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TMS32DM6467CCUTAV6

Texas Instruments

TMS32DM6467CCUTAV6 by Texas Instruments

TMS32DM6467CCUTAV6 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at -40 to 105 °C. It features a package style of GRID ARRAY, FINE PITCH and supports I2C, PCI, SPI, UART, USB buses. Ideal for industrial applications requiring high-performance computing in compact form factors.

Median Price

$116.950

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,758 parts In-Stock

1+ parts

$113.074

100+ parts

$109.673

1k+ parts

$85.018

10k+ parts

-

1,758

$113.074

$109.673

$85.018

-

Rochester

USA . 235 parts In-Stock

1+ parts

$116.950

100+ parts

$109.930

1k+ parts

$102.920

10k+ parts

-

235

$116.950

$109.930

$102.920

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DigiKey

USA . 235 parts In-Stock

1+ parts

-

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-

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10k+ parts

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235

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Verical

USA . 235 parts In-Stock

1+ parts

-

100+ parts

$137.412

1k+ parts

$128.650

10k+ parts

-

235

-

$137.412

$128.650

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 468 parts In-Stock

1+ parts

$107.420

100+ parts

-

1k+ parts

-

10k+ parts

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468

$107.420

-

-

-

DigiKey Marketplace

USA . 252 parts In-Stock

1+ parts

$122.810

100+ parts

-

1k+ parts

-

10k+ parts

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252

$122.810

-

-

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Vyrian

USA . 2,140 parts In-Stock

1+ parts

-

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2,140

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,468 parts In-Stock

1+ parts

$17.005

100+ parts

-

1k+ parts

$17.230

10k+ parts

-

1,468

$17.005

-

$17.230

-

ChromeModa Solutions

Germany . 6,652 parts In-Stock

1+ parts

$19.107

100+ parts

$15.668

1k+ parts

-

10k+ parts

-

6,652

$19.107

$15.668

-

-

IDEA Electronic Components Group

UK . 2,083 parts In-Stock

1+ parts

$19.107

100+ parts

$18.152

1k+ parts

$17.196

10k+ parts

-

2,083

$19.107

$18.152

$17.196

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Corphita

USA . 3,956 parts In-Stock

1+ parts

$101.767

100+ parts

-

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10k+ parts

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3,956

$101.767

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Corohmni

South Africa . 2,728 parts In-Stock

1+ parts

$116.990

100+ parts

-

1k+ parts

-

10k+ parts

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2,728

$116.990

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-

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Microchip USA

USA . 374 parts In-Stock

1+ parts

$459.400

100+ parts

$451.050

1k+ parts

$451.050

10k+ parts

$442.690

374

$459.400

$451.050

$451.050

$442.690

DigiPath Technology Company

USA . 1,233 parts In-Stock

1+ parts

-

100+ parts

$17.227

1k+ parts

-

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1,233

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$17.227

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Kepictronics

USA . 79 parts In-Stock

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79

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Overview

Experience the cutting-edge technology of the TMS32DM6467CCUTAV6 by Texas Instruments, a premier manufacturer in semiconductor solutions. This versatile microprocessor circuit offers a wide range of applications in various industries, delivering exceptional performance and reliability. With its advanced features and high-quality construction, this IC provides unmatched value to customers seeking top-tier functionality and efficiency. Trust Texas Instruments to provide innovative solutions that exceed expectations and drive success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the IC.

Surface Mount: YES

The surface-mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage ensures stable and reliable operation of the IC within a safe voltage limit.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, optimizing layout and design.

Bit Size: 32

The 32-bit architecture enables efficient processing of data and instructions, making this IC suitable for handling complex tasks and calculations.

Power Supplies (V): 1.2, 1.8, 3.3

The availability of multiple power supply options offers flexibility in voltage selection for different applications, ensuring compatibility and versatility.

No. of Terminals: 529

The high number of terminals allows for versatile connectivity and integration with other components in a system, enabling seamless communication and data transfer.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style facilitates precise placement and soldering of the IC onto the circuit board, ensuring reliable connections and signal integrity.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in reducing power consumption and improving energy efficiency of the IC, ideal for battery-operated devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range indicates robust thermal performance of the IC, allowing it to operate reliably in challenging environments and conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range makes the IC suitable for use in extreme cold environments without compromising performance or functionality.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin, silver, and copper for terminal finish enhances conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and routing, making it easier to connect the IC to other components and peripherals in the system.

Maximum Seated Height: 3.3 mm

The low maximum seated height minimizes the overall profile of the IC on the circuit board, allowing for compact and space-saving designs in tight enclosure spaces.

RAM Words: 8192

The large RAM capacity of 8192 words provides sufficient memory for storing data and instructions, supporting multitasking and complex computing operations.

Width: 19 mm

The compact width dimension enables easy integration of the IC into various electronic devices and systems, optimizing space utilization and layout efficiency.

External Data Bus Width: 16

The wide external data bus width of 16 bits allows for fast data transfer and efficient communication between the IC and external devices, enhancing performance and speed.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance of 245°C ensures reliable soldering and assembly processes, preventing solder joint failures and ensuring quality production.

Length: 19 mm

The compact length dimension of 19 mm contributes to the overall small form factor of the IC, enabling easy installation and integration into space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation indicates that the IC is designed to withstand harsh environmental conditions and temperature fluctuations, making it suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The peripheral IC type of microprocessor circuit indicates that the IC is equipped with processing capabilities and peripheral interfaces for handling various functions in a system.

Technology: CMOS

The CMOS technology used in the IC offers low power consumption, high speed, and noise immunity, making it an energy-efficient and reliable choice for various applications.

Terminal Form: BALL

The ball terminal form provides reliable and secure connections with the PCB, ensuring stable electrical contact and signal transmission.

Nominal Supply Voltage: 1.2 V

The precise nominal supply voltage of 1.2 V ensures consistent and optimized performance of the IC, maintaining stability and reliability in operation.

Bus Compatibility: I2C; PCI; SPI; UART; USB

The compatibility with various bus protocols such as I2C, PCI, SPI, UART, and USB allows for seamless integration with different communication interfaces and peripherals, enhancing versatility and connectivity.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8 mm enables high-density packaging and efficient layout design on the PCB, optimizing space utilization and signal routing.

Format: FIXED POINT

The fixed-point format provides accuracy and precision in numerical calculations and data processing, ensuring reliable performance in mathematical operations and algorithms.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that the IC has moderate sensitivity to moisture exposure, requiring proper handling and storage to prevent damage and ensure longevity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS32DM6467CCUTAV6 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Bus Compatibility:

I2C; PCI; SPI; UART; USB

External Data Bus Width:

16

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS32DM6467CCUTAV6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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