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BALL Other Function uPs,uCs & Peripheral ICs 1,582

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
TCI6638K2KDAAWA2 by Texas Instruments

TCI6638K2KDAAWA2

Texas Instruments

TCI6638K2KDAAWA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at 0.95-1.05 V and has a peak reflow temperature of 245°C, making it suitable for high-performance computing applications. The CMOS technology and compact size of 40x40 mm make it ideal for advanced embedded systems requiring efficient processing power.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

CP3SP33SMS/NOPB by Texas Instruments

CP3SP33SMS/NOPB

Texas Instruments

CP3SP33SMS/NOPB by Texas Instruments is a 16-bit microprocessor with 32-bit external data bus width, operating at speeds up to 96 rpm. It features a low profile grid array package style with 224 terminals and supports I2C, I2S, SPI, UART, and USB buses. Ideal for industrial applications requiring high-speed processing in a compact form factor.

16

I2C; I2S; SPI; UART; USB

CR16C

32

S-PBGA-B224

e0

13 mm

3

224

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA224,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

Not Qualified

32768

1.4 mm

96 rpm

Microcontrollers

200 mA

1.98 V

1.62 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN LEAD

BALL

.8 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

M82710-14 by Mindspeed Technologies

M82710-14

Mindspeed Technologies

Mindspeed Technologies' M82710-14 is a CMOS microprocessor circuit with 484 terminals in a grid array package. It operates b/w -25°C to 110°C, suitable for various applications requiring high-performance processing capabilities in compact form factors. The surface-mountable rectangular package makes it ideal for space-constrained designs.

R-PBGA-B484

484

110 Cel

-25 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

OTHER

BALL

BOTTOM

MICROPROCESSOR CIRCUIT

MTFC32GJVED-4MIT by Micron Technology

MTFC32GJVED-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: VFBGA; Package Shape: RECTANGULAR;

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B169

e1

18 mm

169

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

14 mm

MICROPROCESSOR CIRCUIT

MTFC4GMVEA-4MIT by Micron Technology

MTFC4GMVEA-4MIT

Micron Technology

MTFC4GMVEA-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.65V to 1.95V, making it ideal for INDUSTRIAL applications requiring high performance in a compact GRID ARRAY package style.

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B153

e1

13 mm

153

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

11.5 mm

MICROPROCESSOR CIRCUIT

MTFC64GJVDN-4MIT by Micron Technology

MTFC64GJVDN-4MIT

Micron Technology

MTFC64GJVDN-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.65V to 1.95V. This low profile, fine pitch GRID ARRAY package is ideal for industrial applications requiring high performance uPs and uCs.

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B169

e1

18 mm

169

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.4 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

14 mm

MICROPROCESSOR CIRCUIT

MTFC8GLVEA-4MIT by Micron Technology

MTFC8GLVEA-4MIT

Micron Technology

MTFC8GLVEA-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.65V to 1.95V. This IC has 153 terminals in a GRID ARRAY package suitable for industrial applications.

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B153

e1

13 mm

153

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

11.5 mm

MICROPROCESSOR CIRCUIT

MTFC16GJDDQ-4MIT by Micron Technology

MTFC16GJDDQ-4MIT

Micron Technology

MTFC16GJDDQ-4MIT by Micron Technology is a rectangular, surface mount microprocessor circuit with 100 terminals. It operates at a voltage range of 2.7V to 3.6V and can withstand temperatures from -40°C to 85°C. This industrial-grade IC is suitable for various applications requiring low-profile, high-performance computing.

R-PBGA-B100

e1

18 mm

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

260

1.4 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

14 mm

MICROPROCESSOR CIRCUIT

MTFC4GLDDQ-4MIT by Micron Technology

MTFC4GLDDQ-4MIT

Micron Technology

MTFC4GLDDQ-4MIT by Micron Technology is a CMOS MICROPROCESSOR CIRCUIT with 100 terminals in a GRID ARRAY, LOW PROFILE package. It operates b/w -40 to 85 °C with supply voltage range of 2.7V to 3.6V, making it ideal for industrial applications requiring high performance and reliability.

R-PBGA-B100

e1

18 mm

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

260

1.4 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

14 mm

MICROPROCESSOR CIRCUIT

MTFC8GLDDQ-4MIT by Micron Technology

MTFC8GLDDQ-4MIT

Micron Technology

MTFC8GLDDQ-4MIT by Micron Technology is a CMOS MICROPROCESSOR CIRCUIT with 100 terminals in a GRID ARRAY, LOW PROFILE package. It operates b/w -40 to 85 °C with supply voltage range of 2.7V to 3.6V, making it ideal for industrial applications requiring high performance and reliability.

R-PBGA-B100

e1

18 mm

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

260

1.4 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

14 mm

MICROPROCESSOR CIRCUIT

MTFC32GJDED-4MIT by Micron Technology

MTFC32GJDED-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: VFBGA; Package Shape: RECTANGULAR;

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B169

e1

18 mm

169

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

14 mm

MICROPROCESSOR CIRCUIT

MTFC64GJDDN-4MIT by Micron Technology

MTFC64GJDDN-4MIT

Micron Technology

MTFC64GJDDN-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.65V to 1.95V, making it ideal for industrial applications requiring low profile, fine pitch GRID ARRAY package style.

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B169

e1

18 mm

169

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.4 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

14 mm

MICROPROCESSOR CIRCUIT

MTFC8GLDEA-4MIT by Micron Technology

MTFC8GLDEA-4MIT

Micron Technology

MTFC8GLDEA-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.65V to 1.95V. The package style is GRID ARRAY, very thin profile, fine pitch, making it suitable for industrial applications requiring high performance in compact spaces.

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B153

e1

13 mm

153

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

11.5 mm

MICROPROCESSOR CIRCUIT

ADUCM350BBCZ by Analog Devices

ADUCM350BBCZ

Analog Devices

ADUCM350BBCZ by Analog Devices is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 2.5V to 3.6V, making it ideal for INDUSTRIAL applications requiring low profile, fine pitch GRID ARRAY package style.

S-PBGA-B120

e1

8 mm

3

120

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35 mm

3.6 V

2.5 V

3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

8 mm

MICROPROCESSOR CIRCUIT

80312 by Intel

80312

Intel

Intel 80312 is a CMOS microprocessor circuit with 540 terminals in a square grid array package. It operates at a nominal voltage of 3.3V and has a max seated height of 4.1mm. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B540

42.5 mm

540

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Not Qualified

4.1 mm

3.6 V

3 V

3.3 V

YES

CMOS

BALL

1.27 mm

BOTTOM

42.5 mm

MICROPROCESSOR CIRCUIT

TMS320DM368ZCEF by Texas Instruments

TMS320DM368ZCEF

Texas Instruments

TMS320DM368ZCEF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating b/w 0-85 °C. It supports I2C, SPI, UART, USB buses and has a terminal pitch of 0.65 mm. Ideal for applications requiring low profile, fine pitch package style in CMOS technology.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM368ZCE by Texas Instruments

TMS320DM368ZCE

Texas Instruments

TMS320DM368ZCE by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at temperatures from 0 to 85°C. It supports I2C, SPI, UART, and USB buses for various applications requiring low profile and fine pitch package style. The processor has a supply voltage range of 1.28-1.8V and features a grid array package with a terminal pitch of 0.65mm.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355ZCE270 by Texas Instruments

TMS320DM355ZCE270

Texas Instruments

TMS320DM355ZCE270 by Texas Instruments is a 32-bit microprocessor with 337 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.365V and RAM words of 32768, suitable for applications requiring high processing power in compact spaces like embedded systems and IoT devices.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CZUT7 by Texas Instruments

TMS320DM6467CZUT7

Texas Instruments

TMS320DM6467CZUT7 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 0-85°C, it has a supply voltage range of 1.14-3.3V and peak reflow temperature of 245°C. Ideal for applications requiring high processing power in compact designs.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CZUTAV by Texas Instruments

TMS320DM6467CZUTAV

Texas Instruments

TMS320DM6467CZUTAV by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at -40 to 105 °C. It has a package style of GRID ARRAY, FINE PITCH and terminal finish of TIN SILVER COPPER. Ideal for industrial applications requiring high processing power in compact form factor.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CZUTD7 by Texas Instruments

TMS320DM6467CZUTD7

Texas Instruments

TMS320DM6467CZUTD7 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at temperatures from -40 to 85 °C, it has a max supply voltage of 1.26 V and supports power supplies of 1.2, 1.8, and 3.3 V. Ideal for industrial applications requiring a high-performance microprocessor circuit in a compact square package style with grid array terminals.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CZUT by Texas Instruments

TMS320DM6467CZUT

Texas Instruments

TMS320DM6467CZUT by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.14-1.26V, it has a max temp of 85°C and package style of grid array, fine pitch. Ideal for applications requiring high processing power in compact designs.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM365ZCE21 by Texas Instruments

TMS320DM365ZCE21

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 338; Package Code: LFBGA; Package Shape: SQUARE;

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM365ZCE30 by Texas Instruments

TMS320DM365ZCE30

Texas Instruments

TMS320DM365ZCE30 by Texas Instruments is a 32-bit microprocessor circuit with a max supply voltage of 1.42V. It is used in industrial applications and supports I2C, SPI, UART, and USB bus compatibility.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.42 V

1.28 V

1.35 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM365ZCEF by Texas Instruments

TMS320DM365ZCEF

Texas Instruments

TMS320DM365ZCEF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from -40 to 85 °C and supports I2C, SPI, UART, and USB buses. This industrial-grade chip has a package style of grid array with low profile and fine pitch terminals.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMX320DM365BZCE by Texas Instruments

TMX320DM365BZCE

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 338; Package Code: LFBGA; Package Shape: SQUARE;

32

FIXED POINT

S-PBGA-B338

13 mm

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.2,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

NOT SPECIFIED

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TZUT1 by Texas Instruments

TMS320DM6467TZUT1

Texas Instruments

TMS320DM6467TZUT1 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at temperatures from 0 to 85 °C. It has a max supply voltage of 1.365 V and is suitable for MICROPROCESSOR CIRCUIT applications due to its CMOS technology and fine pitch package style.

ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TZUTD1 by Texas Instruments

TMS320DM6467TZUTD1

Texas Instruments

TMS320DM6467TZUTD1 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at temperatures from -40 to 85 °C, it has a max supply voltage of 1.365 V and is ideal for industrial applications requiring MICROPROCESSOR CIRCUIT technology.

ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6433ZDU4 by Texas Instruments

TMS320DM6433ZDU4

Texas Instruments

TMS320DM6433ZDU4 by Texas Instruments is a 32-bit microprocessor with 20480 RAM words. Operating at 1.14-1.26V, it supports I2C, SPI, UART buses and CMOS technology. Ideal for applications requiring MICROPROCESSOR CIRCUIT in a compact GRID ARRAY package measuring 23x23mm with 376 terminals.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; SPI; UART

FIXED POINT

S-PBGA-B376

e1

23 mm

3

376

85 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA376,22X22,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

1.2,1.8,3.3

Not Qualified

20480

2.48 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

LH7A400N0E000B3A by NXP Semiconductors

LH7A400N0E000B3A

NXP Semiconductors

NXP Semiconductors' LH7A400N0E000B3A is a ceramic package IC with 256 terminals, operating at temperatures from 0 to 70°C. It has power supplies of 1.8V and 3.3V, suitable for various applications requiring fine pitch grid array style packaging in commercial-grade environments.

S-XBGA-B256

256

70 Cel

0 Cel

CERAMIC

FBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, FINE PITCH

1.8,3.3

Not Qualified

Other uPs/uCs/Peripheral ICs

YES

COMMERCIAL

BALL

.8 mm

BOTTOM

LH7A404N0E000B0A by NXP Semiconductors

LH7A404N0E000B0A

NXP Semiconductors

Other uPs/uCs/Peripheral ICs; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE;

S-XBGA-B324

324

70 Cel

0 Cel

CERAMIC

FBGA

BGA324,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

1.8,3.3

Not Qualified

Other uPs/uCs/Peripheral ICs

YES

COMMERCIAL

BALL

.8 mm

BOTTOM

DM355SDZCE135 by Texas Instruments

DM355SDZCE135

Texas Instruments

The Texas Instruments DM355SDZCE135 is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. Ideal for applications requiring a low-profile, fine-pitch package style in CMOS technology.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SDZCE216 by Texas Instruments

DM355SDZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SDZCE270 by Texas Instruments

DM355SDZCE270

Texas Instruments

The Texas Instruments DM355SDZCE270 is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low profile, fine pitch package styles in surface mount configurations.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SDZCEA216 by Texas Instruments

DM355SDZCEA216

Texas Instruments

DM355SDZCEA216 by Texas Instruments is a 32-bit microprocessor circuit with a max supply voltage of 1.365V. It is used in industrial applications and supports I2C, SPI, UART, and USB bus compatibility.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355CZCE216 by Texas Instruments

TMS320DM355CZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355CZCEA21 by Texas Instruments

TMS320DM355CZCEA21

Texas Instruments

TMS320DM355CZCEA21 by Texas Instruments is a 32-bit microprocessor with 337 terminals, operating at -40 to 100 °C. It features a 1.3 V nominal voltage, I2C, SPI, UART, USB compatibility and is ideal for industrial applications requiring a MICROPROCESSOR CIRCUIT in a SQUARE package with PLASTIC/EPOXY body material.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355DZCE216 by Texas Instruments

TMS320DM355DZCE216

Texas Instruments

TMS320DM355DZCE216 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at 1.3V nominal voltage and supports I2C, SPI, UART, and USB buses. Ideal for applications requiring low profile, fine pitch package style in the temperature range of 0-85°C.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355DZCE270 by Texas Instruments

TMS320DM355DZCE270

Texas Instruments

TMS320DM355DZCE270 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85 °C and supports I2C, SPI, UART, and USB buses. This MICROPROCESSOR CIRCUIT has a package style of GRID ARRAY and is suitable for various applications requiring low profile and fine pitch components.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355DZCEA21 by Texas Instruments

TMS320DM355DZCEA21

Texas Instruments

TMS320DM355DZCEA21 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from -40 to 100°C and supports I2C, SPI, UART, and USB buses. This industrial-grade IC has a package style of grid array with low profile and fine pitch for various applications.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMX320DM355ZCE216 by Texas Instruments

TMX320DM355ZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

32

FIXED POINT

S-PBGA-B337

13 mm

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

NOT SPECIFIED

13 mm

MICROPROCESSOR CIRCUIT

TMX320DM355ZCE270 by Texas Instruments

TMX320DM355ZCE270

Texas Instruments

Texas Instruments TMX320DM355ZCE270 is a 32-bit microprocessor with 337 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.365V and RAM words of 32768, suitable for MICROPROCESSOR CIRCUIT applications in various industries.

32

FIXED POINT

S-PBGA-B337

13 mm

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

NOT SPECIFIED

13 mm

MICROPROCESSOR CIRCUIT

SM32DM355GCEM216EP by Texas Instruments

SM32DM355GCEM216EP

Texas Instruments

Texas Instruments SM32DM355GCEM216EP is a 32-bit microprocessor with 8192 RAM words. It operates b/w -55 to 125 °C and supports I2C, SPI, UART, USB buses. Ideal for military-grade applications due to its CMOS technology and low profile grid array package style.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e0

13 mm

3

337

125 Cel

-55 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

MILITARY

TIN LEAD

BALL

.65 mm

BOTTOM

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM6441AZWT by Texas Instruments

TMS320DM6441AZWT

Texas Instruments

TMS320DM6441AZWT by Texas Instruments is a 32-bit microprocessor with 16384 RAM words, operating at temperatures from 0 to 85°C. It features a package style of grid array, low profile, fine pitch and supports bus compatibility with Ethernet, I2C, SPI, UART, and USB. Ideal for applications requiring high-performance processing in compact spaces.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

16384

1.4 mm

Digital Signal Processors

1.1 V

1 V

1.05 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

XA7Z010-1CLG225Q by Xilinx

XA7Z010-1CLG225Q

Xilinx

XA7Z010-1CLG225Q by Xilinx is a MICROPROCESSOR CIRCUIT with 225 terminals in a GRID ARRAY package. Operating b/w -40 to 125 °C, it's AEC-Q100 compliant for AUTOMOTIVE use. Featuring CMOS technology, it has a 0.8 mm terminal pitch and TIN SILVER COPPER finish.

S-PBGA-B225

e1

13 mm

3

225

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1,1.8

Not Qualified

AEC-Q100

1.5 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

N

13 mm

MICROPROCESSOR CIRCUIT

XA7Z010-1CLG400I by Xilinx

XA7Z010-1CLG400I

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA400,20X20,32;

S-PBGA-B400

e1

17 mm

3

400

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

N

17 mm

MICROPROCESSOR CIRCUIT

XA7Z010-1CLG400Q by Xilinx

XA7Z010-1CLG400Q

Xilinx

XA7Z010-1CLG400Q by Xilinx is a MICROPROCESSOR CIRCUIT with 400 terminals in a GRID ARRAY package. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. The CMOS technology, low profile design, and fine pitch make it ideal for compact electronic systems.

S-PBGA-B400

e1

17 mm

3

400

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

N

17 mm

MICROPROCESSOR CIRCUIT

XA7Z020-1CLG400I by Xilinx

XA7Z020-1CLG400I

Xilinx

XA7Z020-1CLG400I by Xilinx is a MICROPROCESSOR CIRCUIT with 400 terminals in a GRID ARRAY package. It operates at 1-1.8V, CMOS technology, and has a terminal pitch of 0.8mm. Ideal for applications requiring low profile and fine pitch components in automotive electronics or industrial control systems.

S-PBGA-B400

e1

17 mm

3

400

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

N

17 mm

MICROPROCESSOR CIRCUIT