mm x 17.5mm x 2.45mm for various IoT applications.
XC7Z030-3FBG484E
The Xilinx XC7Z030-3FBG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 484 terminals in a square grid array package, it's ideal for various applications requiring high-performance microprocessors and peripheral ICs.
ESP32-S3-WROOM-1-N8
ESP32-S3-WROOM-1-N8 by Espressif Systems is a SoC with 41 terminals, operating at 3.3V, suitable for IoT applications. It has a max supply voltage of 3.6V, temp range -40 to 85°C, and compact dimensions (18mm x 25.5mm).
MCIMX6S5DVM10AC
Freescale Semiconductor
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
XCZU9EG-1FFVB1156I
XCZU9EG-1FFVB1156I by Xilinx is a CMOS MICROPROCESSOR CIRCUIT with 1156 terminals in a GRID ARRAY package. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high-performance processing capabilities.
CC2540F256RHAR
CC2540F256RHAR by Texas Instruments is a 40-terminal microprocessor circuit with 8192 RAM bytes. Operating at -40 to 85 °C, it supports SPI, USART, and USB bus compatibility. Ideal for industrial applications requiring comparators and timers in a compact square chip carrier package.
XC7Z030-1FBG676C
The Xilinx XC7Z030-1FBG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage ranging from 0.95V to 1.05V. With a package style of Grid Array and 676 terminals, it's ideal for various applications in Other Function uPs,uCs & Peripheral ICs.
NRF5340-CLAA-R
Nordic Semiconductor Asa
Nordic Semiconductor's NRF5340-CLAA-R is a cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 105 °C and supports supply voltage range of 1.7V to 3.6V. This rectangular package has 95 terminals in a grid array style, making it suitable for secure IoT applications.
XC7Z030-2FBG484I
The Xilinx XC7Z030-2FBG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, suitable for various applications requiring high-performance processing capabilities.
XCZU7EV-2FFVF1517E
XCZU7EV-2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance and reliability in compact designs.
CY8C6347BZI-BLD33
Infineon Technologies
PROGRAMMABLE SoC; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3;
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XCVM1802-1MSEVSVD1760
XCVM1802-1MSEVSVD1760 by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.775-0.825 V. This GRID ARRAY IC is ideal for applications requiring high performance in a compact 40x40 mm package.
XCVM1402-1MSEVFVC1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVM1802-2MSEVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .825 V;
XCVM1102-1MLISFVB625
MICROPROCESSOR CIRCUIT;
XCVM1102-1MSISFVA784
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
XCVM1802-1LSIVSVD1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;
XCVM1802-2LLIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
XCVM1802-2MLEVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; JESD-609 Code: e1;
XCVM1102-1HLESFVA784
MICROPROCESSOR CIRCUIT; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1;
XCVM1102-1GLESFVA784
MICROPROCESSOR CIRCUIT; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER;
XCVM1102-1HLEVFVB1024
XCVM1102-1GSIVFVB1024
XCVM1102-1DSIVFVB1024
XCVM1102-1HLESFVB625
XCVM1102-1DLIVFVB1024
XCVM1102-1HLISFVA784
XCVM1102-1DLEVFVB1024
XCVM1102-1DSESFVA784
XCVM1102-1GLISFVA784
XCVM1102-1GLIVFVB1024
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