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TMS320DM6467TCUT1

Texas Instruments

TMS320DM6467TCUT1 by Texas Instruments

TMS320DM6467TCUT1 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at max 35 MHz. It has a supply voltage range of 1.235-1.365 V and supports Ethernet, I2C, SPI, UART, USB buses. Ideal for applications requiring high-speed processing in compact devices.

Median Price

$151.600

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,850 parts In-Stock

1+ parts

$127.841

100+ parts

$115.718

1k+ parts

$110.208

10k+ parts

-

2,850

$127.841

$115.718

$110.208

-

Rochester

USA . 9 parts In-Stock

1+ parts

$151.600

100+ parts

$142.500

1k+ parts

$133.410

10k+ parts

-

9

$151.600

$142.500

$133.410

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DigiKey

USA . 9 parts In-Stock

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9

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Verical

USA . 9 parts In-Stock

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-

100+ parts

$178.125

1k+ parts

$166.762

10k+ parts

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9

-

$178.125

$166.762

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,293 parts In-Stock

1+ parts

$121.449

100+ parts

-

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2,293

$121.449

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DigiKey Marketplace

USA . 9 parts In-Stock

1+ parts

$159.200

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-

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9

$159.200

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Vyrian

USA . 5,871 parts In-Stock

1+ parts

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5,871

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ACDS - Activité Composants Distribution Service

France . 81 parts In-Stock

1+ parts

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81

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Rebound Electronics

UK . 14 parts In-Stock

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Odintec Ltd.

Israel . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 662 parts In-Stock

1+ parts

$53.517

100+ parts

-

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-

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662

$53.517

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Parana Technologies

USA . 407 parts In-Stock

1+ parts

$60.934

100+ parts

$5,658.632

1k+ parts

$54.840

10k+ parts

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407

$60.934

$5,658.632

$54.840

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DigiPath Technology Company

USA . 826 parts In-Stock

1+ parts

$67.096

100+ parts

-

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826

$67.096

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ChromeModa Solutions

Germany . 1,956 parts In-Stock

1+ parts

$68.465

100+ parts

$56.141

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10k+ parts

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1,956

$68.465

$56.141

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IDEA Electronic Components Group

UK . 420 parts In-Stock

1+ parts

$68.465

100+ parts

$65.042

1k+ parts

$61.618

10k+ parts

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420

$68.465

$65.042

$61.618

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Corphita

USA . 4,628 parts In-Stock

1+ parts

$115.057

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4,628

$115.057

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Ampacity Inc.

Singapore . 589 parts In-Stock

1+ parts

$236.510

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589

$236.510

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Lixinc

USA . 13,043 parts In-Stock

1+ parts

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13,043

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Futuretech Components

Singapore . 200 parts In-Stock

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200

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Authorized Procurement Solutions

USA . 81 parts In-Stock

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81

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Overview

Unlock the power of innovation with the TMS320DM6467TCUT1 by Texas Instruments. Crafted with precision and expertise, this cutting-edge microprocessor circuit offers unparalleled performance and reliability. Ideal for a wide range of applications including Ethernet, I2C, SPI, UART, and USB, this product is designed to exceed your expectations. Experience seamless integration, high-speed processing, and unmatched efficiency with the TMS320DM6467TCUT1. Elevate your projects to new heights with Texas Instruments quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for its durability and cost-effectiveness, making the product sturdy and affordable.

Surface Mount: YES

Surface mount technology allows for more efficient assembly processes and saves space on the circuit board.

Maximum Supply Voltage: 1.365 V

Operating within this voltage range ensures stability and reliability of the product.

Package Shape: SQUARE

Square packages are space-efficient and allow for easy integration into circuit designs.

Bit Size: 32

A larger bit size enables the product to handle more complex tasks and data processing.

Power Supplies (V): 1.3,1.8/3.3

Support for multiple power supply voltages offers flexibility in different operating environments.

No. of Terminals: 529

Having a high number of terminals allows for connectivity to various external components and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style ensures high density mounting and efficient signal routing.

Minimum Supply Voltage: 1.235 V

A low minimum supply voltage helps in reducing power consumption and operating costs.

Maximum Operating Temperature: 85 °C

Being able to operate at high temperatures ensures the product's reliability in various environments.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures expands the product's usability in different conditions.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance, ensuring long-term performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and routing of traces.

Maximum Seated Height: 3.3 mm

A low seated height helps in reducing the overall profile of the product and enables compact designs.

RAM Words: 8192

Having a large RAM capacity allows for efficient data storage and processing.

Width: 19 mm

The compact width of the product helps in fitting into space-constrained designs.

External Data Bus Width: 48

A wider data bus allows for faster data transfer and communication with external devices.

Maximum Clock Frequency: 35 MHz

Operating at a high clock frequency enables fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

This spec ensures that the product can withstand reflow soldering processes for a sufficient duration without damage.

Peak Reflow Temperature °C: 245

Withstanding high reflow temperatures ensures the product's reliability during manufacturing processes.

Length: 19 mm

The compact length of the product contributes to its space-saving design.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit allows the product to perform complex computing tasks efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the product's efficiency.

Terminal Form: BALL

Ball terminals provide reliable connections and are suitable for high-density packaging.

Nominal Supply Voltage: 1.3 V

Operating at a nominal supply voltage of 1.3V ensures compatibility with standard power sources.

Bus Compatibility: ETHERNET; I2C; SPI; UART; USB

Support for multiple bus interfaces enables seamless communication with a wide range of peripherals and devices.

Terminal Pitch: 0.8 mm

A small terminal pitch allows for high-density mounting and space-efficient PCB layouts.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances computational efficiency.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the product has a moderate sensitivity to moisture, requiring standard handling procedures.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467TCUT1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Bus Compatibility:

ETHERNET; I2C; SPI; UART; USB

Maximum Clock Frequency:

35 MHz

External Data Bus Width:

48

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.3,1.8/3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467TCUT1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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