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BALL Other Function uPs,uCs & Peripheral ICs 1,582

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XOMAPL137AZKB3 by Texas Instruments

XOMAPL137AZKB3

Texas Instruments

XOMAPL137AZKB3 by Texas Instruments is a 256-terminal IC with power supplies of 1.2V, 1.8/3.3V, operating b/w 0-70°C. It features a square package shape made of plastic/epoxy material and is surface mountable. Ideal for commercial applications requiring high-performance microcontrollers and peripheral functions in a compact grid array package style.

S-PBGA-B256

256

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

1.2,1.8/3.3

Not Qualified

Other Microprocessor ICs

YES

COMMERCIAL

BALL

1 mm

BOTTOM

TDA8026ET/C2,518 by NXP Semiconductors

TDA8026ET/C2,518

NXP Semiconductors

TDA8026ET/C2,518 by NXP Semiconductors is a microprocessor circuit with a 3.3V supply and operates b/w -25 °C to 85 °C. It features a fine pitch grid array package with 64 terminals and supports surface mount technology. Ideal for various embedded applications, it ensures reliable performance in compact designs.

S-PBGA-B64

e1

2

64

85 Cel

-25 Cel

PLASTIC/EPOXY

FBGA

BGA64,8X8,32

SQUARE

GRID ARRAY, FINE PITCH

260

3.3

Not Qualified

Other Microprocessor ICs

260 mA

3.3 V

YES

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

MICROPROCESSOR CIRCUIT

TDA8026ET/C2,551 by NXP Semiconductors

TDA8026ET/C2,551

NXP Semiconductors

NXP Semiconductors TDA8026ET/C2,551 is a MICROPROCESSOR CIRCUIT with 64 terminals and 3.3V supply voltage. It operates b/w -25 to 85°C, suitable for various applications requiring a fine pitch GRID ARRAY package style. With a peak reflow temp of 260°C, it's ideal for SMT assembly in electronics manufacturing.

S-PBGA-B64

2

64

85 Cel

-25 Cel

PLASTIC/EPOXY

FBGA

BGA64,8X8,32

SQUARE

GRID ARRAY, FINE PITCH

260

3.3

Not Qualified

Other Microprocessor ICs

260 mA

3.3 V

YES

OTHER

BALL

.8 mm

BOTTOM

MICROPROCESSOR CIRCUIT

TDA8026ET/C2,557 by NXP Semiconductors

TDA8026ET/C2,557

NXP Semiconductors

TDA8026ET/C2,557 by NXP Semiconductors is a microprocessor circuit in a square grid array package. It operates at 3.3V with a max current of 260mA and supports temperatures from -25 °C to 85 °C. Ideal for compact electronic applications requiring efficient processing.

S-PBGA-B64

2

64

85 Cel

-25 Cel

PLASTIC/EPOXY

FBGA

BGA64,8X8,32

SQUARE

GRID ARRAY, FINE PITCH

260

3.3

Not Qualified

Other Microprocessor ICs

260 mA

3.3 V

YES

OTHER

BALL

.8 mm

BOTTOM

MICROPROCESSOR CIRCUIT

PN7120A0EV/C10801E by NXP Semiconductors

PN7120A0EV/C10801E

NXP Semiconductors

NXP Semiconductors' PN7120A0EV/C10801E is a 49-terminal IC with 1.8V supply voltage, operating b/w -30°C to 85°C. It features a grid array package style, ball terminal form, and tin silver copper finish. Ideal for applications requiring fine pitch surface mount technology in plastic/epoxy packages.

S-PBGA-B49

e1

3

49

85 Cel

-30 Cel

PLASTIC/EPOXY

FBGA

BGA49,7X7,20

SQUARE

GRID ARRAY, FINE PITCH

260

1.8

Not Qualified

Other uPs/uCs/Peripheral ICs

1.8 V

YES

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

TMS320DM335CZCE216 by Texas Instruments

TMS320DM335CZCE216

Texas Instruments

TMS320DM335CZCE216 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.3-3.3V, it has a peak reflow temp of 260°C and operates b/w 0-85°C. Ideal for applications requiring a low-profile, fine-pitch grid array package style.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM335DZCE135 by Texas Instruments

TMS320DM335DZCE135

Texas Instruments

TMS320DM335DZCE135 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low power consumption and high processing capabilities.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM335DZCE216 by Texas Instruments

TMS320DM335DZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

MCIMX535DVV1B by Freescale Semiconductor

MCIMX535DVV1B

Freescale Semiconductor

MCIMX535DVV1B by Freescale Semiconductor is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 85 °C, with supply voltage range of 1.2-1.3 V. Ideal for applications requiring fine pitch grid array package style and 529 terminals in a square shape.

S-PBGA-B529

e2

19 mm

3

529

85 Cel

-20 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

Not Qualified

1.85 mm

1.3 V

1.2 V

1.25 V

YES

CMOS

Tin/Silver (Sn/Ag)

BALL

.8 mm

BOTTOM

40

19 mm

SYSTEM ON CHIP

OMAPL132BZWTA2E by Texas Instruments

OMAPL132BZWTA2E

Texas Instruments

OMAPL132BZWTA2E by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.95V to 1.2V, making it suitable for low power applications. With a compact SQUARE shape and BALL terminal form, it is ideal for space-constrained designs requiring high performance.

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

S-PBGA-B361

e1

16 mm

3

361

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8/3.3

Not Qualified

1.4 mm

Other Microprocessor ICs

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM368ZCEDF by Texas Instruments

TMS320DM368ZCEDF

Texas Instruments

TMS320DM368ZCEDF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates in industrial temperature range (-40 to 85 °C) and supports I2C, SPI, UART, USB buses. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low profile and fine pitch package style.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.42 V

1.28 V

1.35 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

OMAPL132BZWT2 by Texas Instruments

OMAPL132BZWT2

Texas Instruments

OMAPL132BZWT2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.95V to 1.2V, making it suitable for low-power applications. With a compact size of 16mm x 16mm and surface-mount capability, it is ideal for space-constrained designs in various electronic devices.

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

S-PBGA-B361

e1

16 mm

3

361

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8/3.3

Not Qualified

1.4 mm

Other Microprocessor ICs

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL132BZWTA2 by Texas Instruments

OMAPL132BZWTA2

Texas Instruments

OMAPL132BZWTA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.95V to 1.2V and is suitable for applications requiring low profile, fine pitch ICs. With CMOS technology and TIN SILVER COPPER finish, it offers high performance in compact designs.

ALSO OPERATES AT 1.2 V TYP

S-PBGA-B361

e1

16 mm

3

361

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8/3.3

Not Qualified

1.4 mm

Other Microprocessor ICs

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM6441BZWT by Texas Instruments

TMS320DM6441BZWT

Texas Instruments

TMS320DM6441BZWT by Texas Instruments is a 32-bit microprocessor with 20480 RAM words, operating at -40 to 85°C. It supports Ethernet, I2C, SPI, UART, and USB buses for various applications like multimedia systems and industrial automation due to its low profile grid array package.

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

32

ETHERNET; I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B316

e1

16 mm

3

316

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.05/1.2,1.8,3.3

Not Qualified

20480

1.4 mm

Digital Signal Processors

1.1 V

1 V

1.05 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM6443BZWT by Texas Instruments

TMS320DM6443BZWT

Texas Instruments

TMS320DM6443BZWT by Texas Instruments is a 32-bit microprocessor with 20480 RAM words. It operates at 1.14-1.26 V, suitable for MICROPROCESSOR CIRCUIT applications like ETHERNET, I2C, SPI, UART, and USB interfaces. The package style is GRID ARRAY with low profile and fine pitch design for compact setups.

32

ETHERNET; I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B316

e1

16 mm

3

316

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8/3.3

Not Qualified

20480

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

XC7Z010-1CLG400C by Xilinx

XC7Z010-1CLG400C

Xilinx

XC7Z010-1CLG400C by Xilinx is a 400-terminal, low-profile, fine-pitch grid array package with a max supply voltage of 1.05V. It is a system-on-chip (SoC) peripheral IC that operates in temperatures ranging from 0 to 85°C. This versatile device is commonly used in various applications requiring high-performance computing and integrated functionality.

S-PBGA-B400

e1

17 mm

3

400

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z010-1CLG400I by Xilinx

XC7Z010-1CLG400I

Xilinx

The Xilinx XC7Z010-1CLG400I is a System on Chip with 400 terminals, operating b/w -40 to 100 °C. It features a low profile grid array package style and CMOS technology, suitable for various applications requiring high performance in a compact form factor. With a supply voltage range of 0.95V to 1.05V, it is ideal for projects demanding efficient power consumption and advanced processing capabilities.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z010-2CLG400E by Xilinx

XC7Z010-2CLG400E

Xilinx

The Xilinx XC7Z010-2CLG400E is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. It operates b/w 0-100°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact form factors.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z010-2CLG400I by Xilinx

XC7Z010-2CLG400I

Xilinx

XC7Z010-2CLG400I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z010-3CLG400E by Xilinx

XC7Z010-3CLG400E

Xilinx

XC7Z010-3CLG400E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. This low-profile chip in a grid array package is ideal for various applications requiring high performance and compact design.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-1CLG400I by Xilinx

XC7Z020-1CLG400I

Xilinx

The Xilinx XC7Z020-1CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-1CLG484C by Xilinx

XC7Z020-1CLG484C

Xilinx

XC7Z020-1CLG484C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05 V. This low profile, fine pitch chip in a grid array package is ideal for various applications requiring high performance and integration.

S-PBGA-B484

19 mm

484

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-1CLG484I by Xilinx

XC7Z020-1CLG484I

Xilinx

XC7Z020-1CLG484I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. This low profile chip in grid array package is ideal for various applications requiring high performance and compact design.

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-2CLG400E by Xilinx

XC7Z020-2CLG400E

Xilinx

The Xilinx XC7Z020-2CLG400E is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. It operates b/w 0-100°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact designs.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-2CLG484E by Xilinx

XC7Z020-2CLG484E

Xilinx

The Xilinx XC7Z020-2CLG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 484 terminals in a low profile grid array package, it's ideal for various embedded applications requiring high-performance processing capabilities.

S-PBGA-B484

19 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-2CLG484I by Xilinx

XC7Z020-2CLG484I

Xilinx

The Xilinx XC7Z020-2CLG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it is ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-3CLG400E by Xilinx

XC7Z020-3CLG400E

Xilinx

The Xilinx XC7Z020-3CLG400E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-3CLG484E by Xilinx

XC7Z020-3CLG484E

Xilinx

The Xilinx XC7Z020-3CLG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. This low profile chip in a square package is ideal for various applications requiring high performance and integration capabilities.

S-PBGA-B484

19 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

TMS320DM368ZCE48 by Texas Instruments

TMS320DM368ZCE48

Texas Instruments

TMS320DM368ZCE48 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it ideal for applications requiring low power consumption and high performance in compact designs.

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM368ZCED48F by Texas Instruments

TMS320DM368ZCED48F

Texas Instruments

TMS320DM368ZCED48F by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating at -40 to 85°C. It features a max supply voltage of 1.42V and supports I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile package with fine pitch grid array style.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.42 V

1.28 V

1.35 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUT4 by Texas Instruments

TMS320DM6467CCUT4

Texas Instruments

TMS320DM6467CCUT4 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.26V and supports I2C, PCI, SPI, UART, and USB buses. Ideal for applications requiring a MICROPROCESSOR CIRCUIT in a compact GRID ARRAY package style.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTAV by Texas Instruments

TMS320DM6467CCUTAV

Texas Instruments

TMS320DM6467CCUTAV by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at -40 to 105 °C. It supports I2C, PCI, SPI, UART, USB buses and has a terminal pitch of 0.8 mm. Ideal for industrial applications requiring high-speed data processing in compact form factors.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTD7 by Texas Instruments

TMS320DM6467CCUTD7

Texas Instruments

TMS320DM6467CCUTD7 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at -40 to 85°C. It features a 16-bit external data bus width and supports I2C, PCI, SPI, UART, and USB buses. Ideal for industrial applications requiring a CMOS technology-based microprocessor circuit in a compact square package.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTV by Texas Instruments

TMS320DM6467CCUTV

Texas Instruments

TMS320DM6467CCUTV by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.26V and supports various bus compatibilities like I2C, PCI, SPI, UART, and USB. Ideal for applications requiring a high-performance microprocessor circuit in a compact square package style.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUT by Texas Instruments

TMS320DM6467CCUT

Texas Instruments

TMS320DM6467CCUT by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.26V and supports I2C, PCI, SPI, UART, and USB buses. Ideal for applications requiring a fixed-point format and external data bus width of 16 bits.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CGUTA6 by Texas Instruments

TMS320DM6467CGUTA6

Texas Instruments

TMS320DM6467CGUTA6 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.14-1.26V, it has a max temp of 85°C and uses CMOS technology. Ideal for applications requiring MICROPROCESSOR CIRCUIT in a PLASTIC/EPOXY package style with 529 terminals.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e0

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

220

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN LEAD

BALL

.8 mm

BOTTOM

20

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TCUT1 by Texas Instruments

TMS320DM6467TCUT1

Texas Instruments

TMS320DM6467TCUT1 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at max 35 MHz. It has a supply voltage range of 1.235-1.365 V and supports Ethernet, I2C, SPI, UART, USB buses. Ideal for applications requiring high-speed processing in compact devices.

ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

35 MHz

48

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TCUT9 by Texas Instruments

TMS320DM6467TCUT9

Texas Instruments

TMS320DM6467TCUT9 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at max 35 MHz. It features 8192 RAM words, 48-bit external data bus width, and supports Ethernet, I2C, SPI, UART & USB. Ideal for applications requiring high-speed processing in a compact form factor.

ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

35 MHz

48

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TCUTD1 by Texas Instruments

TMS320DM6467TCUTD1

Texas Instruments

TMS320DM6467TCUTD1 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at max 35 MHz. Ideal for industrial applications, it supports Ethernet, I2C, SPI, UART, and USB bus compatibility with a supply voltage range of 1.3-3.3V.

ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

35 MHz

48

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TZUT9 by Texas Instruments

TMS320DM6467TZUT9

Texas Instruments

TMS320DM6467TZUT9 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.3V, it has a max supply voltage of 1.365V and supports power supplies of 1.8/3.3V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring high performance in a compact form factor, with a package style of GRID ARRAY and FINE PITCH.

ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS32DM6467CCUTAV6 by Texas Instruments

TMS32DM6467CCUTAV6

Texas Instruments

TMS32DM6467CCUTAV6 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at -40 to 105 °C. It features a package style of GRID ARRAY, FINE PITCH and supports I2C, PCI, SPI, UART, USB buses. Ideal for industrial applications requiring high-performance computing in compact form factors.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

XC7Z030-1FFG676I by Xilinx

XC7Z030-1FFG676I

Xilinx

The Xilinx XC7Z030-1FFG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

LM8330TME/NOPB by Texas Instruments

LM8330TME/NOPB

Texas Instruments

LM8330TME/NOPB by Texas Instruments is a MICROPROCESSOR CIRCUIT with 128-bit Address Bus Width. It operates b/w -30 to 85 °C, with supply voltage range of 1.62V to 1.98V. Ideal for applications requiring low power consumption and compact design due to its very thin profile and fine pitch package style.

128

S-PBGA-B25

e1

2.01 mm

1

20

20

25

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

BGA25,5X5,16

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

.03 mA

1.98 V

1.62 V

1.8 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.01 mm

MICROPROCESSOR CIRCUIT

LM8330TMX/NOPB by Texas Instruments

LM8330TMX/NOPB

Texas Instruments

LM8330TMX/NOPB by Texas Instruments is a CMOS MICROPROCESSOR CIRCUIT with 128-bit Address Bus Width. It operates b/w -30 to 85 °C, with Supply Voltage ranging from 1.62V to 1.98V. Ideal for applications requiring low power consumption and compact design in electronics industry.

128

S-PBGA-B25

e1

2.01 mm

1

20

20

25

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

BGA25,5X5,16

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

.03 mA

1.98 V

1.62 V

1.8 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.01 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTA6 by Texas Instruments

TMS320DM6467CCUTA6

Texas Instruments

TMS320DM6467CCUTA6 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating b/w 0-85°C. It features a 16-bit external data bus width and supports I2C, PCI, SPI, UART, and USB buses. This MICROPROCESSOR CIRCUIT is ideal for applications requiring fixed-point format processing in various industries.

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTA by Texas Instruments

TMS320DM6467CCUTA

Texas Instruments

TMS320DM6467CCUTA by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates b/w 0-85°C, supports I2C, PCI, SPI, UART, USB buses and has a supply voltage range of 1.14-1.26V. Ideal for applications requiring high processing power in compact designs.

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTV6 by Texas Instruments

TMS320DM6467CCUTV6

Texas Instruments

TMS320DM6467CCUTV6 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at temperatures from 0 to 85°C. It has a package style of grid array and fine pitch, with a terminal finish of Sn/Ag/Cu. Ideal for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility.

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

XC7Z030-2FFG676I by Xilinx

XC7Z030-2FFG676I

Xilinx

Xilinx XC7Z030-2FFG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP