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TMS320DM365ZCEF

Texas Instruments

TMS320DM365ZCEF by Texas Instruments

TMS320DM365ZCEF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from -40 to 85 °C and supports I2C, SPI, UART, and USB buses. This industrial-grade chip has a package style of grid array with low profile and fine pitch terminals.

Median Price

$23.306

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 213 parts In-Stock

1+ parts

$23.306

100+ parts

$20.717

1k+ parts

$15.233

10k+ parts

-

213

$23.306

$20.717

$15.233

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$18.880

100+ parts

-

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50

$18.880

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Digiode

USA . 1,939 parts In-Stock

1+ parts

$22.141

100+ parts

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1,939

$22.141

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Vyrian

USA . 5,136 parts In-Stock

1+ parts

-

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5,136

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Demsay Elektronik

Türkiye . 1,100 parts In-Stock

1+ parts

-

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1,100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 698 parts In-Stock

1+ parts

$16.649

100+ parts

-

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698

$16.649

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Ampacity Inc.

Singapore . 156 parts In-Stock

1+ parts

$19.810

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-

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156

$19.810

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Corohmni

South Africa . 928 parts In-Stock

1+ parts

$20.960

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928

$20.960

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Corphita

USA . 1,165 parts In-Stock

1+ parts

$20.975

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-

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1,165

$20.975

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Microchip USA

USA . 1,970 parts In-Stock

1+ parts

$55.917

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1,970

$55.917

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Parana Technologies

USA . 2,339 parts In-Stock

1+ parts

$56.912

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2,339

$56.912

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DigiPath Technology Company

USA . 787 parts In-Stock

1+ parts

$62.667

100+ parts

$57.654

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787

$62.667

$57.654

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ChromeModa Solutions

Germany . 2,563 parts In-Stock

1+ parts

$63.946

100+ parts

$52.436

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2,563

$63.946

$52.436

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IDEA Electronic Components Group

UK . 1,103 parts In-Stock

1+ parts

$63.946

100+ parts

$60.749

1k+ parts

$57.551

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1,103

$63.946

$60.749

$57.551

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Lixinc

USA . 9,039 parts In-Stock

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9,039

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A-Z Elektronik GmbH

Germany . 6,873 parts In-Stock

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6,873

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Overview

Unlock endless possibilities with the Texas Instruments TMS320DM365ZCEF! As a leader in the industry, Texas Instruments delivers top-quality products, and this microprocessor circuit is no exception. Designed for a range of applications, this device provides unparalleled value and benefits to customers. With its advanced technology and versatile compatibility, the TMS320DM365ZCEF offers reliability and performance that will take your projects to the next level. Experience seamless operation and efficiency with this exceptional product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, ideal for portable devices.

Surface Mount: YES

With surface mount capability, this product can be easily integrated into compact and space-saving designs.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26V ensures efficient power usage and helps prevent overheating in the system.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, optimizing layout and design.

Bit Size: 32

A 32-bit architecture provides high processing power and performance for advanced applications and tasks.

Power Supplies: 1.2, 1.8, 3.3 V

Compatibility with multiple power supply voltages allows for flexibility in system design and integration.

No. of Terminals: 338

The high number of terminals enables connectivity with multiple devices and peripherals, enhancing functionality.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density integration and reliability in demanding environments.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14V ensures stable operation and efficient power consumption.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments and maintain performance.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C allows for reliable operation in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure soldering during installation, improving overall system stability.

Maximum Seated Height: 1.3 mm

The low maximum seated height of 1.3mm enables slim and compact device designs without compromising performance.

RAM Words: 8192

With 8192 RAM words, this product offers ample memory capacity for storing and processing data efficiently.

Width: 13 mm

The 13mm width allows for space-efficient placement on the PCB, reducing footprint and enabling compact designs.

External Data Bus Width: 32

A 32-bit external data bus width facilitates high-speed data transfer and processing capabilities.

Maximum Time At Peak Reflow Temperature: 30 s

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during assembly.

Peak Reflow Temperature: 260 C

The peak reflow temperature of 260°C enables secure solder joints and prevents component damage during reflow processes.

Length: 13 mm

The 13mm length complements the width dimension for a balanced and space-efficient package design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes this product suitable for rugged and harsh operating environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The integration of a microprocessor circuit as a peripheral IC type provides advanced processing capabilities for diverse applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, enhancing overall performance efficiency.

Terminal Form: BALL

The ball terminal form provides reliable connections and easy installation, ensuring secure operation in demanding conditions.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V ensures compatibility with standard power sources and efficient power management.

Bus Compatibility: I2C; SPI; UART; USB

Compatibility with multiple bus interfaces such as I2C, SPI, UART, and USB enables seamless communication with various devices and peripherals.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65mm allows for precise and secure connection points, enhancing overall system reliability.

Format: FIXED POINT

Fixed-point format provides accurate and efficient data processing capabilities for numerical calculations and algorithms.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product can withstand moderate moisture exposure during assembly and operation, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM365ZCEF attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA338,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM365ZCEF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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