Loading...

DM355SDZCE270

Texas Instruments

DM355SDZCE270 by Texas Instruments

The Texas Instruments DM355SDZCE270 is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low profile, fine pitch package styles in surface mount configurations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,798 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,798

-

-

-

-

Digiode

USA . 2,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,585

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 136 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

-

136

$6.000

-

-

-

AZTECH Wire

Italy . 528 parts In-Stock

1+ parts

$9.896

100+ parts

-

1k+ parts

-

10k+ parts

-

528

$9.896

-

-

-

Native Components

USA . 229 parts In-Stock

1+ parts

$17.985

100+ parts

-

1k+ parts

-

10k+ parts

-

229

$17.985

-

-

-

Northwest PG Solutions

USA . 1,075 parts In-Stock

1+ parts

$19.783

100+ parts

$17.805

1k+ parts

-

10k+ parts

-

1,075

$19.783

$17.805

-

-

Corohmni

South Africa . 217 parts In-Stock

1+ parts

$27.371

100+ parts

-

1k+ parts

-

10k+ parts

-

217

$27.371

-

-

-

Parana Technologies

USA . 274 parts In-Stock

1+ parts

$57.721

100+ parts

-

1k+ parts

-

10k+ parts

-

274

$57.721

-

-

-

DigiPath Technology Company

USA . 1,306 parts In-Stock

1+ parts

$63.558

100+ parts

$58.473

1k+ parts

-

10k+ parts

-

1,306

$63.558

$58.473

-

-

ChromeModa Solutions

Germany . 5,875 parts In-Stock

1+ parts

$64.855

100+ parts

$53.181

1k+ parts

-

10k+ parts

-

5,875

$64.855

$53.181

-

-

IDEA Electronic Components Group

UK . 2,112 parts In-Stock

1+ parts

$64.855

100+ parts

$61.612

1k+ parts

$58.370

10k+ parts

-

2,112

$64.855

$61.612

$58.370

-

Corphita

USA . 2,256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,256

-

-

-

-

Microchip USA

USA . 389 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

389

-

-

-

-

Overview

Elevate your electronic designs with the DM355SDZCE270 by Texas Instruments. Crafted with precision and expertise, this versatile microprocessor circuit offers unrivaled performance and reliability. Whether you're working on industrial automation or consumer electronics, this cutting-edge device delivers exceptional value and efficiency. Say goodbye to limitations and embrace endless possibilities with Texas Instruments at the helm. Experience innovation like never before with the DM355SDZCE270.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, making it suitable for various environmental conditions.

Surface Mount: YES

Allows for easy and secure mounting on a PCB, saving space and improving overall circuit board design.

Maximum Supply Voltage: 1.365 V

Ensures stable and safe operation within specified voltage limits.

Bit Size: 32

Offers high processing capability and efficiency for handling complex tasks and calculations.

Power Supplies (V): 1.3, 1.8, 3.3

Provides flexibility in power requirements, allowing compatibility with various voltage sources.

No. of Terminals: 337

Offers ample connectivity options for integrating the product into different electronic systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables efficient heat dissipation, compact design, and high-density mounting on PCBs.

Minimum Supply Voltage: 1.235 V

Ensures reliable operation even at lower voltage levels, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for use in a wide range of operating environments without risk of overheating.

Minimum Operating Temperature: 0 °C

Capable of functioning in low-temperature conditions, making it versatile for various applications.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for long-lasting performance.

RAM Words: 8192

Sufficient memory capacity for storing and processing data efficiently in real-time operations.

Width: 13 mm

Compact size for easy integration into space-constrained electronic devices.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow soldering processes for reliable solder joints.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Enables advanced processing capabilities and communication functions, enhancing the overall performance of the product.

Technology: CMOS

Offers low power consumption and high noise immunity, improving energy efficiency and reliability.

Terminal Form: BALL

Facilitates easy soldering and connection to other components, simplifying manufacturing and assembly processes.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate exposure to moisture during storage and operation, ensuring product reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DM355SDZCE270 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

337

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

DM355SDZCE270 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 9